公开(公告)号：US11876503B2

公开(公告)日：2024-01-16

申请号：US17164287

申请日：2021-02-01

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuichi Goto ,  Keisuke Takeyama

IPC分类号： H03H9/10 ,  H03H9/24

CPC分类号： H03H9/2457 ,  H03H9/1057

摘要： A resonance device that includes a lower cover, an upper cover joined to the lower cover, a resonator having vibrating arms that bend and vibrate in a vibration space between the lower cover and the upper cover, and particles attached to tip portions of the vibrating arms. When a median size of the particle is defined as D50, a specific gravity of the particle is defined as A, and a resonant frequency of the resonator is defined as X, D50≤189/(X×√A).

公开(公告)号：US20230359019A1

公开(公告)日：2023-11-09

申请号：US18196678

申请日：2023-05-12

申请人： HUAWEI TECHNOLOGIES CO., LTD. ,  FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： Thomas Knieling ,  Ulrich Hofmann ,  Stephan Marauska ,  Berkan Zorlubas ,  Fabian Schwarz ,  Frank Senger ,  Yong Cao

IPC分类号： G02B26/08 ,  H03H3/007 ,  H03H9/10

CPC分类号： G02B26/0858 ,  H03H3/0073 ,  H03H9/1057

摘要： A micromechanical resonator wafer assembly includes an actuator wafer supporting an outer actuator layer. The outer actuator layer includes an oscillating part configured to be driven by an electrical drive signal. The micromechanical resonator wafer assembly further includes a device wafer mounted on top of the actuator wafer. The device wafer includes a plurality of inner actuators. Each of the inner actuators include an oscillation body configured to oscillate about one or more axes. The device wafer is physically connected to the actuator wafer such that each of the inner actuators forms with the outer actuator layer a coupled oscillation system for excitation of the oscillation body of the respective inner actuator. The micromechanical resonator wafer assembly provides external actuation of the oscillation body of each of the inner actuators by use of the outer actuator layer and hence, provides improved scan angles with fast start-up time.

公开(公告)号：US11804820B2

公开(公告)日：2023-10-31

申请号：US17945277

申请日：2022-09-15

申请人： Murata Manufacturing Co., Ltd.

发明人： Ryota Kawai ,  Yoshihisa Inoue ,  Yoshiyuki Higuchi

IPC分类号： H03H9/24 ,  H03H9/05 ,  H03H9/10

CPC分类号： H03H9/2489 ,  H03H9/0595 ,  H03H9/1057

摘要： A resonator is provided that includes a vibration member including three or more vibration arms that each have a fixed end with at least two vibration arms performing out-of-plane bending at different phases. The resonator also includes a base having a front end connected to the fixed end of each of the vibration arms and a rear end opposing the front end. A frame holds the vibration member and two support arms are provided with first ends connected to the frame. The second ends of the two support arms are connected to a location in the rear end of the base.

公开(公告)号：US11799436B2

公开(公告)日：2023-10-24

申请号：US16551757

申请日：2019-08-27

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Byron Neville Burgess ,  William Robert Krenik ,  Stuart M. Jacobsen

IPC分类号： H03H3/04 ,  H03H9/10 ,  H03H3/02 ,  H03H9/02 ,  H03H9/17 ,  H01L23/498 ,  H01L23/31 ,  H03H9/05

CPC分类号： H03H3/02 ,  H03H3/04 ,  H03H9/02102 ,  H03H9/02149 ,  H03H9/1007 ,  H03H9/1057 ,  H03H9/175 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/49838 ,  H03H9/0542 ,  H03H2003/023 ,  H03H2003/027 ,  Y10T29/42 ,  Y10T29/49171 ,  Y10T29/49172

摘要： A method of forming a resonator includes forming top and bottom dielectric structures over a substrate. A piezoelectric layer is formed between the top and bottom dielectric structures. A bottom electrode is formed between the piezoelectric layer and the bottom dielectric structure, and a top electrode is formed between the piezoelectric layer and the top dielectric structure. A metal layer is formed over the top dielectric structure and is patterned, thereby forming a first contact pad making electrical contact to the top electrode, a second contact pad making electrical contact with the bottom electrode, and a mass bias located over the top dielectric structure.

公开(公告)号：US11770112B1

公开(公告)日：2023-09-26

申请号：US17197378

申请日：2021-03-10

申请人： SiTime Corporation

发明人： Charles I. Grosjean ,  Ginel C. Hill ,  Paul M. Hagelin ,  Renata Melamud Berger ,  Aaron Partridge ,  Markus Lutz

IPC分类号： H03H9/24 ,  H03H3/007 ,  B81C1/00 ,  H03H9/10

CPC分类号： H03H9/2457 ,  B81C1/0069 ,  H03H3/0072 ,  H03H3/0076 ,  H03H9/1057

摘要： A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

公开(公告)号：US20180048286A1

公开(公告)日：2018-02-15

申请号：US15723344

申请日：2017-10-03

申请人： Murata Manufacturing Co, Ltd.

发明人： YUICHI GOTO ,  Wakana Hirota

IPC分类号： H03H9/17

CPC分类号： H03H9/172 ,  H03H3/0072 ,  H03H9/02338 ,  H03H9/0595 ,  H03H9/1057 ,  H03H9/178 ,  H03H9/2489 ,  H03H2009/155

摘要： A resonance device is provided having a resonator with opposing upper and lower lids. The resonator includes a base, and multiple vibration arms that are connected to a front end of the base so as to extend away from the base. Moreover, a frame surrounds a periphery of the base portion and the vibration arms and one or more holding arms connect the base to the frame. The base, the vibration arms, and the holding arm include a substrate and a temperature characteristics correction layer laminated on the substrate and having a material with a coefficient of thermal expansion different from that of the substrate. The base, the vibration arms, and the holding arm are formed integrally with the substrate and the temperature characteristics correction layer.

公开(公告)号：US09660176B2

公开(公告)日：2017-05-23

申请号：US14031663

申请日：2013-09-19

申请人： Seiko Epson Corporation

发明人： Hideo Miyasaka

IPC分类号： B23K31/02 ,  H01L41/23 ,  H03H9/10 ,  B23K1/00 ,  B23K1/005 ,  G01C19/5628 ,  B23K101/36

CPC分类号： H01L41/23 ,  B23K1/0016 ,  B23K1/005 ,  B23K2101/36 ,  G01C19/5628 ,  H01L2924/16195 ,  H03H9/10 ,  H03H9/1021 ,  H03H9/1057 ,  H03H9/1071 ,  Y10T29/42

摘要： A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction.

公开(公告)号：US20170093361A1

公开(公告)日：2017-03-30

申请号：US15186510

申请日：2016-06-19

申请人： SiTime Corporation

发明人： Charles I. Grosjean ,  Nicholas Miller ,  Paul M. Hagelin ,  Ginel C. Hill ,  Joseph C. Doll ,  Trushal Chokshi ,  Yi Zhang ,  Aaron Partridge ,  Markus Lutz

IPC分类号： H03H3/007 ,  H03H9/17

CPC分类号： H03H3/0077 ,  H03H9/02259 ,  H03H9/02401 ,  H03H9/02448 ,  H03H9/1057 ,  H03H9/17 ,  H03H9/2463 ,  H03H2003/027 ,  H03H2009/02307 ,  H03H2009/155

摘要： In a MEMS device having a substrate and a moveable micromachined member, a mechanical structure secures the moveable micromachined member to the substrate, thermally isolates the moveable micromachined member from the substrate and provides a conduction path to enable heating of the moveable micromachined member to a temperature of at least 300 degrees Celsius.

公开(公告)号：US20170012604A1

公开(公告)日：2017-01-12

申请号：US15200775

申请日：2016-07-01

申请人： SEIKO EPSON CORPORATION

发明人： Takahiko YOSHIZAWA

IPC分类号： H03H9/17 ,  H03B5/32 ,  H01L41/053 ,  H01L41/311 ,  H01L41/047 ,  H01L41/18

CPC分类号： H03H9/17 ,  H03H3/02 ,  H03H9/1014 ,  H03H9/1057

摘要： A vibrator includes a substrate, an electrode located on the substrate, a vibrating piece, an interconnect that includes a first joining portion surrounding the electrode on the substrate and is connected to the vibrating piece and electrically connected to the electrode, and a lid portion that has an opening for exposing the electrode and is joined to the first joining portion.

摘要翻译： 振动器包括基板，位于基板上的电极，振动片，互连件，其包括围绕基板上的电极并连接到振动片并电连接到电极的第一接合部分和盖部分， 具有用于使电极露出的开口并与第一接合部接合。

公开(公告)号：US09350318B2

公开(公告)日：2016-05-24

申请号：US14085948

申请日：2013-11-21

申请人： Seiko Epson Corporation

发明人： Shinya Aoki ,  Masashi Shimura

IPC分类号： B23K26/00 ,  H03H9/10 ,  B23K26/22

CPC分类号： H03H9/1014 ,  B23K26/21 ,  B23K26/211 ,  B23K26/22 ,  H01L2224/16 ,  H01L2924/1461 ,  H03H9/1057 ,  H03H9/1071 ,  H01L2924/00

摘要： A method for manufacturing an electronic device is provided, in which a base and a lid as a cover body are bonded together while forming an interior space between the base and the lid. The method includes: a step of preparing the lid including a groove communicating the interior space with the outside, the groove being in a back surface of the lid; a step of accommodating a gyro element as an electronic component in the interior space; a first bonding step of bonding the base and the lid together by seam welding at an area for bonding except for a portion corresponding to the groove; and a second bonding step of bonding the base and the lid by welding using a laser beam at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.

摘要翻译： 本发明提供一种电子设备的制造方法，其中将基座和作为盖体的盖子结合在一起，同时在基座和盖子之间形成内部空间。 该方法包括：准备盖子的步骤，包括将内部空间与外部连通的槽，槽位于盖的后表面中; 将陀螺元件作为电子部件容纳在内部空间中的步骤; 第一接合步骤，通过在除了对应于所述槽的部分之外的接合区域处的缝焊将所述基部和所述盖结合在一起; 以及第二接合步骤，通过使用激光束在所述接合区域的一部分进行焊接来接合所述基部和所述盖，所述部分包括所述凹槽的外侧的端部，从而封闭所述凹槽。