公开(公告)号：US08604345B2

公开(公告)日：2013-12-10

申请号：US13354446

申请日：2012-01-20

申请人： Seok Hwan Ahn ,  Young Gwan Ko

发明人： Seok Hwan Ahn ,  Young Gwan Ko

IPC分类号： H05K1/00

CPC分类号： H05K3/107 ,  H05K3/0032 ,  H05K3/045 ,  H05K3/426 ,  H05K2201/0376 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1461

摘要： A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler.

摘要翻译： 具有掩埋在通孔中的电镀图案的印刷电路板。 印刷电路板具有：包含电绝缘树脂的绝缘基板; 穿过所述绝缘基板的通孔; 通孔，其包括形成在所述通孔的内壁上的金属层和填充在所述通孔中的填充物; 电路层，其包括埋在所述绝缘基板中并传输电信号的电路图案; 以及埋在填料末端的电镀图案。

公开(公告)号：US20120077333A1

公开(公告)日：2012-03-29

申请号：US13310319

申请日：2011-12-02

申请人： Young Gwan KO ,  Ryoichi WATANABE ,  Sang Soo LEE

发明人： Young Gwan KO ,  Ryoichi WATANABE ,  Sang Soo LEE

IPC分类号： H01L21/78

CPC分类号： H01L21/486 ,  H01L21/32115 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/045 ,  H05K3/06 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

摘要翻译： 这里公开了沟槽衬底及其制造方法。 沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层， 通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。 由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

公开(公告)号：US20100264549A1

公开(公告)日：2010-10-21

申请号：US12463945

申请日：2009-05-11

申请人： Young Gwan KO ,  Ryoichi Watanabe ,  Sang Soo Lee

发明人： Young Gwan KO ,  Ryoichi Watanabe ,  Sang Soo Lee

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/768

CPC分类号： H01L21/486 ,  H01L21/32115 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/045 ,  H05K3/06 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

摘要翻译： 这里公开了沟槽衬底及其制造方法。 沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层， 通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。 由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

公开(公告)号：US20100132998A1

公开(公告)日：2010-06-03

申请号：US12379760

申请日：2009-02-27

申请人： Dong Gyu Lee ,  Jin Won Choi ,  Young Gwan Ko ,  Seon Jae Mun ,  Tae Joon Chung

发明人： Dong Gyu Lee ,  Jin Won Choi ,  Young Gwan Ko ,  Seon Jae Mun ,  Tae Joon Chung

IPC分类号： H05K1/11 ,  B05D5/12

CPC分类号： H05K3/3484 ,  H01L23/49816 ,  H01L23/49894 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post.

摘要翻译： 本发明涉及一种具有金属柱的基板及其制造方法，其中形成在金属柱上的圆形焊料凸块部件通过经受两次回流工艺而沿着金属柱的侧表面熔化并向下流动 ，从而形成用于防止金属柱的氧化和腐蚀的焊料凸块膜。

公开(公告)号：US08883647B2

公开(公告)日：2014-11-11

申请号：US13310319

申请日：2011-12-02

申请人： Young Gwan Ko ,  Ryoichi Watanabe ,  Sang Soo Lee

发明人： Young Gwan Ko ,  Ryoichi Watanabe ,  Sang Soo Lee

IPC分类号： H01L21/311 ,  H01L23/498 ,  H01L21/48 ,  H05K3/46 ,  H05K3/04 ,  H05K3/06 ,  H01L21/321

CPC分类号： H01L21/486 ,  H01L21/32115 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/045 ,  H05K3/06 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

摘要翻译： 这里公开了沟槽衬底及其制造方法。 沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层， 通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。 由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

公开(公告)号：US20120267157A1

公开(公告)日：2012-10-25

申请号：US13541619

申请日：2012-07-03

申请人： Young Gwan KO

发明人： Young Gwan KO

IPC分类号： H05K1/11

CPC分类号： H05K3/4682 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0097 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2203/0108 ,  H05K2203/0733 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.

摘要翻译： 公开了一种印刷电路板，其包括具有嵌入其一个表面中的电路图案的绝缘构件，形成在所述绝缘构件的一个表面上并包括积聚绝缘层和形成在所述绝缘构件中的电路层的积聚层 并且具有连接到电路图案的通孔，以及形成在积聚层上的阻焊层。 还提供了制造印刷电路板的方法。 印刷电路板使用积聚工艺制造，并且其最外面的电路层被形成为具有使用压印工艺的嵌入式结构，从而最小化电路层的分离并减少了交货时间和制造成本。

公开(公告)号：US08234781B2

公开(公告)日：2012-08-07

申请号：US12559443

申请日：2009-09-14

申请人： Young Gwan Ko

发明人： Young Gwan Ko

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H05K3/4682 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0097 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2203/0108 ,  H05K2203/0733 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.

摘要翻译： 公开了一种印刷电路板，其包括具有嵌入其一个表面中的电路图案的绝缘构件，形成在所述绝缘构件的一个表面上并包括积聚绝缘层和形成在所述绝缘构件中的电路层的积聚层 并且具有连接到电路图案的通孔，以及形成在积聚层上的阻焊层。 还提供了制造印刷电路板的方法。 印刷电路板使用积聚工艺制造，并且其最外面的电路层被形成为具有使用压印工艺的嵌入式结构，从而最小化电路层的分离并减少了交货时间和制造成本。

公开(公告)号：US08196293B2

公开(公告)日：2012-06-12

申请号：US12634617

申请日：2009-12-09

申请人： Young Gwan Ko

发明人： Young Gwan Ko

IPC分类号： H05K3/36

CPC分类号： H05K3/462 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/09536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer.

摘要翻译： 公开了一种印刷电路板，其包括其两侧具有芯电路层的芯基板，形成在芯基板的一侧上的第一累积层，形成在芯基板的另一侧上的第二累积层， 以及分别形成在第一和第二堆积层上的第一和第二保护层，其中第一堆积层包括作为通过沟槽技术形成的最外层电路层的沟槽电路层，沟槽电路层嵌入 第一保护层和第二堆积层的最外层电路层嵌入第二堆积层的最外绝缘层中，以及制造印刷电路板的方法。 由于通过沟槽技术形成最外层电路层，难以将最外层电路层与最外层绝缘层分开。

公开(公告)号：US08072052B2

公开(公告)日：2011-12-06

申请号：US12463945

申请日：2009-05-11

申请人： Young Gwan Ko ,  Ryoichi Watanabe ,  Sang Soo Lee

发明人： Young Gwan Ko ,  Ryoichi Watanabe ,  Sang Soo Lee

IPC分类号： H01L23/495

CPC分类号： H01L21/486 ,  H01L21/32115 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/045 ,  H05K3/06 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

摘要翻译： 这里公开了沟槽衬底及其制造方法。 沟槽基板包括基底基板，形成在基底基板的一侧或两侧上的绝缘层，并且包括形成在电路区域中的沟槽和位于沟槽基板的周边边缘的虚设区域，以及电路层， 通过电镀工艺的电路区域的沟槽，并且包括电路图案和通孔。 由于在虚拟区域和切割区域中形成沟槽，因此在电镀工艺中在绝缘层上形成的镀层的厚度偏差得到改善。

公开(公告)号：US06468498B1

公开(公告)日：2002-10-22

申请号：US09823576

申请日：2001-05-25

申请人： Sang-Goo Lee ,  Min-Chan Kim ,  Gil-Seon Kang ,  Wha-Young Lee ,  In-Kyu Song ,  Young-Gwan Ko

发明人： Sang-Goo Lee ,  Min-Chan Kim ,  Gil-Seon Kang ,  Wha-Young Lee ,  In-Kyu Song ,  Young-Gwan Ko

IPC分类号： C01G2102

CPC分类号： C30B11/00 ,  B01J23/002 ,  B01J23/14 ,  B01J23/628 ,  B01J23/6484 ,  B01J23/8966 ,  B01J23/898 ,  B01J35/004 ,  B01J2523/00 ,  C01B3/042 ,  C01B13/0207 ,  C01G23/003 ,  C01G53/006 ,  C01G55/002 ,  C01P2002/84 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C01P2006/80 ,  C30B9/00 ,  C30B29/30 ,  C30B29/32 ,  Y02E60/364 ,  B01J2523/11 ,  B01J2523/22 ,  B01J2523/44 ,  B01J2523/47 ,  B01J2523/56 ,  B01J2523/57 ,  B01J2523/828 ,  B01J2523/847 ,  B01J2523/18 ,  B01J2523/27

摘要： A composite metal material of formula (I) are stable and not deteriorated for a long time and have excellent activities in photolyzing water with visible light: x(A)y(B)z(C)-p(P)n(N)  (I) wherein, (A) is Pb(Mg1/3Nb2/3)O3 or Pb(Zn1/3Nb2/3)O3, (B) is PbTiO3, (C) is LiTaO3, (P) is a metal selected from the group consisting of Pt, Au, Ag, Pd and Rh, (N) is an oxide of a metal selected from the group consisting of Ni, Co, Fe, Sr, Sc, Ru, Cu and Cd, x is a number in the range of 0.65 to 0.98, y is a number in the range of 0.01 to 0.34, z is a number in the range of 0.01 to 0.1, and p and n are each independently a number in the range of 0.01 to 5.

摘要翻译： 式（I）的复合金属材料长期稳定且不劣化，并且在可见光的光解水中具有优异的活性：其中，（A）为Pb（Mg1 / 3Nb2 / 3）O3或Pb（Zn1 / 3Nb2 / 3）O 3，（B）是PbTiO 3，（C）是LiTaO 3，（P）是选自Pt，Au，Ag，Pd和Rh的金属，（N）是选自 由Ni，Co，Fe，Sr，Sc，Ru，Cu和Cd组成的组，x为0.65〜0.98的数，y为0.01〜0.34的数，z为 范围为0.01〜0.1，p和n各自独立地为0.01〜5的数。