摘要:
In order to follow the ABS conditions when the movement of the object position, such as the movement of an object or the movement of an X-ray tube, occurs during fluoroscopy, an X-ray image diagnostic apparatus includes a histogram generation unit 6b that generates a histogram showing the distribution of brightness values of an X-ray image of an object; an object region detection unit 6c that detects an object region, which is a region where the object is imaged, in the X-ray image on the basis of the histogram; and an X-ray condition determination unit 2a that determines X-ray conditions defining an output of X-rays so that a brightness value representing the object region approaches a target brightness value of the object region set in advance.
摘要:
To provide a method for controlling an X-ray image diagnostic apparatus and an X-ray generation device equipped with an ABS system tracking movement of an object position without an operator performing setting operation for a region of interest (ROI), the determination condition storage unit (6i) storing ROI position determination conditions in which image statistical information is used for defining conditions to determine a position of an ROI in an X-ray image out of plural blocks generated by dividing the X-ray image into plural regions, the first block statistical information calculation unit (6f) calculating the image statistical information for each of plural blocks, and the region-of-interest position selection unit (6g) selecting a block that serves as an ROI from among plural blocks using the ROI position determination conditions and the image statistical information of each block are provided. A feedback value to be used in controlling the brightness value of the ROI is calculated based on the brightness value of the ROI, and irradiation conditions are determined so that the feedback value reaches a target brightness value.
摘要:
A wiring board includes an insulating resin layer, wirings, and a via-hole conductor. The wirings are disposed through the insulating resin layer therebetween and formed of copper foils. The via-hole conductor penetrates through the insulating resin layer and electrically connects the wirings together. The via-hole conductor includes a resin portion and a metal portion containing copper, tin, and bismuth. The metal portion includes a first metal region including a link of copper particles, a second metal region including, as a main component, at least one of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region including bismuth as a main component. The copper particles partially include a plane-to-plane contact with a roughened surface of the copper foil, and the second metal region is partially formed on a surface of the link and on the roughened surface of the copper foil.
摘要:
An oscillating mirror module as a deflecting unit is disposed so that a movable mirror faces a plane where image carriers are arranged. A plurality of light source units are disposed within a plane parallel to the plane where the image carriers are arranged so that main light fluxes of light beams emitted from the light sources form predetermined angles with each other. The oscillating mirror module includes an incidence mirror that bends a plurality of light beams emitted from the light source units to direct the light beams to the movable mirror, and a separation mirror that separates the light beams scanned by the movable mirror into two opposite directions with respect to a cross-section including a surface normal of the movable mirror and perpendicular to the rotation axis of the movable mirror. A light collecting unit collects light beams so that output optical axes of the light beams corresponding to the light source units intersect on a surface of the movable mirror of the deflecting unit.
摘要:
The present invention relates to a laminated structure having a molded body that has a fine concavo-convex structure on a surface thereof and a protection film that is allowed to come into contact with the surface of the molded body on the side of the fine concavo-convex structure, in which the average interval between convexes of the fine concavo-convex structure is equal to or shorter than a wavelength of visible light, and adhesion strength of the protection film when the protection film is attached to the fine concavo-convex structure is 0.1 to 1.7 N/25 mm. According to the present invention, a laminated structure for manufacturing a processed product which can be easily processed without causing the protection film to be easily detached and has little residual adhesive can be provided.
摘要:
To provide a method for producing pyrimidine compound useful as an intermediate for agricultural chemicals or pharmaceuticals, which is simple in operation, presents high yield and produces only a small amount of by-products.The method comprises reacting a compound represented by the formula (I) with a compound represented by the formula (II) in the presence of a pyridine compound to produce a compound represented by the formula (III), a compound represented by the formula (IV) or their mixture.
摘要:
A mold in which a fine uneven structure is formed on the surface by anodizing a surface of an aluminum base material having a purity of equal to or more than 99.5% by mass, wherein a 60-degree gloss of the surface on the side where a fine uneven structure is formed is equal to or more than 750%.
摘要:
A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.
摘要:
A first main-scanning-position correction unit divides a surface to be scanned into first areas in a main scanning direction into areas, sets a separate clock-pulse timing for first area, and corrects a main-scanning position error. A second main-scanning-position correction unit divides the surface into second areas in the main scanning direction based on first-scanning-position correction data, sets a separate clock-pulse timing for each second area, and corrects the main-scanning position error.
摘要:
A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.