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公开(公告)号：US08703286B2
公开(公告)日：2014-04-22
申请号：US13090855
申请日：2011-04-20
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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公开(公告)号：US08643199B2
公开(公告)日：2014-02-04
申请号：US12361485
申请日：2009-01-28
IPC分类号： H01L23/29
CPC分类号： H01L23/24 , C08G73/10 , C08L79/08 , C08L2203/20 , C08L2205/02 , H01L21/563 , H01L21/566 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
摘要翻译： 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。
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公开(公告)号：US20090146289A1
公开(公告)日：2009-06-11
申请号：US12361485
申请日：2009-01-28
CPC分类号： H01L23/24 , C08G73/10 , C08L79/08 , C08L2203/20 , C08L2205/02 , H01L21/563 , H01L21/566 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01029 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
摘要翻译： 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。
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84.发明授权Thermal interface material and electronic assembly having such a thermal interface material 有权热界面材料和具有这种热界面材料的电子组件公开(公告)号：US07311967B2
公开(公告)日：2007-12-25
申请号：US10038334
申请日：2001-10-18
CPC分类号： H01L24/29 , H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/16152 , Y10S428/913 , Y10T428/1225 , Y10T428/12701 , Y10T428/12896 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/2982 , Y10T428/31511 , Y10T428/31529 , Y10T428/31663 , Y10T428/31692 , H01L2924/00 , H01L2924/01022 , H01L2924/01034 , H01L2924/01083 , H01L2224/29099 , H01L2924/00014 , H01L2924/0503 , H01L2924/05032 , H01L2924/04642 , H01L2924/05432 , H01L2224/29199 , H01L2224/29299
摘要： A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
摘要翻译： 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒具有低于所选温度（例如铟的157℃）的熔融温度，并且填料颗粒具有基本上高于所选温度（例如银的961℃）的熔融温度。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。
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85.发明授权公开(公告)号：US07294915B2
公开(公告)日：2007-11-13
申请号：US11259994
申请日：2005-10-24
申请人： Saikumar Jayaraman
发明人： Saikumar Jayaraman
IPC分类号： H01L23/48
CPC分类号： C08G69/42 , C08G59/504 , H01L21/563 , H01L23/293 , H01L23/296 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： An apparatus including a first substrate comprising a first set of contact points; a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of the second set of contact points; and a composition disposed between the first substrate and the second substrate including a siloxane-based aromatic diamine.
摘要翻译： 一种装置，包括：第一基板，包括第一组接触点; 第二基板，包括通过第一组接触点的一部分与第二组接触点的一部分之间的互连而耦合到第一基板的第二组接触点; 以及设置在所述第一基板和所述第二基板之间的包含硅氧烷基芳族二胺的组合物。
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公开(公告)号：US07252877B2
公开(公告)日：2007-08-07
申请号：US10358526
申请日：2003-02-04
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
IPC分类号： B32B27/00
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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公开(公告)号：US20070152325A1
公开(公告)日：2007-07-05
申请号：US11323243
申请日：2005-12-30
申请人： Ashay Dani , Anna Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
发明人： Ashay Dani , Anna Prakash , Saikumar Jayaraman , Mitesh Patel , Vijay Wakharkar
CPC分类号： H01L23/42 , H01L23/3731 , H01L23/3732 , H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01327 , H01L2924/04941 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. A dielectric sheet is also disposed between the die backside and the heat sink. The dielectric sheet diminishes overall heat transfer from the die to the heat sink by a small fraction of total possible heat transfer without the dielectric sheet. A method of operating the chip includes biasing the chip with the dielectric sheet in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 电介质片也设置在模具背面和散热器之间。 电介质薄片通过少量的总可能的热传递而减少了从模具到散热器的总传热，而没有电介质片材。 操作芯片的方法包括将电介质片偏置在适当位置。
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公开(公告)号：US20070148360A1
公开(公告)日：2007-06-28
申请号：US11684739
申请日：2007-03-12
申请人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
发明人： Terry Sterrett , Tian-An Chen , Saikumar Jayaraman
IPC分类号： B05D7/00
CPC分类号： C08L101/12 , B29C39/026 , B29C70/58 , B29C70/882 , B29L2031/3406 , C08J5/10 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H05K3/321 , H05K2201/0367 , H05K2201/10674 , H05K2201/10719 , Y10T428/24917 , Y10T428/25 , Y10T428/31681 , H01L2924/00 , H01L2224/0401
摘要： A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
摘要翻译： 公开了一种低温碰撞的方法。 提供能够在低温下通过自由基或阳离子聚合交联的树脂。 然后将导电颗粒加入到树脂中以形成混合物。 然后通过加热或暴露于光使混合物活化，以使混合物聚合。 在替代实施方案中，使用乙烯基醚树脂，其中加入导电颗粒。 混合物通过曝光聚合。
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公开(公告)号：US07183139B2
公开(公告)日：2007-02-27
申请号：US10794467
申请日：2004-03-04
IPC分类号： H01L21/44
CPC分类号： H01L23/293 , C08G59/3254 , H01L21/563 , H01L24/29 , H01L24/743 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/10329 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/0401
摘要： A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.
摘要翻译： 用于芯片封装中底部填充的系统包括底部填充混合物，其改善通常存在于包装的模具和浸渍树脂的玻璃纤维安装基板之间的CTE失配。 在一个实施方案中，该系统包括一种底部填充混合物，其单独表现出以前已知的无机填充的底部填充复合物的特征的CTE。 实施例还涉及使用底部填充混合物的倒装芯片封装的组装。
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公开(公告)号：US20060105497A1
公开(公告)日：2006-05-18
申请号：US10990228
申请日：2004-11-15
申请人： Daewoong Suh , Saikumar Jayaraman
发明人： Daewoong Suh , Saikumar Jayaraman
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/563 , H01L23/562 , H01L2924/0002 , H01L2924/15311 , H05K3/305 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/043 , H05K2203/0568 , Y02P70/613 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one opening within the stress compensation layer, and forming an interconnect paste within the at least one opening.
摘要翻译： 描述形成微电子结构的方法。 这些方法包括在衬底上形成应力补偿层，在应力补偿层内形成至少一个开口，以及在至少一个开口内形成互连膏。
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