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1.Electronic devices having metallurgies containing copper-semiconductor compounds 失效
标题翻译: 具有包含铜半导体化合物的冶金的电子器件公开(公告)号:US5855993A
公开(公告)日:1999-01-05
申请号:US200811
申请日:1994-02-22
申请人: Michael John Brady , Curtis Edward Farrell , Sung Kwon Kang , Jeffrey Robert Marino , Donald Joseph Mikalsen , Paul Andrew Moskowitz , Eugene John O'Sullivan , Terrence Robert O'Toole , Sampath Purushothaman , Sheldon Cole Rieley , George Frederick Walker
发明人: Michael John Brady , Curtis Edward Farrell , Sung Kwon Kang , Jeffrey Robert Marino , Donald Joseph Mikalsen , Paul Andrew Moskowitz , Eugene John O'Sullivan , Terrence Robert O'Toole , Sampath Purushothaman , Sheldon Cole Rieley , George Frederick Walker
IPC分类号: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532 , B32B3/00 , B23K35/14 , H01L23/48
CPC分类号: H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/05 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L24/03 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917
摘要: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
摘要翻译: 在电子设备中的导体的表面使用含锗和锗的材料。 焊料可无焊接,电线可以与这些表面引线接合。 这些材料用作用于封装集成电路芯片的引线框架的表面涂层。 这些材料可以贴花地转移到导体表面上,或者无电解或电解地放置在其上。