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公开(公告)号：US08101865B2
公开(公告)日：2012-01-24
申请号：US12641430
申请日：2009-12-18
Applicant: Tomoyuki Ikeda
Inventor： Tomoyuki Ikeda
IPC: H05K1/03
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
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公开(公告)号：US07786390B2
公开(公告)日：2010-08-31
申请号：US12115286
申请日：2008-05-05
Applicant: Tomoyuki Ikeda
Inventor： Tomoyuki Ikeda
IPC: H05K1/03
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。
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公开(公告)号：US20100155112A1
公开(公告)日：2010-06-24
申请号：US12641430
申请日：2009-12-18
Applicant: Tomoyuki IKEDA
Inventor： Tomoyuki IKEDA
IPC: H05K1/03
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
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公开(公告)号：US20080257591A1
公开(公告)日：2008-10-23
申请号：US12115286
申请日：2008-05-05
Applicant: Tomoyuki IKEDA
Inventor： Tomoyuki IKEDA
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。
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公开(公告)号：US20080107863A1
公开(公告)日：2008-05-08
申请号：US11935207
申请日：2007-11-05
Applicant: Tomoyuki Ikeda , Naoaki Fujii , Seiji Izawa
Inventor： Tomoyuki Ikeda , Naoaki Fujii , Seiji Izawa
CPC classification number: H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H05K1/112 , H05K1/115 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/096 , H05K2201/09781 , H05K2201/10674 , H05K2203/0733 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A multilayered printed wiring board includes a multilayered core substrate having multiple insulation layers and one or more stacked via structure formed through the multiple insulation layers, and a build-up structure formed over the multilayered core substrate and including multiple interlaminar insulation layers and multiple conductor circuits. The stacked via structure has multiple vias formed in the multiple insulation layers, respectively. Each of the interlaminar insulation layers includes a resin material without a core material. The multiple insulation layers in the multilayered core substrate have three or more insulation layers and each of the insulation layers in the multilayered core substrate includes a core material impregnated with a resin.
Abstract translation: 多层印刷电路板包括具有多个绝缘层的多层芯基板和通过多个绝缘层形成的一个或多个堆叠的通孔结构，以及形成在多层芯基板上的堆积结构，并且包括多个层间绝缘层和多个导体电路 。 堆叠的通孔结构分别在多个绝缘层中形成多个通孔。 每个层间绝缘层包括没有芯材的树脂材料。 多层核心基板中的多个绝缘层具有三层以上的绝缘层，多层核心基板中的各绝缘层包含浸渍有树脂的芯材。
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Patent Agency Ranking
公开(公告)号：US08966750B2
公开(公告)日：2015-03-03
申请号：US13167305
申请日：2011-06-23
Applicant: Tomoyuki Ikeda , Naoaki Fujii , Seiji Izawa
Inventor： Tomoyuki Ikeda , Naoaki Fujii , Seiji Izawa
IPC: H01K3/10 , H01L21/48 , H01L23/498 , H05K3/46 , H05K1/11
CPC classification number: H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H05K1/112 , H05K1/115 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/096 , H05K2201/09781 , H05K2201/10674 , H05K2203/0733 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.
Abstract translation: 一种制造多层印刷布线板的方法，包括形成包括绝缘层和通过绝缘层形成的一个或多个堆叠的通孔结构的多层芯基板，分别形成在绝缘层中的通孔的堆叠通孔结构分别包括在绝缘层中的绝缘层 所述多层芯基板包括至少三个绝缘层，所述多层芯基板中的每个所述绝缘层包括浸渍有树脂的芯材，并且在所述多层芯基板上形成堆积结构，并且包括层间绝缘层和导体电路， 每个层间绝缘层包括没有芯材的树脂材料。
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公开(公告)号：US08324506B2
公开(公告)日：2012-12-04
申请号：US12641498
申请日：2009-12-18
Applicant: Tomoyuki Ikeda
Inventor： Tomoyuki Ikeda
IPC: H05K1/03
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.
Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。
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公开(公告)号：US20120012464A1
公开(公告)日：2012-01-19
申请号：US13242166
申请日：2011-09-23
Applicant: Tomoyuki IKEDA
Inventor： Tomoyuki IKEDA
IPC: C25D5/02
CPC classification number: H05K3/0026 , C25D5/02 , H05K1/119 , H05K3/0032 , H05K3/0094 , H05K3/422 , H05K3/423 , H05K3/427 , H05K2201/09827 , H05K2201/09836 , H05K2201/09854 , H05K2203/1572 , Y10T29/49124 , Y10T29/49126
Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.
Abstract translation: 一种制造印刷电路板的方法，包括：提供具有第一和第二表面的绝缘树脂基板，在第一表面上照射激光，使得形成在第一表面上具有开口并向内逐渐变细的第一开口部分，在第二表面上照射激光 形成第二开口部，该第二开口部在第二面上形成有向内侧逐渐变细并且与第一开口部连通的第二开口部，形成有具有第一开口部和第二开口部的贯通孔，在内部形成无电解电镀膜 并且在所述化学镀膜上形成电解镀膜，使得在所述贯通孔中形成贯通孔导体结构。 第一部分的开口具有相对于第二开口部分的开口偏心的重心轴线。
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公开(公告)号：US08030579B2
公开(公告)日：2011-10-04
申请号：US12099957
申请日：2008-04-09
Applicant: Yukihiko Toyoda , Yoichiro Kawamura , Tomoyuki Ikeda
Inventor： Yukihiko Toyoda , Yoichiro Kawamura , Tomoyuki Ikeda
CPC classification number: H05K1/115 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K1/0271 , H05K1/113 , H05K1/116 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K3/4688 , H05K2201/0133 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , H05K2201/09454 , H05K2201/09536 , H05K2201/09563 , H05K2201/096 , H05K2201/09627 , H05K2201/09745 , H01L2924/00
Abstract: An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the vicinity of via-holes. The present invention is a multilayered printed circuit board comprising: a conductor circuit and an interlaminar resin insulating layer serially formed on a substrate in alternate fashion and in repetition, wherein a connection of the conductor circuits through the interlaminar resin insulating layers is performed by a via-hole, wherein via-holes in different level layers among the via-holes are formed so as to form a stack-via structure, and wherein at least one of the land diameters of the above-mentioned via-holes in different level layers having the stack via structure is different from the land diameters of other via-holes.
Abstract translation: 本发明的目的是提供一种具有导体电路的布线距离短的多层印刷电路板，可广泛选择导体电路的设计，并且由于在层间树脂绝缘层中几乎不发生破裂 通孔附近。 本发明是一种多层印刷电路板，包括：导体电路和层间树脂绝缘层，其以交替的方式和重复地串联形成在基板上，其中通过层间树脂绝缘层的导体电路的连接通过通孔 孔，其中形成通孔中的不同级别的通孔，以形成堆叠通孔结构，并且其中不同层级中的上述通孔的平台直径中的至少一个具有 堆叠通孔结构不同于其它通孔的焊盘直径。
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公开(公告)号：US07905014B2
公开(公告)日：2011-03-15
申请号：US11832378
申请日：2007-08-01
Applicant: Tomoyuki Ikeda
Inventor： Tomoyuki Ikeda
IPC: H01K3/10
CPC classification number: H01L23/50 , B32B3/10 , B32B7/02 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/3011 , H05K1/115 , H05K3/4608 , H05K3/4641 , H05K2201/09509 , H05K2201/09518 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42a of a power source layer 42, second via hole conductors 52 extending from the outer surface of a second insulating layer 26 to the conductive portions 42a of the power source layer 42, tapered third via hole conductors 53 extending from the outer surface of the second insulating layer 26 to conductive portions 40a of a ground layer 40, and fourth via hole conductors 54 extending from the outer surface of a center insulating layer 22 to the conductive portions 40a of the ground layer 40. The first via hole conductors 51 are tapered, and thus the interval distance to the adjacent first via hole conductor 51 is shorter than straight-shaped first via hole conductors, and thus the pitch of the first via hole conductor 51 at the positive pole side and the fourth via hole conductor 54 at the negative pole side can be sufficiently reduced. This point is applicable to the third via hole conductors 53.
Abstract translation: 多层芯板10包括从第一绝缘层24的外表面延伸到电源层42的导电部分42a的锥形第一通孔导体51，从第二绝缘层26的外表面延伸的第二通孔导体52 到电源层42的导电部分42a，从第二绝缘层26的外表面延伸到接地层40的导电部分40a的锥形第三通孔导体53，以及从外表面延伸的第四通孔导体54 第一通孔导体51是锥形的，因此与相邻的第一通路孔导体51的间隔距离比直形的第一通孔导体短， 因此正极侧的第一通孔导体51的间距和负极侧的第四通孔导体54的间距能够充分地再次 屈服 这点适用于第三通孔导体53。
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