公开(公告)号：US20140211483A1

公开(公告)日：2014-07-31

申请号：US14342158

申请日：2012-08-31

申请人： Su Hyeon Cho

发明人： Su Hyeon Cho

IPC分类号： G02B5/02 ,  F21V11/16

CPC分类号： G02B5/0226 ,  F21V11/16 ,  G02B5/0221 ,  G02B5/0231 ,  G02B5/0278 ,  G02B6/0053 ,  Y10T428/24355

摘要： Provided is an optical sheet, the optical sheet comprising: a base film; and a plurality of constructions which are irregularly arranged on one surface of the base film so that an arrangement axis of one construction is out of an arrangement axis of another construction adjacent to one side surface of the base film within a range of 1 to 50% of a length or a width of the another construction. Thus, a protective film and a prism type sheet are removed, and the weakness and workability of processes are improved, thereby being capable of reducing a unit price. Furthermore, a shielding force which is the most weakness of the prism type sheet can be improved.

摘要翻译： 提供了一种光学片，所述光学片包括：基膜; 以及在基膜的一个表面上不规则地配置的多个结构，使得一个结构的布置轴线在与基膜的一个侧表面相邻的另一结构的布置轴线的1％到50％的范围内， 具有另一结构的长度或宽度。 因此，去除了保护膜和棱镜型片，并且提高了工艺的弱点和可加工性，从而能够降低单价。 此外，可以提高作为棱镜型片材最弱点的屏蔽力。

公开(公告)号：US20130126215A1

公开(公告)日：2013-05-23

申请号：US13489045

申请日：2012-06-05

申请人： Suk Hyeon Cho ,  Francis Sohn

发明人： Suk Hyeon Cho ,  Francis Sohn

IPC分类号： H05K7/20 ,  H05K3/42

CPC分类号： H05K1/0206 ,  H05K1/0209 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09781 ,  H05K2203/0338 ,  Y10T29/49165

摘要： The present invention relates to a printed circuit board including: a substrate; a circuit pattern formed on a surface of the substrate; a dummy pattern formed on the surface of the substrate, where the circuit pattern is not formed, to be spaced apart from the circuit pattern by a predetermined interval; and a plurality of heat radiating vias formed along an outer edge of the substrate to electrically connect the dummy patterns through the substrate, and it is possible to suppress generation of electromagnetic waves or shield the electromagnetic waves and improve heat radiating characteristics at the same time.

摘要翻译： 印刷电路板技术领域本发明涉及一种印刷电路板，包括：基板; 形成在所述基板的表面上的电路图案; 形成在基板表面上的虚设图案，其中未形成电路图案，以与电路图案间隔预定间隔; 以及沿着基板的外缘形成的多个散热通孔，以通过基板电连接虚拟图案，并且可以同时抑制电磁波的产生或屏蔽电磁波并提高散热特性。

公开(公告)号：US20130111685A1

公开(公告)日：2013-05-09

申请号：US13808677

申请日：2010-08-10

申请人： Hyeon Cho

发明人： Hyeon Cho

IPC分类号： D06C27/00

CPC分类号： D06C27/00 ,  D04H1/02 ,  D04H1/541 ,  D04H1/558

摘要： The present invention relates to a nonwoven fabric for cleaning and to a production method for the same. Provided is a nonwoven fabric for cleaning and a production method therefor, comprising: a raw-material supply step in which between 80 and 90 parts by weight of cotton fibre and between 10 and 20 parts by weight of synthetic fibre are introduced; a step in which the introduced raw materials are mixed by using a blowing and scutching machine; a step in which a web is produced in the form of a sheet by using a carding machine to process the mixed raw materials; a step in which a fibrous web is produced by layering a plurality of the webs and then spraying a water jet so as to join the plurality of webs to each other; and a heat-treatment step in which the fibrous web is subjected to hot drying, and the synthetic fibre is softened and the bond with the cotton fibre is strengthened. Also provided is a production method for the nonwoven fabric. According to the present invention, a nonwoven fabric for cleaning can be provided which maintains the water absorbency and the oil absorbency while markedly increasing the tensile strength of the cotton fibre.

摘要翻译： 本发明涉及一种清洁用无纺布及其制造方法。 本发明提供一种清洗用无纺布及其制造方法，其特征在于，包括：原料供给工序，其中，导入80〜90重量份的棉纤维和10〜20重量份的合成纤维; 通过使用吹扫和切割机将引入的原料混合的步骤; 通过使用梳理机以片材的形式制造纤维网来处理混合原料的步骤; 通过层叠多个纤维网然后喷射水射流以将多个纤维网彼此连接来生产纤维幅材的步骤; 以及对纤维网进行热干燥的热处理工序，合成纤维软化，与棉纤维的结合得到增强。 还提供了一种无纺布的制造方法。 根据本发明，可以提供保持吸水性和吸油性同时显着提高棉纤维的拉伸强度的清洁用无纺布。

公开(公告)号：US20120218703A1

公开(公告)日：2012-08-30

申请号：US13240439

申请日：2011-09-22

申请人： Jeong Hyeon Cho ,  Myung Hee Sung ,  Kyoung Sun Kim ,  Seung Jin Seo ,  Jung Joon Lee

发明人： Jeong Hyeon Cho ,  Myung Hee Sung ,  Kyoung Sun Kim ,  Seung Jin Seo ,  Jung Joon Lee

IPC分类号： G06F1/16 ,  H05K1/00 ,  H05K1/14

CPC分类号： H05K1/141 ,  G06F1/183 ,  H05K1/147 ,  H05K2201/10189

摘要： A circuit board assembly includes a first circuit board having an electrical connection circuit on a surface thereof. A second circuit board is on the surface of the first circuit board. A first memory socket is mounted on the second circuit board. The first memory socket is only electrically connected to the electrical connection circuit through the second circuit board. A second memory socket is mounted on the second circuit board. The second memory socket that is only electrically connected to the electrical connection circuit through the second circuit board.

摘要翻译： 电路板组件包括在其表面上具有电连接电路的第一电路板。 第二电路板位于第一电路板的表面上。 第一个存储器插座安装在第二个电路板上。 第一存储器插座仅通过第二电路板电连接到电连接电路。 第二个存储器插座安装在第二个电路板上。 第二存储器插座仅通过第二电路板电连接到电连接电路。

公开(公告)号：US20120111728A1

公开(公告)日：2012-05-10

申请号：US13283329

申请日：2011-10-27

申请人： Suk Hyeon Cho ,  Myeong Ho Hong

发明人： Suk Hyeon Cho ,  Myeong Ho Hong

IPC分类号： C25D1/00

CPC分类号： H05K3/4007 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/205 ,  H05K2201/09745 ,  H05K2203/0338 ,  H01L2924/00

摘要： Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.

摘要翻译： 这里公开了一种制造电路板的方法。 根据本发明的优选实施例的制造电路板的方法被配置为包括（A）在载体110的一个表面111上形成用于凸块的空腔115，（B）在空腔115中形成凸块130 对于通过电镀工艺的凸块，（C）在载体110的一个表面111上层叠绝缘层140以施加凸起130，（D）形成包括与凸起130连接的通孔155的电路层150 绝缘层140和（E）去除载体110，由此通过形成用于载体110中的凸点的空腔111来形成分离的焊球的过程以形成凸起，从而简化了制造电路板的过程 并缩短交货时间。

公开(公告)号：US20120095007A2

公开(公告)日：2012-04-19

申请号：US12600283

申请日：2008-04-30

申请人： Ki Ho Lee ,  Han Ju Yi ,  Hyeon Cho ,  Dae Joong Im ,  Eun Hee Chae ,  Yeon Jung Choi

发明人： Ki Ho Lee ,  Han Ju Yi ,  Hyeon Cho ,  Dae Joong Im ,  Eun Hee Chae ,  Yeon Jung Choi

IPC分类号： A61K31/496 ,  C07D405/10 ,  C07D403/04 ,  C07D401/04 ,  A61P25/00 ,  A61P25/22 ,  A61K31/4965 ,  A61K31/498 ,  A61K31/506 ,  C07D295/14 ,  A61P25/24

CPC分类号： C07D239/42 ,  C07D213/74 ,  C07D241/04 ,  C07D241/44 ,  C07D265/18 ,  C07D265/36 ,  C07D295/033 ,  C07D307/54 ,  C07D317/58 ,  C07D317/66 ,  C07D319/18

摘要： There is provided a novel carbamoyloxy arylalkan arylpiperazine derivative compound having abundant racemic or enantiomeric characteristics, represented by the formula 1, and pharmaceutically available salts or hydrates thereof. Also, there are provided a pharmaceutical composition for treating pain (i.e., acute or chronic pain, neuropathic pain, inflammatory pain, diabetic pain, postherpetic neuralgia, etc.), anxiety or depression including an effective amount of the compound, and a method for treating pain, anxiety or depression in mammals by administering an effective amount of the compound to the mammals in need of treatment thereof.

摘要翻译： 提供了具有由式1表示的大量外消旋或对映体特征的新型氨基甲酰氧基芳基烷基芳基哌嗪衍生物化合物及其药学上可用的盐或水合物。 此外，提供了用于治疗疼痛（即急性或慢性疼痛，神经性疼痛，炎性疼痛，糖尿病性疼痛，带状疱疹后神经痛等），焦虑或抑郁的药物组合物，包括有效量的化合物，以及用于 通过向需要治疗的哺乳动物施用有效量的化合物来治疗哺乳动物的疼痛，焦虑或抑郁。

公开(公告)号：US20110308845A1

公开(公告)日：2011-12-22

申请号：US13164055

申请日：2011-06-20

申请人： Suk Hyeon CHO ,  Jung Hyun Park

发明人： Suk Hyeon CHO ,  Jung Hyun Park

IPC分类号： H05K1/09 ,  H05K3/42 ,  H05K1/11

CPC分类号： H05K3/421 ,  H05K3/0097 ,  H05K3/426 ,  H05K3/427 ,  H05K2201/0959 ,  H05K2203/1536 ,  Y10T29/49165

摘要： The present invention provides a printed circuit board including: an insulating member having a through via hole; a circuit pattern disposed on the insulating member; a solder resist disposed on the insulating member while exposing a portion of the circuit pattern; a via plating pad connected to the circuit pattern, disposed inside the via hole, and covering a lower opening of the via hole along an inner wall of the via hole; and an external connection means having a center portion coinciding with a center portion of the via hole and disposed on the via plating pad, and a method of manufacturing the same.

摘要翻译： 本发明提供一种印刷电路板，包括：具有通孔的绝缘件; 布置在所述绝缘构件上的电路图案; 设置在所述绝缘构件上的阻焊剂，同时暴露所述电路图案的一部分; 连接到所述电路图案的通孔电镀垫，设置在所述通孔内部，并且沿着所述通孔的内壁覆盖所述通孔的下开口; 以及具有与通孔的中心部分重合并设置在通孔电镀垫上的中心部分的外部连接装置及其制造方法。

公开(公告)号：US08064217B2

公开(公告)日：2011-11-22

申请号：US11896769

申请日：2007-09-05

申请人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

发明人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

摘要： A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

摘要翻译： 公开了一种制造光学元件嵌入式印刷电路板的方法。 一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层 金属芯的侧面，以及形成在第一绝缘层上并与光学部件电连接的电路图案。

公开(公告)号：US07485569B2

公开(公告)日：2009-02-03

申请号：US11137345

申请日：2005-05-24

申请人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

发明人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

IPC分类号： H01L21/4763

CPC分类号： H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

摘要翻译： 一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层 并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。 此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

公开(公告)号：US20080198552A1

公开(公告)日：2008-08-21

申请号：US12010879

申请日：2008-01-30

申请人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

发明人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

IPC分类号： F21V29/00 ,  H05K7/20 ,  H01B13/00

CPC分类号： H01L23/3121 ,  H01L23/13 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/64 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

摘要翻译： 公开了一种用于制造封装板的封装板和方法。 一种封装板，其包括第一金属层，堆叠在第一金属层上的隔热层，其间插入有第一绝缘层，形成在所述隔热层中的空腔，形成在所述空腔中的安装层 与第一绝缘层接触，安装在安装层上的第一部件和覆盖散热层和空腔的至少一部分的第二绝缘层可提供改进的散热和更小的厚度。