公开(公告)号：US08828543B2

公开(公告)日：2014-09-09

申请号：US11966040

申请日：2007-12-28

申请人： Tae Sub Bae ,  Jin Gyu Park ,  Jung Bae Jun ,  Jae Ho Lee ,  Jung Il Park ,  Sang Woon Lee

发明人： Tae Sub Bae ,  Jin Gyu Park ,  Jung Bae Jun ,  Jae Ho Lee ,  Jung Il Park ,  Sang Woon Lee

IPC分类号： B32B5/16 ,  B05D3/04 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/25 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

摘要翻译： 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 进一步公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本上连续的密度梯度，并且可以包括镍（Ni）和 金（Au）。

公开(公告)号：US08821764B2

公开(公告)日：2014-09-02

申请号：US13403316

申请日：2012-02-23

申请人： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

发明人： Min-Sok Jang ,  Kyung-Hwan Ko ,  Seung-Il Lee ,  Jin-Wook Moon ,  Jeong-Geun Han

IPC分类号： H01B1/02 ,  H01B1/12 ,  B05D5/12 ,  H05K3/32 ,  B22F1/02

CPC分类号： H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

摘要： In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

摘要翻译： 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US08455895B2

公开(公告)日：2013-06-04

申请号：US12941799

申请日：2010-11-08

申请人： Yan Chai ,  Calvin B. Ward

发明人： Yan Chai ,  Calvin B. Ward

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/111 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light source and method for making the same are disclosed. The light source includes a plurality of surface mount LEDs that are bonded to a mounting substrate by a layer of asymmetric conductor. Each LED has surface mount contacts on a first surface thereof and emits light from a second surface thereof that is opposite the first surface. The mounting substrate includes a top surface having a plurality of connection traces. Each connection trace includes an n-trace positioned to underlie a corresponding one of the n-contacts and a p-trace positioned to underlie a corresponding one of the p-contacts, the p-trace having an area greater than the p-contact. The layer of asymmetric conductor is sandwiched between the surface mount contacts and the connection traces, and can optionally extend into the spaces between the LEDs to provide a scattering medium for redirecting light leaving the sides of the LEDs.

摘要翻译： 公开了一种光源及其制造方法。 光源包括通过不对称导体层结合到安装基板的多个表面贴装LED。 每个LED在其第一表面上具有表面安装触点，并且从与第一表面相对的第二表面发射光。 安装基板包括具有多个连接迹线的顶表面。 每个连接迹线包括定位成位于n个触点中的相应一个的下方的n迹线和位于相应一个p触点下方的p迹线，p迹线具有大于p触点的面积。 不对称导体层被夹在表面安装触点和连接迹线之间，并且可以可选地延伸到LED之间的空间中，以提供用于重定向离开LED侧面的光的散射介质。

公开(公告)号：US08273207B2

公开(公告)日：2012-09-25

申请号：US12631210

申请日：2009-12-04

申请人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

发明人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

IPC分类号： B29C65/00 ,  B31B1/60 ,  B32B37/00 ,  B32B7/12 ,  B32B9/04 ,  A61F13/15 ,  B41J2/16

CPC分类号： H05K3/323 ,  C08K7/00 ,  C09J9/02 ,  C09J11/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0233 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

摘要翻译： 一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性 导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间 和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于 绝缘颗粒。

公开(公告)号：US20110100683A1

公开(公告)日：2011-05-05

申请号：US12994880

申请日：2009-06-03

申请人： Rabin Bhattacharya ,  Liesbeth Van Pieterson ,  Koen Van Os ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

发明人： Rabin Bhattacharya ,  Liesbeth Van Pieterson ,  Koen Van Os ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

IPC分类号： H05K1/00 ,  H01R43/00 ,  D02G3/36

CPC分类号： H05K1/038 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/0233 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10393 ,  Y10T29/49117 ,  Y10T442/2008 ,  Y10T442/2041 ,  Y10T442/2098 ,  Y10T442/2107 ,  Y10T442/2123 ,  Y10T442/2738

摘要： The invention relates to an electronic textile comprising a textile substrate having a substrate electrode, and an electronic component having a component electrode. The component electrode is in electrically conductive contact with the substrate electrode via a coupling layer having a directionally dependent conductance so as to preferentially allow an electrical current to flow between the substrate electrode and the component electrode. As the coupling layer does not have to be patterned to prevent the occurrence of parasitic electrical currents, the electrically conductive contact between the substrate electrode and the component electrode has an improved reliability.

摘要翻译： 本发明涉及一种电子织物，其包括具有基底电极的织物基底和具有部件电极的电子部件。 部件电极通过具有方向依赖电导的耦合层与衬底电极导电接触，以便优先地允许电流在衬底电极和部件电极之间流动。 由于耦合层不必被图案化以防止寄生电流的发生，所以基板电极和部件电极之间的导电接触具有改进的可靠性。

公开(公告)号：US07550846B2

公开(公告)日：2009-06-23

申请号：US11315138

申请日：2005-12-21

申请人： John C. Knights

发明人： John C. Knights

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/11332 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2924/09701 ,  H05K3/125 ,  H05K3/245 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/013

摘要： A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.

摘要翻译： 形成接触结构和接触结构的方法。 接触结构包括接触位置和基本上设置在接触位置上的接触元件，至少一个这样的接触元件包括可变形的中心和覆盖可变形中心的至少一部分的导电层。

公开(公告)号：US07507604B2

公开(公告)日：2009-03-24

申请号：US12044239

申请日：2008-03-07

申请人： Daoqiang Lu ,  Henning Braunisch

发明人： Daoqiang Lu ,  Henning Braunisch

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构， 各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

公开(公告)号：US07413686B2

公开(公告)日：2008-08-19

申请号：US10509204

申请日：2003-03-25

申请人： Yukio Yamada

发明人： Yukio Yamada

IPC分类号： H01B1/00 ,  B32B5/16

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/3512

摘要： A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.

摘要翻译： 导电颗粒可用于连接各种被粘物。 导电性粒子包括树脂粒子，设置在树脂粒子周围的第一导电粒子，设置在树脂粒子周围的第一树脂被膜。 第一树脂涂层比树脂颗粒软。 在其周围设置第二导电薄膜。 当待连接的被粘物的电极的表面部分是硬的时，导电颗粒和第二导电薄膜的第一树脂涂层被压力破坏，以使第二导电薄膜与电极接触，并且 金属布线。 如果电极的表面部分是软的，则表面侧的第二导电薄膜与电极接触，这使得可以使用粒子，而不管被粘物的表面状态如何。

公开(公告)号：US20070252112A1

公开(公告)日：2007-11-01

申请号：US11763521

申请日：2007-06-15

申请人： Jung JUN ,  Jin PARK ,  Jae LEE ,  Tae BAE

发明人： Jung JUN ,  Jin PARK ,  Jae LEE ,  Tae BAE

IPC分类号： H01B1/12

CPC分类号： H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

摘要翻译： 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：US20060263581A1

公开(公告)日：2006-11-23

申请号：US11429390

申请日：2006-05-05

申请人： Jin Park ,  Jung Jun ,  Tae Bae ,  Jae Lee

发明人： Jin Park ,  Jung Jun ,  Tae Bae ,  Jae Lee

IPC分类号： B32B7/02 ,  B32B5/16 ,  H01B1/00

CPC分类号： H01B1/22 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/24942 ,  Y10T428/25

摘要： The insulated conductive particles of the present invention comprise a resin core 41 having an average particle size of 1 to 10 μm, a Ni layer 42 coated on the surface of the resin core with a thickness of 0.01-0.1 μm, an Au layer 43 coated on the Ni layer with a thickness of 0.03-0.3 μm, and an inorganic insulating layer 44 coated on the Au layer with a thickness of 0.05-1 μm. An anisotropic conductive film of the present invention comprises the insulated conductive particles in the number of 10,000-80,000 per square millimeter (mm2).

摘要翻译： 本发明的绝缘导电性粒子包括平均粒径为1〜10μm的树脂芯41，涂覆在树脂芯的表面上的厚度为0.01〜0.1μm的Ni层42，涂覆有Au层43 在厚度为0.03-0.3μm的Ni层上，以及涂覆在Au层上的厚度为0.05-1μm的无机绝缘层44。 本发明的各向异性导电膜包括10000-80,000 /平方毫米（mm 2）的绝缘导电颗粒。