公开(公告)号：US5357403A

公开(公告)日：1994-10-18

申请号：US545793

申请日：1990-06-29

申请人： Theodore R. Haller ,  Robert J. Wojnarowski

发明人： Theodore R. Haller ,  Robert J. Wojnarowski

IPC分类号： H01L23/12 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46 ,  H05K1/11

CPC分类号： H01L23/5383 ,  H01L23/538 ,  H01L23/5389 ,  H01L2924/0002

摘要： Mispositioning of chips in a high density interconnect structure is compensated for by including a layer having alignment conductor in the high density interconnect structure without requiring adaptation of the signal conductor metallization levels of the high density interconnect structure. One level, two levels or more of alignment conductor may be employed. The alignment levels of the high density interconnect structure are preferably a ground plane, and if two layers of alignment conductors are provided, a power plane.

摘要翻译： 通过在高密度互连结构中包括具有对准导体的层，而不需要适应高密度互连结构的信号导体金属化水平来补偿高密度互连结构中的芯片的位置偏移。 可以采用一级，两级或更多的对准导体。 高密度互连结构的取向水平优选为接地面，如果设置两层取向导体，则具有电源面。

公开(公告)号：US5169678A

公开(公告)日：1992-12-08

申请号：US456421

申请日：1989-12-26

申请人： Herbert S. Cole ,  Robert J. Wojnarowski

发明人： Herbert S. Cole ,  Robert J. Wojnarowski

IPC分类号： C08K5/00 ,  B23K26/00 ,  B23K26/18 ,  B23K26/40 ,  C08J7/00 ,  C08J7/04 ,  C08K5/22 ,  C08L101/00 ,  C09D201/00 ,  G03F7/039 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  H01L21/311 ,  H01L23/12 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18

CPC分类号： G03F7/039 ,  G03F7/2053 ,  H01L21/31127 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10S430/146

摘要： The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified material is substantially non-laser ablatable.

公开(公告)号：US06604971B1

公开(公告)日：2003-08-12

申请号：US09562774

申请日：2000-05-02

申请人： Xiao-Dong Sun ,  Robert J. Wojnarowski ,  Raul E. Ayala ,  Thomas F. McNulty

发明人： Xiao-Dong Sun ,  Robert J. Wojnarowski ,  Raul E. Ayala ,  Thomas F. McNulty

IPC分类号： H01J900

CPC分类号： H01L33/50 ,  H01L2933/0041

摘要： A method of manufacturing an LED lamp includes dispersing color correction particles throughout a suspension media to a viscosity of substantially 2000 cP. In the case of correcting blue GaN LEDs to white light, the particles to be blended are phosphorus having a diameter of less than 20 microns. An LED die is mounted onto a stage and a nano-liter pipette is arranged such that an interface separation of approximately 1 millimeter is achieved between the tip of the pipette and the surface of the LED die. Once the relatively viscous suspension media covers the LED die, ultraviolet light is directed towards the suspension media to cure it. Heat is then applied to further cure the suspension media until solid as observed under a microscope.

摘要翻译： 制造LED灯的方法包括将颜色校正颗粒分散在悬浮介质中至基本上为2000cP的粘度。 在将蓝色GaN LED校正为白光的情况下，要混合的颗粒是直径小于20微米的磷。 将LED管芯安装在平台上，并且配置纳米移液器，使得在移液管的尖端和LED管芯的表面之间实现大约1毫米的界面分离。 一旦相对粘稠的悬浮介质覆盖LED管芯，紫外线就被引向悬浮介质以使其固化。 然后施加热量以进一步固化悬浮介质，直到在显微镜下观察到的固体。

公开(公告)号：US06407411B1

公开(公告)日：2002-06-18

申请号：US09548440

申请日：2000-04-13

申请人： Robert J. Wojnarowski ,  Richard J. Uriarte ,  Ferenc Horkay ,  Pamela K. Benicewicz ,  William P. Minnear

发明人： Robert J. Wojnarowski ,  Richard J. Uriarte ,  Ferenc Horkay ,  Pamela K. Benicewicz ,  William P. Minnear

IPC分类号： H01L3300

CPC分类号： H01L33/641 ,  H01L23/36 ,  H01L23/49558 ,  H01L23/60 ,  H01L33/54 ,  H01L33/56 ,  H01L33/647 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401

摘要： An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone.

摘要翻译： 改进的LED引线框架封装组件包括导热的电绝缘材料，其增强了组件的热传导和结构完整性，抗UV封装材料以及降低静电放电的整体ESD材料。 导热电绝缘材料在引线框架组件中产生电绝缘的导热路径，用于耗散功率，并且还用作安装结构，从而允许使用软密封剂材料，优选硅树脂。

公开(公告)号：US5527741A

公开(公告)日：1996-06-18

申请号：US321346

申请日：1994-10-11

申请人： Herbert S. Cole ,  Raymond A. Fillion ,  Bernard Gorowitz ,  Ronald F. Kolc ,  Robert J. Wojnarowski

发明人： Herbert S. Cole ,  Raymond A. Fillion ,  Bernard Gorowitz ,  Ronald F. Kolc ,  Robert J. Wojnarowski

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/538 ,  H05K3/32

CPC分类号： H05K3/32 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  Y10T29/4913

摘要： A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.

摘要翻译： 一种用于制造电路模块的方法包括在绝缘层的第一表面上的第一图案化金属化层上施加外部绝缘层。 基极绝缘层的第二表面具有第二图案化金属化层。 具有芯片焊盘的至少一个电路芯片附接到基极绝缘层的第二表面。 形成各个通孔以暴露第一图案化金属化层，第二图案化金属化层和芯片焊盘的选定部分。 图案化的外部金属化层被施加在外部绝缘层上以延伸通过选定的通孔以互连所选择的芯片焊盘和第一和第二金属化层的选定部分。

公开(公告)号：US5525190A

公开(公告)日：1996-06-11

申请号：US408231

申请日：1995-03-22

申请人： Robert J. Wojnarowski ,  Herbert S. Cole ,  John L. Henkes

发明人： Robert J. Wojnarowski ,  Herbert S. Cole ,  John L. Henkes

IPC分类号： B29D11/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/36 ,  G02B6/42 ,  G02B6/43 ,  B44C1/22 ,  B29C37/00 ,  C23F1/02

CPC分类号： B29D11/00701 ,  G02B6/1221 ,  G02B6/13 ,  G02B6/421 ,  G02B6/43 ,  G02B2006/12173 ,  G02B2006/12176

摘要： HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

摘要翻译： 采用HDI制造技术在聚合物材料中形成各种光波导结构。 考虑到可能偏离理想的装置的实际位置和取向，形成自适应光学连接。 结构包括固体导光结构，也适于导电冷却流体的中空导光结构，以及采用液晶材料的光学开关器件。 可以使用“缩回”方法在聚合物材料中形成隧道，然后填充固化时收缩的未固化的聚合物材料。

公开(公告)号：US5336928A

公开(公告)日：1994-08-09

申请号：US947190

申请日：1992-09-18

申请人： Constantine A. Neugebauer, deceased ,  Robert J. Wojnarowski

发明人： Constantine A. Neugebauer, deceased ,  Robert J. Wojnarowski

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H05K3/28 ,  H01L23/48

CPC分类号： H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787

摘要： A hermetically sealed electronic package particularly adapted for high density interconnect (HDI) electronic systems, employs a ceramic substrate as the package base. The substrate is provided with module contact pads. A barrier support frame on the module contact pads divides them into inner and outer portions. A plurality of electronic components, such as integrated circuit chips, are fastened to the substrate within the perimeter of the barrier support frame, and interconnections are provided between inner portions of the module contact pads and contact pads on the electronic components. A polymer barrier layer is deposited over the area enclosed by the barrier support frame as well as a portion of the frame itself, and is overlaid with a metal barrier layer. A protective solder layer is deposited on the metal barrier layer to bridge any voids in the metal barrier layer.

摘要翻译： 特别适用于高密度互连（HDI）电子系统的气密密封电子封装采用陶瓷衬底作为封装基座。 基板设有模块接触垫。 模块接触垫上的障碍支撑框架将它们分成内部和外部。 诸如集成电路芯片的多个电子部件在屏障支撑框架的周边内紧固到基板，并且在模块接触焊盘的内部部分和电子部件上的接触焊盘之间提供互连。 聚合物阻挡层沉积在由阻挡支撑框架包围的区域以及框架本身的一部分上，并且覆盖有金属阻挡层。 在金属阻挡层上沉积保护性焊料层以桥接金属阻挡层中的任何空隙。

公开(公告)号：US5324687A

公开(公告)日：1994-06-28

申请号：US962379

申请日：1992-10-16

申请人： Robert J. Wojnarowski

发明人： Robert J. Wojnarowski

IPC分类号： H01L21/68 ,  H01L21/98 ,  H01L23/538 ,  H01L25/065 ,  H01L21/302 ,  H01L21/463

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/18162 ,  Y10S438/977

摘要： A method of thinning dice or integrated circuit chips used in producing lightweight packaged electronic systems, such as HDI circuits and systems produced therefrom provides for positioning dice in a die carrier layer that allows for easy separation from the dice after completion of the die thinning step. A holding layer is then attached to the die carrier layer for ease of attaching it to a material removal device, such as a lapping machine or an ultrasonic milling machine. A portion of the die carrier layer, along its exposed side, is then removed by the material removal device as a consequence of removal, by the material removal device, of an expendable portion of the dice positioned within the die carrier layer. The holding layer and the die carrier layer are then separated from the thinned dice by a conventional method, such as chemical etching, solvent soaking or induction heating. The thinned dice are significantly lighter than their original weight and their uniform thickness makes them well suited for mass produced lightweight electronic systems and flexible assemblies, such as HDI circuits.

摘要翻译： 用于制造轻质封装电子系统（例如HDI电路和由此产生的系统）的骰子或集成电路芯片的稀化方法提供了在模具载体层中定位骰子，其允许在模具变薄步骤完成之后容易地与骰子分离。 然后将保持层附接到模具载体层，以便于将其附着到诸如研磨机或超声波铣床的材料去除装置。 因此，通过材料去除装置去除位于模具载体层内的骰子的消耗部分，结果，模具载体层沿其暴露侧的一部分被材料去除装置移除。 然后通过常规方法（例如化学蚀刻，溶剂浸泡或感应加热）将保持层和模具载体层与薄的骰子分离。 薄的骰子比原来的重量明显更轻，它们的均匀厚度使得它们非常适合于大量生产的轻质电子系统和诸如HDI电路的柔性组件。

公开(公告)号：US06747406B1

公开(公告)日：2004-06-08

申请号：US09633527

申请日：2000-08-07

申请人： Jacob C. Bortscheller ,  Robert J. Wojnarowski

发明人： Jacob C. Bortscheller ,  Robert J. Wojnarowski

IPC分类号： H01J6304

CPC分类号： H01L33/508 ,  H01L2224/48463 ,  H01L2224/8592 ,  H01S5/028

摘要： A light source (10) includes a light emitting component (32), such as a UV/blue light emitting diode or laser diode coated with a layer (60) of a phosphor material (64). The phosphor material converts a portion of the light emitted by the light emitting component to light of a longer wavelength, such as yellow light. The thickness d of the layer varies across the light emitting component in relation to the intensity of light emitted by the light emitting component. This maintains a uniform color of the emission from the light source while minimizing the loss in light intensity (brightness) due to the presence of the phosphor.

摘要翻译： 光源（10）包括诸如UV /蓝色发光二极管的发光部件（32）或涂覆有磷光体材料（64）的层（60）的激光二极管。 荧光体材料将由发光部件发射的光的一部分转换为较长波长的光，例如黄色光。 该层的厚度d相对于由发光部件发出的光的强度而在发光部件上变化。 这保持了来自光源的发射的均匀颜色，同时由于荧光体的存在而使光强度（亮度）的损失最小化。

公开(公告)号：US5576517A

公开(公告)日：1996-11-19

申请号：US411176

申请日：1995-03-27

申请人： Robert J. Wojnarowski ,  Herbert S. Cole ,  Theresa A. Sitnik-Nieters ,  Wolfgang Daum

发明人： Robert J. Wojnarowski ,  Herbert S. Cole ,  Theresa A. Sitnik-Nieters ,  Wolfgang Daum

IPC分类号： B32B7/02 ,  B32B18/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  H05K1/18

CPC分类号： H05K1/0313 ,  H01L21/481 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H05K1/024 ,  H05K1/0373 ,  H05K3/0032 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/3011 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/083 ,  H05K2203/122 ,  H05K3/386 ,  Y10S521/918 ,  Y10T29/49124 ,  Y10T29/49155

摘要： An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.

摘要翻译： 电子结构包括具有芯片焊盘并由衬底支撑的电路芯片，以及具有孔并位于衬底和电路芯片上的低介电常数多孔聚合物层。 多孔聚合物层具有与至少一个芯片焊盘对准的至少一个通孔，并且电导体图案在多孔聚合物层的一部分上延伸到至少一个通孔中。 电导体的图案不会显着地突出到多孔聚合物层的孔中。