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公开(公告)号：US08395056B2
公开(公告)日：2013-03-12
申请号：US12811800
申请日：2009-01-16
IPC分类号： H05K9/00
CPC分类号： H05K3/4626 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K3/4069 , H05K3/462 , H05K2201/0129 , H05K2201/0133 , H05K2201/0209 , H05K2201/10121 , H05K2201/10378 , H05K2203/061 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
摘要： A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.
摘要翻译： 多层印刷电路板（11）由在其两侧具有布线的多个印刷电路板（21a和21b）和用于互连印刷电路板（21a和21b）的松弛连接层（15）组成。 松弛连接层（15）包含无机填料，热固性树脂和用于缓解内应力的缓冲器。 通过使位于其内部的松弛连接层（15）通过在回流焊或其它工序中的加热和冷却引起的内部应力来防止多层印刷线路板（11）发生翘曲。
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公开(公告)号：US20100276187A1
公开(公告)日：2010-11-04
申请号：US12811800
申请日：2009-01-16
IPC分类号： H05K1/00
CPC分类号： H05K3/4626 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K3/4069 , H05K3/462 , H05K2201/0129 , H05K2201/0133 , H05K2201/0209 , H05K2201/10121 , H05K2201/10378 , H05K2203/061 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
摘要： A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.
摘要翻译： 多层印刷电路板（11）由在其两侧具有布线的多个印刷电路板（21a和21b）和用于互连印刷电路板（21a和21b）的松弛连接层（15）组成。 松弛连接层（15）包含无机填料，热固性树脂和用于缓解内应力的缓冲器。 通过使位于其内部的松弛连接层（15）通过在回流焊或其它工序中的加热和冷却引起的内部应力来防止多层印刷线路板（11）发生翘曲。
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公开(公告)号：US08446736B2
公开(公告)日：2013-05-21
申请号：US12305046
申请日：2008-05-28
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
摘要： An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
摘要翻译： 具有开口并在表面层上形成电路的上板，具有开口的板和在通孔中填充有导电膏的形成导电孔的连接片和在表面层上形成电路的下板被堆叠 ，加热按压。 特别地，板之间的连接片由与上板和下板不同的材料制成。 可以制造具有空腔结构的多层电路板和具有高层间连接可靠性的全层IVH结构。
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公开(公告)号：US20090175017A1
公开(公告)日：2009-07-09
申请号：US12305046
申请日：2008-05-28
CPC分类号： H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
摘要： An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
摘要翻译： 具有开口并在表面层上形成电路的上板，具有开口的板和在通孔中填充有导电膏的形成导电孔的连接片和在表面层上形成电路的下板被堆叠 ，加热按压。 特别地，板之间的连接片由与上板和下板不同的材料制成。 可以制造具有空腔结构的多层电路板和具有高层间连接可靠性的全层IVH结构。
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公开(公告)号：US20120272520A1
公开(公告)日：2012-11-01
申请号：US13446562
申请日：2012-04-13
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , B23K35/025 , B23K35/302 , H05K3/4652 , H05K2203/178 , Y02P70/613 , Y10T29/49126 , Y10T29/49158 , Y10T29/49165
摘要： In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.
摘要翻译： 在制造电路板的方法中，将导电浆料填充在形成有第一预浸料坯的第一孔中，该第一预浸料坯具有使第一保护膜粘合的两侧，从而制造第一电路板。 回收通过混合纤维片获得的纤维片外壳糊，得到回收膏; 过滤通过过滤器进行; 加入溶剂等; 并且调节粘度，组成比等，从而制造再利用浆料。 将再利用糊料填充在形成有第二预浸料坯的第二孔中，所述第二预浸料坯具有使第二保护膜粘附的两侧。
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公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译： 提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。 第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。 使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。
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公开(公告)号：US20050067177A1
公开(公告)日：2005-03-31
申请号：US10952476
申请日：2004-09-29
申请人： Ryuichi Saito , Hiroshi Kagata , Masaaki Katsumata
发明人： Ryuichi Saito , Hiroshi Kagata , Masaaki Katsumata
IPC分类号： H01L23/12 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/16 , H03H9/10 , H05K1/03 , H05K3/28 , H05K3/30 , H01L23/28
CPC分类号： H01L25/16 , H01L21/4857 , H01L21/563 , H01L23/13 , H01L23/3121 , H01L23/49822 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15192 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H03H9/0542 , H03H9/0557 , H03H9/1085 , H05K1/0306 , H05K3/284 , H05K3/305 , H05K2201/09036 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y02P70/613 , Y10T29/43 , Y10T29/435 , Y10T29/49126 , Y10T29/49163 , Y10T29/49165 , Y10T29/49171 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and the ceramic substrate. The ceramic substrate has a surface thereof having a recess formed therein. The first and second electrodes are provided on the surface of the ceramic substrate so that the recess is located between the first and second electrodes. The component is located over the recess and spaced from the ceramic substrate with a space including the recess. The space including the recess is filled with the resin. The module allows each component to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes on the substrate and improving the operation reliability.
摘要翻译： 模块包括陶瓷基板，设置在陶瓷基板上的第一和第二电极，分别具有连接到第一和第二电极的第三和第四电极以及填充在部件和陶瓷基板之间的空间中的树脂。 陶瓷基板的表面具有形成在其中的凹部。 第一和第二电极设置在陶瓷基板的表面上，使得凹槽位于第一和第二电极之间。 所述部件位于所述凹部之上并与所述陶瓷基板间隔开并具有包括所述凹部的空间。 包含凹部的空间用树脂填充。 该模块允许每个部件以更高的接合强度进行表面安装，从而防止基板上的电极之间的短路并提高操作可靠性。
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公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译： 提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。 第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。 使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。
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公开(公告)号：US5594406A
公开(公告)日：1997-01-14
申请号：US122604
申请日：1993-10-01
申请人： Kazushige Koyama , Naoki Mutoh , Masaaki Katsumata
发明人： Kazushige Koyama , Naoki Mutoh , Masaaki Katsumata
CPC分类号： H01C7/112 , Y10T29/49099
摘要： A product and process of making such product in which a varistor is formed by diffusing lead borosilicate-type glass, into a surface of a fired or sintered zinc oxide substrate, i.e., "varistor element," during formation of an electrode on the surface of the substrate. Typically, an electrode paste or material, comprising a mixture or lead borosilicate-type glass frit and Ag powder, is applied to the substrate and provides the lead borosilicate-type glass for diffusing into the substrate. The improvement is that the lead borosilicate-type glass frit for the electrode paste or material comprises a mixture of PbO, B.sub.2 O.sub.3, SiO.sub.2 and at least one metal oxide selected from the group consisting of cobalt oxide, magnesium oxide, yttrium oxide, antimony oxide, manganese oxide, tellurium oxide, lanthanum oxide, cerium oxide, praseodium oxide, neodymium oxide, samarium oxide, europium oxide, gadolinium oxide, terbium oxide, dysprosium oxide, holmium oxide, erbium oxide, thulium oxide, ytterbium oxide and lutetium oxide.
摘要翻译： PCT No.PCT / JP93 / 00224 Sec。 371日期：1993年10月1日 102（e）日期1993年10月1日PCT提交1993年2月24日PCT公布。 公开号WO93 / 17438 日期1993年9月2日制造这样的产品的方法，其中通过将硼硅酸铅型玻璃扩散到形成火焰或烧结氧化锌衬底的表面中，即形成“变阻器元件” 电极在基板的表面上。 通常，将包含混合物或硼硅酸铅型玻璃料和Ag粉末的电极浆料或材料施加到基底上，并提供用于扩散到基底中的硼硅酸铅型玻璃。 改进之处在于用于电极浆料或材料的硼硅酸铅型玻璃料包括PbO，B 2 O 3，SiO 2和至少一种选自氧化钴，氧化镁，氧化钇，氧化锑， 氧化锰，氧化碲，氧化镧，氧化铈，氧化镨，氧化钕，氧化钐，氧化铕，氧化钆，氧化铽，氧化镝，氧化钬，氧化铒，氧化oxide，氧化镱和氧化镥。
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10.发明授权Magnetostriction type torque sensor with temperature dependent error compensation 失效具有温度相关误差补偿的磁致伸缩式扭矩传感器
公开(公告)号：US4989460A
公开(公告)日：1991-02-05
申请号：US288824
申请日：1988-12-23
申请人： Masashi Mizuno , Katsuhiro Kojima , Yoji Ozawa , Takanobu Saito , Munekatsu Shimada , Masaaki Katsumata , Hiroyuki Aoki
发明人： Masashi Mizuno , Katsuhiro Kojima , Yoji Ozawa , Takanobu Saito , Munekatsu Shimada , Masaaki Katsumata , Hiroyuki Aoki
IPC分类号： G01L3/10
摘要： A magnetostriction type torque sensor employs a plurality of detector coils arranged in axial arrangement along an objective rotary body. The detector coils are so designed and arranged as to compensate influence of temperature, particularly the error caused due to axial temperature gradient caused in the objective rotary body.
摘要翻译： 磁致伸缩式扭矩传感器使用沿物镜旋转体轴向布置的多个检测器线圈。 检测器线圈被设计和布置为补偿温度的影响，特别是由于在物镜旋转体中引起的轴向温度梯度引起的误差。
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