公开(公告)号：US08485031B2

公开(公告)日：2013-07-16

申请号：US13361764

申请日：2012-01-30

申请人： Jamie Speldrich ,  Scott Edward Beck ,  Phil Foster ,  Ru Wang

发明人： Jamie Speldrich ,  Scott Edward Beck ,  Phil Foster ,  Ru Wang

IPC分类号： G01F1/68

CPC分类号： G01F15/125 ,  B01D17/10 ,  G01F1/36 ,  G01F1/40 ,  G01F1/684 ,  G01F1/6842

摘要： The present disclosure relates to methods and devices for reducing moisture, dust, particulate matter, and/or other contaminates entering a sensor. A sensor assembly may include a housing with an inlet flow port and an outlet flow port. The housing may define a fluid channel extending between the inlet flow port and the outlet flow port, with a sensor positioned in the housing and exposed to the fluid channel. The sensor may be configured to sense a measure related to the flow rate of a fluid flowing through the fluid channel. A hydrophobic filter may be situated in the fluid channel, sometimes upstream of the sensor. When so configured, and during operation of the sensor assembly, a fluid may pass through the inlet flow port, through the hydrophobic filter, across the sensor, and through the outlet flow port.

摘要翻译： 本公开涉及用于减少进入传感器的湿气，灰尘，颗粒物质和/或其它污染物的方法和装置。 传感器组件可以包括具有入口流动端口和出口流动端口的壳体。 壳体可以限定在入口流动端口和出口流动端口之间延伸的流体通道，传感器定位在壳体中并暴露于流体通道。 传感器可以被配置为感测与流过流体通道的流体的流量相关的测量。 疏水过滤器可以位于流体通道中，有时位于传感器的上游。 当这样构造并且在传感器组件的操作期间，流体可以穿过入口流动端口，穿过疏水过滤器，穿过传感器，并且通过出口流动端口。

公开(公告)号：US20120186336A1

公开(公告)日：2012-07-26

申请号：US13361764

申请日：2012-01-30

申请人： Jamie Speldrich ,  Scott Edward Beck ,  Phil Foster ,  Ru Wang

发明人： Jamie Speldrich ,  Scott Edward Beck ,  Phil Foster ,  Ru Wang

IPC分类号： G01F15/02

CPC分类号： G01F15/125 ,  B01D17/10 ,  G01F1/36 ,  G01F1/40 ,  G01F1/684 ,  G01F1/6842

摘要： The present disclosure relates to methods and devices for reducing moisture, dust, particulate matter, and/or other contaminates entering a sensor. A sensor assembly may include a housing with an inlet flow port and an outlet flow port. The housing may define a fluid channel extending between the inlet flow port and the outlet flow port, with a sensor positioned in the housing and exposed to the fluid channel. The sensor may be configured to sense a measure related to the flow rate of a fluid flowing through the fluid channel. A hydrophobic filter may be situated in the fluid channel, sometimes upstream of the sensor. When so configured, and during operation of the sensor assembly, a fluid may pass through the inlet flow port, through the hydrophobic filter, across the sensor, and through the outlet flow port.

摘要翻译： 本公开涉及用于减少进入传感器的湿气，灰尘，颗粒物质和/或其它污染物的方法和装置。 传感器组件可以包括具有入口流动端口和出口流动端口的壳体。 壳体可以限定在入口流动端口和出口流动端口之间延伸的流体通道，传感器定位在壳体中并暴露于流体通道。 传感器可以被配置为感测与流过流体通道的流体的流量相关的测量。 疏水过滤器可以位于流体通道中，有时位于传感器的上游。 当这样构造并且在传感器组件的操作期间，流体可以穿过入口流动端口，穿过疏水过滤器，穿过传感器，并且通过出口流动端口。

公开(公告)号：US20120170637A1

公开(公告)日：2012-07-05

申请号：US13336690

申请日：2011-12-23

申请人： Liang-Wei HUANG ,  Fang-Ru Wang ,  Ting-Fa Yu ,  Chien-Sheng Lee

发明人： Liang-Wei HUANG ,  Fang-Ru Wang ,  Ting-Fa Yu ,  Chien-Sheng Lee

IPC分类号： H04L27/01 ,  H04L7/00

CPC分类号： H04L25/03057 ,  H04N5/211 ,  H04N21/4383 ,  H04N21/4432

摘要： A communication device is disclosed including: an analog-to-digital converter (ADC) for converting an analog input signal into a digital input signal; an equalizer module coupled with the ADC for processing the digital input signal to generate an equalized signal; a data slicer coupled with the equalizer module for generating an output signal based on the equalized signal; and a control unit coupled with the equalizer module and the data slicer; wherein the control unit or the equalizer module preserves at least one signal equalizing parameter of the equalizer module before the equalizer module enters power saving mode, and the equalizer module loads the at least one signal equalizing parameter to operate when the communication device receives a predetermined control signal.

摘要翻译： 公开了一种通信设备，包括：用于将模拟输入信号转换为数字输入信号的模数转换器（ADC）; 与ADC耦合的均衡器模块，用于处理数字输入信号以产生均衡的信号; 与所述均衡器模块耦合的数据限幅器，用于基于所述均衡信号产生输出信号; 以及与均衡器模块和数据限幅器耦合的控制单元; 其中所述控制单元或所述均衡器模块在所述均衡器模块进入功率节省模式之前保持均衡器模块的至少一个信号均衡参数，并且所述均衡器模块在所述通信设备接收到预定控制时加载所述至少一个信号均衡参数以进行操作 信号。

公开(公告)号：US20080244506A1

公开(公告)日：2008-10-02

申请号：US12135502

申请日：2008-06-09

申请人： Earl A. Killian ,  Richardo E. Gonzalez ,  Ashish B. Dixit ,  Monica Lam ,  Walter D. Lichtenstein ,  Christopher Rowen ,  John C. Ruttenberg ,  Robert P. Wilson ,  Albert Ren-Ru Wang ,  Dror Eliezer Maydan

发明人： Earl A. Killian ,  Richardo E. Gonzalez ,  Ashish B. Dixit ,  Monica Lam ,  Walter D. Lichtenstein ,  Christopher Rowen ,  John C. Ruttenberg ,  Robert P. Wilson ,  Albert Ren-Ru Wang ,  Dror Eliezer Maydan

IPC分类号： G06F9/44

CPC分类号： G06F17/5045 ,  G06F8/20 ,  G06F8/41 ,  G06F8/53 ,  G06F2217/04 ,  G06F2217/68

摘要： An automated processor design tool uses a description of customized processor instruction set extensions in a standardized language to develop a configurable definition of a target instruction set, a Hardware Description Language description of circuitry necessary to implement the instruction set, and development tools such as a compiler, assembler, debugger and simulator which can be used to develop applications for the processor and to verify it. Implementation of the processor circuitry can be optimized for various criteria such as area, power consumption, speed and the like. Once a processor configuration is developed, it can be tested and inputs to the system modified to iteratively optimize the processor implementation. By providing a constrained domain of extensions and optimizations, the process can be automated to a high degree, thereby facilitating fast and reliable development.

摘要翻译： 自动处理器设计工具使用标准化语言对定制的处理器指令集扩展进行描述，以开发目标指令集的可配置定义，实现指令集所需的电路的硬件描述语言描述，以及开发工具，如编译器 ，汇编器，调试器和模拟器，可用于开发处理器的应用程序并进行验证。 处理器电路的实现可针对诸如面积，功耗，速度等的各种标准进行优化。 一旦开发了处理器配置，就可以对其进行测试，并修改系统的输入以迭代地优化处理器实现。 通过提供扩展和优化的限制域，该过程可以高度自动化，从而促进快速可靠的开发。

公开(公告)号：US07098126B2

公开(公告)日：2006-08-29

申请号：US10052989

申请日：2001-11-09

申请人： Han-Kun Hsieh ,  Shing-Ru Wang ,  I-Chung Tung

发明人： Han-Kun Hsieh ,  Shing-Ru Wang ,  I-Chung Tung

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/0094 ,  H05K3/3473 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of fabricating electroplate solder on an organic circuit board for forming flip chip joints and board to board solder joints is disclosed. In the method, there is initially provided an organic circuit board including a surface bearing electrical circuitry that includes at least one contact pad. A solder mask layer that is placed on the board surface and patterned to expose the pad. Subsequently, a metal seed layer is deposited by physical vapor deposition, chemical vapor deposition, electroless plating with the use of catalytic copper, or electroplating with the use of catalytic copper, over the board surface. A resist layer with at least an opening located at the pad is formed over the metal seed layer. A solder material is then formed in the opening by eletroplating. Finally, the resist and the metal seed layer beneath the resist are removed.

公开(公告)号：US06864554B2

公开(公告)日：2005-03-08

申请号：US10336791

申请日：2003-01-06

申请人： Ming-Der Lin ,  Kwang-Ru Wang

发明人： Ming-Der Lin ,  Kwang-Ru Wang

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L31/0203

CPC分类号： H01L33/486 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.

摘要翻译： 公开了一种光电子器件。 该光电子器件包括透明导电衬底，光电子元件和基底。 透明导电性基板包括透明板，形成在透明板上的透明电极膜和形成在透明板上的绝缘部。 绝缘部将透明电极膜分割为不相互导电的第一透明电极膜和第二透明电极膜。 包含正电极和负电极的光电子元件设置在透明导电衬底上并分别与第一透明电极膜和第二透明电极膜电连接。 基部形成有开口，该开口在开口的底部具有反射表面，并且光电子元件以悬挂或与开口底部连接的方式保持在开口中。

公开(公告)号：US20050029110A1

公开(公告)日：2005-02-10

申请号：US10845276

申请日：2004-05-12

申请人： Sao-Hsia Tang ,  Shing-Ru Wang

发明人： Sao-Hsia Tang ,  Shing-Ru Wang

IPC分类号： C25D5/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： C25D5/022 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4647 ,  H05K2203/0574 ,  H05K2203/0733

摘要： A circuit board and a fabrication method thereof. Providing the insulating layer with a first conductive layer formed thereon; wherein the insulating layer was formed on a core substrate with at least one patterned circuit layer thereon. A first resist layer is applied on a first conductive layer, forming first openings to expose the first conductive layer. A first patterned circuit layer, including conductive pads and traces, is formed in the first openings. A second resist layer is applied to cover the traces, and a conductive post is formed on each conductive pad. The first and second resist layers and the first conductive layer underneath the first resist layer are removed. A dielectric material layer is formed on the insulating layer with first patterned circuit layer, forming second openings to expose the conductive posts. A second conductive layer is formed on the dielectric material layer and in the second openings. A third resist layer is applied on the second conductive layer, forming third openings of the third resist layer to expose the second conductive layer. A second patterned circuit layer is formed in the second and third openings.

摘要翻译： 电路板及其制造方法。 为绝缘层提供形成在其上的第一导电层; 其中所述绝缘层在其上具有至少一个图案化电路层的芯基板上形成。 将第一抗蚀剂层施加在第一导电层上，形成第一开口以暴露第一导电层。 包括导电焊盘和迹线的第一图案化电路层形成在第一开口中。 施加第二抗蚀剂层以覆盖迹线，并且在每个导电焊盘上形成导电柱。 第一和第二抗蚀剂层和第一抗蚀剂层下面的第一导电层被去除。 在具有第一图案化电路层的绝缘层上形成介电材料层，形成第二开口以露出导电柱。 在介电材料层和第二开口中形成第二导电层。 在第二导电层上施加第三抗蚀剂层，形成第三抗蚀剂层的第三开口以暴露第二导电层。 第二图案化电路层形成在第二和第三开口中。

公开(公告)号：US06716654B2

公开(公告)日：2004-04-06

申请号：US10095003

申请日：2002-03-12

申请人： Jung-Kuei Hsu ,  Hsueh-Chih Yu ,  Chia-Liang Hsu ,  Hung-Yuan Lu ,  Yen-Hu Chu ,  Chui-Chuan Chang ,  Kwang-Ru Wang ,  Chang-Da Tsai ,  San Bao Lin ,  Yung-Chiang Hwang ,  Ming-Der Lin

发明人： Jung-Kuei Hsu ,  Hsueh-Chih Yu ,  Chia-Liang Hsu ,  Hung-Yuan Lu ,  Yen-Hu Chu ,  Chui-Chuan Chang ,  Kwang-Ru Wang ,  Chang-Da Tsai ,  San Bao Lin ,  Yung-Chiang Hwang ,  Ming-Der Lin

IPC分类号： H01L2100

CPC分类号： H01L33/0079 ,  H01L21/42 ,  H01L33/14 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405

摘要： The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.

摘要翻译： 本发明公开了一种具有增强的亮度的发光二极管及其制造方法。 发光二极管包括：外延LED结构，其具有在发光有源层内部具有多个间隔物的至少一个发光有源层; 至少一个导电接触，形成在底表面上，其中在发光有源层内部没有形成间隔物; 形成在间隔物中的透明材料层; 在所述透明材料层和永久性基板之间形成的粘附层; 形成在永久性基板的底面上的底部电极; 以及形成在外延LED结构的顶表面上的相对电极。

公开(公告)号：US07906850B2

公开(公告)日：2011-03-15

申请号：US11588911

申请日：2006-10-27

申请人： Shing-Ru Wang ,  Hsien-Shou Wang ,  Shih-Ping Hsu

发明人： Shing-Ru Wang ,  Hsien-Shou Wang ,  Shih-Ping Hsu

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517

摘要： A circuit board structure and a method for fabricating the same are proposed. The structure includes an insulating protective layer having a plurality of openings in which conductive vias are formed, a patterned circuit layer formed on the surface of the insulating protective layer and electrically connected to the conductive vias in the openings of the insulating protective layer, and a dielectric layer formed on the insulating protective layer and on the surface of the patterned circuit layer, wherein a plurality of openings are formed in the dielectric layer to thereby expose parts of the patterned circuit layer. Accordingly, the present invention reduces the thickness of a circuit board, which reduces package size, improves product performance, and conforms to the developmental trend toward smaller electronic devices.

摘要翻译： 提出了一种电路板结构及其制造方法。 该结构包括具有多个开口的绝缘保护层，其中形成导电通孔;形成在绝缘保护层的表面上并电连接到绝缘保护层的开口中的导电通孔的图案化电路层，以及 电介质层，其形成在绝缘保护层上和图案化电路层的表面上，其中在电介质层中形成多个开口，从而露出图案化电路层的部分。 因此，本发明可以减小电路板的厚度，减小封装尺寸，提高产品性能，并符合朝向较小型电子器件的发展趋势。

公开(公告)号：US06737679B2

公开(公告)日：2004-05-18

申请号：US10336820

申请日：2003-01-06

申请人： Ming-Der Lin ,  Kwang-Ru Wang

发明人： Ming-Der Lin ,  Kwang-Ru Wang

IPC分类号： H01L2715

CPC分类号： H01L33/62 ,  H01L31/022466 ,  H01L33/42 ,  H01L33/48 ,  H01L2224/48091 ,  H01L2924/12041 ,  Y10S257/918 ,  H01L2924/00014

摘要： An optoelectronic unit and a transparent conductive substrate of the same are disclosed. The transparent conductive substrate comprises a transparent plate, a transparent electrode film, an insulation part, and a bounding pad, wherein the transparent electrode film and the insulation part are formed on the transparent plate, the insulation part divides the transparent electrode film into a first transparent electrode film area and a second transparent electrode film area that non-conduct each other, and the bounding pad is formed on the second transparent electrode film area. The optoelectronic unit comprises the aforementioned transparent conductive substrate, an optoelectronic element, and a conductive wire, wherein one electrode of the optoelectronic element is electrically connected to the aforementioned first transparent electrode film area, and the other electrode of the optoelectronic element is electrically connected to the aforementioned bounding pad by the conductive wire.

摘要翻译： 公开了一种光电单元及其透明导电基板。 所述透明导电性基板包括透明板，透明电极膜，绝缘部和限界垫，所述透明电极膜和所述绝缘部形成在所述透明板上，所述绝缘部将所述透明电极膜分割为第一 透明电极膜区域和不相互导电的第二透明电极膜区域，并且在第二透明电极膜区域上形成界限垫。 光电单元包括上述透明导电衬底，光电子元件和导线，其中光电元件的一个电极电连接到上述第一透明电极膜区域，并且光电子元件的另一个电极电连接到 通过导线将前述的边界焊盘。