公开(公告)号：US20190326213A1

公开(公告)日：2019-10-24

申请号：US16464972

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: H01L23/522 ,  H01G4/33 ,  H01G4/38 ,  H01L23/488 ,  H01L23/50 ,  H01L23/64 ,  H05K1/16 ,  H01L49/02 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：US20190288371A1

公开(公告)日：2019-09-19

申请号：US16345173

申请日：2016-12-20

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190187798A1

公开(公告)日：2019-06-20

申请号：US16326902

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV ,  Johanna M. SWAN

IPC: G06F3/01 ,  G06F1/16

CPC classification number: G06F3/016 ,  G06F1/16 ,  G06F1/163

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

公开(公告)号：US20180332151A1

公开(公告)日：2018-11-15

申请号：US15777093

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H04M1/02 ,  H01Q1/38 ,  H01Q21/22 ,  H01Q1/24

CPC classification number: H04M1/0277 ,  G06F1/1613 ,  G06F1/1698 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/405 ,  H01Q3/26 ,  H01Q9/0414 ,  H01Q21/0093 ,  H01Q21/22 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q25/00

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180323159A1

公开(公告)日：2018-11-08

申请号：US15773152

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/18 ,  H01Q1/38

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/16 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180234128A1

公开(公告)日：2018-08-16

申请号：US15745980

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Brandon M. RAWLINGS ,  Georgios C. DOGIAMIS

IPC: H04B1/40 ,  H01L25/00 ,  H04B1/00 ,  H01L23/00

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

公开(公告)号：US20180217949A1

公开(公告)日：2018-08-02

申请号：US15746318

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Brandon M. RAWLINGS

IPC: G06F13/14 ,  H04M9/06 ,  G06F3/14

Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

公开(公告)号：US20180097284A1

公开(公告)日：2018-04-05

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H01L41/187 ,  H01L41/04 ,  H01Q5/50 ,  H04L29/06

CPC classification number: H01Q1/526 ,  H01L41/047 ,  H01L41/094 ,  H01Q1/273 ,  H01Q15/0086 ,  H04L63/0245 ,  H04L63/1475 ,  H04L67/12 ,  H04L67/146 ,  H04W12/0052 ,  H04W12/12

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US20180003749A1

公开(公告)日：2018-01-04

申请号：US15201144

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Ian A. YOUNG

IPC: G01R23/02

CPC classification number: G01R23/02 ,  G01D5/00 ,  G01D18/006 ,  G01P15/097 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.

公开(公告)号：US20170288724A1

公开(公告)日：2017-10-05

申请号：US15088996

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: H04B1/48 ,  H03H9/05 ,  H03H9/54 ,  H01H57/00

CPC classification number: H04B1/48 ,  H01H57/00 ,  H01H2057/006 ,  H03H7/38 ,  H03H2015/005

Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.