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公开(公告)号：US09209348B2
公开(公告)日：2015-12-08
申请号：US14681715
申请日：2015-04-08
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Kevin K. C. Chang , Andreas Bibl
CPC classification number: H01L33/62 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L27/156 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/04 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/60 , H01L2224/83005 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 稳定层包括稳定腔阵列和稳定柱阵列。 每个稳定腔包括围绕稳定柱的侧壁。 微型设备阵列位于稳定柱阵列上。 微器件阵列中的每个微器件包括比直接在底表面下方的相应的稳定位置更宽的底表面。
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公开(公告)号：US20150318328A1
公开(公告)日：2015-11-05
申请号：US14798298
申请日：2015-07-13
Applicant: LuxVue Technology Corporation
Inventor： Andreas Bibl , Kapil V. Sakariya , Charles R. Griggs , James Michael Perkins
CPC classification number: H01L51/50 , G09G3/006 , G09G3/3208 , H01L21/6835 , H01L24/24 , H01L24/32 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/97 , H01L27/1214 , H01L27/156 , H01L2221/68368 , H01L2221/68381 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/24137 , H01L2224/24227 , H01L2224/245 , H01L2224/29005 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32014 , H01L2224/32057 , H01L2224/32237 , H01L2224/32503 , H01L2224/75252 , H01L2224/75301 , H01L2224/7565 , H01L2224/75725 , H01L2224/759 , H01L2224/7598 , H01L2224/82101 , H01L2224/82102 , H01L2224/82104 , H01L2224/83 , H01L2224/83005 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83805 , H01L2224/8381 , H01L2224/83825 , H01L2224/8383 , H01L2224/97 , H01L2924/0781 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012 , H01L2924/053 , H01L2924/0549 , H01L2924/0543 , H01L2924/0544 , H01L2924/0103 , H01L2924/01013 , H01L2924/01042 , H01L2924/01022 , H01L2924/01074 , H01L2924/01047 , H01L2924/01079 , H01L2924/00
Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
Abstract translation: 描述了显示面板和制造方法。 在一个实施例中，显示基板包括像素区域和非像素区域。 子像素阵列和相应的底电极阵列位于像素区域中。 微型LED器件的阵列结合到底部电极阵列。 形成与微型LED器件的阵列电接触的一个或多个顶部电极层。 在一个实施例中，冗余的一对微型LED器件被结合到底部电极阵列。 在一个实施例中，微型LED器件的阵列被成像以检测不规则。
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公开(公告)号：US20150263066A1
公开(公告)日：2015-09-17
申请号：US14210295
申请日：2014-03-13
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Andreas Bibl
CPC classification number: H01L27/153 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L29/0669 , H01L29/0676 , H01L33/0079 , H01L33/0095 , H01L33/08 , H01L33/16 , H01L33/18 , H01L33/24
Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.
Abstract translation: 描述了纳米线器件和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件包括基底层和在基底层的第一表面上并远离基底层的多个纳米线。 封装材料横向围绕纳米线装置中的多个纳米线，使得纳米线嵌入封装材料内。
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84.发明授权公开(公告)号：US09105714B2
公开(公告)日：2015-08-11
申请号：US13754739
申请日：2013-01-30
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Hsin-Hua Hu , Andreas Bibl
IPC: H01L21/78 , H01L27/15 , H01L25/075 , H01L33/00
CPC classification number: H01L21/7806 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L33/0079 , H01L2224/83 , H01L2224/95 , H01L2924/0002 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity.
Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 微器件阵列位于载体衬底上的分段腔阵列内。 每个微型装置横向保持在相应的分段腔的多个分段固定柱之间。
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公开(公告)号：US09095980B2
公开(公告)日：2015-08-04
申请号：US13776188
申请日：2013-02-25
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J11/00 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , H01L24/75 , H01L2224/7598
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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Patent Agency Ranking
公开(公告)号：US20150214420A1
公开(公告)日：2015-07-30
申请号：US14681715
申请日：2015-04-08
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Kevin K.C. Chang , Andreas Bibl
CPC classification number: H01L33/62 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L27/156 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/04 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/60 , H01L2224/83005 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 稳定层包括稳定腔阵列和稳定柱阵列。 每个稳定腔包括围绕稳定柱的侧壁。 微型设备阵列位于稳定柱阵列上。 微器件阵列中的每个微器件包括比直接在底表面下方的相应的稳定位置更宽的底表面。
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公开(公告)号：US20150187991A1
公开(公告)日：2015-07-02
申请号：US14194509
申请日：2014-02-28
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan , Daniel Arthur Haeger
CPC classification number: H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US20150179703A1
公开(公告)日：2015-06-25
申请号：US14640979
申请日：2015-03-06
Applicant: LuxVue Technology Corporation
Inventor： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L27/156 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/124 , H01L33/20 , H01L33/42 , H01L33/62 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.
Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。
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公开(公告)号：US09000566B2
公开(公告)日：2015-04-07
申请号：US14173693
申请日：2014-02-05
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , Andreas Bibl
IPC: H01L21/00 , B32B38/18 , H01L21/683 , H01L23/538 , B81C99/00
CPC classification number: B32B38/18 , B81C99/002 , H01L21/6835 , H01L23/5384 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , Y10T156/17 , H01L2924/00
Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.
Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。
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公开(公告)号：US20150093842A1
公开(公告)日：2015-04-02
申请号：US14563763
申请日：2014-12-08
Applicant: LuxVue Technology Corporation
Inventor： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L25/167 , H01L21/56 , H01L23/3171 , H01L25/0753 , H01L25/50 , H01L27/1214 , H01L27/1248 , H01L27/1262 , H01L33/005 , H01L33/06 , H01L33/42 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Abstract translation: 公开了一种用于在接收基板上接收微型装置的方法和结构。 诸如微型LED器件的微器件通过覆盖接收衬底上的导电层的钝化层穿孔，并且钝化层硬化。 在一个实施例中，微型LED器件通过B阶热固性材料穿孔。 在一个实施例中，微型LED器件穿过热塑性材料。
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