公开(公告)号：US5523137A

公开(公告)日：1996-06-04

申请号：US216432

申请日：1994-03-23

申请人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Tadahiro Ohishi ,  Hitoshi Narushima

发明人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Tadahiro Ohishi ,  Hitoshi Narushima

IPC分类号： C08L63/00 ,  C08L77/00 ,  C09J7/02 ,  C09J7/04 ,  C09J163/00 ,  C09J177/00 ,  C09J177/02 ,  C09J177/06 ,  C09J179/08 ,  C09J183/06 ,  H01L21/60 ,  H01L23/14 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC分类号： H01L24/86 ,  C09J163/00 ,  C09J177/00 ,  C09J177/02 ,  C09J177/06 ,  C09J179/085 ,  C09J183/06 ,  C09J7/0242 ,  C09J7/0292 ,  C09J7/043 ,  H01L23/145 ,  H05K3/386 ,  C08L63/00 ,  C08L77/00 ,  C09J2201/122 ,  C09J2201/61 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0355 ,  Y10T428/1471 ,  Y10T428/2804 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725

摘要： An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

摘要翻译： 一种用于具有有机绝缘膜的TAB胶带，在有机绝缘膜上形成的粘合剂层和形成在粘合剂层上的保护层，粘合剂层是包含至少具有胺值的聚酰胺树脂的层中的任一个 3和环氧树脂，含有聚酰胺树脂和粉末状无机填料的层，在其主链中含有具有硅氧烷结构的环氧树脂的层和含有至少一种马来酰亚胺化合物的层。

公开(公告)号：US5945188A

公开(公告)日：1999-08-31

申请号：US967901

申请日：1997-11-12

申请人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Tadahiro Ohishi ,  Hitoshi Narushima

发明人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Tadahiro Ohishi ,  Hitoshi Narushima

IPC分类号： C08L63/00 ,  C08L77/00 ,  C09J7/02 ,  C09J7/04 ,  C09J163/00 ,  C09J177/00 ,  C09J177/02 ,  C09J177/06 ,  C09J179/08 ,  C09J183/06 ,  H01L21/60 ,  H01L23/14 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38 ,  B32B27/34

CPC分类号： H01L24/86 ,  C09J163/00 ,  C09J177/00 ,  C09J177/02 ,  C09J177/06 ,  C09J179/085 ,  C09J183/06 ,  C09J7/0242 ,  C09J7/0292 ,  C09J7/043 ,  H01L23/145 ,  H05K3/386 ,  C08L63/00 ,  C08L77/00 ,  C09J2201/122 ,  C09J2201/61 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0355 ,  Y10T428/1471 ,  Y10T428/2804 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725

摘要： An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

摘要翻译： 一种用于具有有机绝缘膜的TAB胶带，在有机绝缘膜上形成的粘合剂层和形成在粘合剂层上的保护层，粘合剂层是包含至少具有胺值的聚酰胺树脂的层中的任一个 3和环氧树脂，含有聚酰胺树脂和粉末状无机填料的层，在其主链中含有具有硅氧烷结构的环氧树脂的层和含有至少一种马来酰亚胺化合物的层。

公开(公告)号：US5786055A

公开(公告)日：1998-07-28

申请号：US382157

申请日：1995-02-01

申请人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Shouji Aoki ,  Tadahiro Oishi ,  Hitoshi Narushima

发明人： Akinori Sei ,  Yoshikazu Tsukamoto ,  Takashi Shiozawa ,  Shouji Aoki ,  Tadahiro Oishi ,  Hitoshi Narushima

IPC分类号： C08G69/48 ,  C09J177/00 ,  H01L21/58 ,  A21H19/00 ,  C09J7/02

CPC分类号： H01L24/83 ,  C08G69/48 ,  C09J177/00 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/149 ,  Y10T428/2804 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/31725

摘要： An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.

摘要翻译： 一种半导体器件用粘合剂，其包含（a）胺值为20〜60，重均分子量为1,000〜5,000的聚酰胺树脂，（b）重均分子量为2,000以下的酚类化合物，具有 含有至少2个羟甲基的骨架。

公开(公告)号：US5290614A

公开(公告)日：1994-03-01

申请号：US761939

申请日：1991-09-20

申请人： Hitoshi Narushima ,  Yoshikazu Tsukamoto ,  Tadahiro Oishi ,  Atsushi Koshimura

发明人： Hitoshi Narushima ,  Yoshikazu Tsukamoto ,  Tadahiro Oishi ,  Atsushi Koshimura

IPC分类号： H01L23/14 ,  C09J7/02

CPC分类号： H01L23/145 ,  H01L2924/0002 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/2826 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2887 ,  Y10T428/2896

摘要： This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.

摘要翻译： PCT No.PCT / JP91 / 00066 Sec。 371日期1991年9月20日 102（e）1991年9月20日PCT 1991年1月23日PCT PCT。 公开号WO91 / 11821 日本1991年8月8日。本发明涉及一种胶带自动接合用粘合带（TAB）。 根据本发明的用于TAB的粘合带的第一类型具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于至少包含甲阶酚醛树脂型酚醛树脂和聚酰胺树脂，其中在粘合剂层中含有2〜35％的甲阶酚醛树脂型树脂。 根据本发明的第二种用于TAB的粘合带具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于具有至少两个层：一个至少包含聚酰胺树脂并层压在所述有机绝缘膜的一个表面上; 其它至少包含聚酰胺树脂和甲阶酚醛树脂，并且层压在所述保护膜的其他表面上。

公开(公告)号：US5298304A

公开(公告)日：1994-03-29

申请号：US980230

申请日：1992-11-23

申请人： Hitoshi Narushima ,  Yoshikazu Tsukamoto ,  Tadahiro Oishi ,  Atsushi Koshimura

发明人： Hitoshi Narushima ,  Yoshikazu Tsukamoto ,  Tadahiro Oishi ,  Atsushi Koshimura

IPC分类号： H01L23/14 ,  C09J7/02

CPC分类号： H01L23/145 ,  H01L2924/0002 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/2826 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2887 ,  Y10T428/2896

摘要： This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.

摘要翻译： 本发明涉及一种胶带自动接合用粘合带（TAB）。 根据本发明的用于TAB的粘合带的第一类型具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于至少包含甲阶酚醛树脂型酚醛树脂和聚酰胺树脂，其中在粘合剂层中含有2〜35％的甲阶酚醛树脂型树脂。 根据本发明的第二种用于TAB的粘合带具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于具有至少两个层：一个至少包含聚酰胺树脂并层压在所述有机绝缘膜的一个表面上; 其它至少包含聚酰胺树脂和甲阶酚醛树脂，并且层压在所述保护膜的其他表面上。

公开(公告)号：US5342895A

公开(公告)日：1994-08-30

申请号：US11845

申请日：1993-01-28

申请人： Toshio Tagami ,  Yoshio Imai ,  Masaaki Kakimoto ,  Osamu Kiyohara ,  Hitoshi Narushima

发明人： Toshio Tagami ,  Yoshio Imai ,  Masaaki Kakimoto ,  Osamu Kiyohara ,  Hitoshi Narushima

IPC分类号： C08G81/02 ,  C08L77/00

CPC分类号： C08G81/028

摘要： Disclosed is a polyamide/polybutadiene/acrylonitrile block copolymer useful in a wide variety of applications, such as an adhesive film, which comprises a polycondensate comprising a polybutadiene/acrylonitrile copolymer having a carboxyl group at each terminal thereof and a polyamide having an aminoaryl group at each terminal, and which is represented by general formula (I) ##STR1## wherein R is a divalent organic group, Ar is a divalent aromatic group, x, y, z, m and n each: represent mean degree of polymerization and are integers in the ranges of x=3 to 7, y=1 to 4, z=5 to 15, n=1 to 30, and nm=2 to 20, respectively. Also, disclosed is a method of producing the polyamide/polybutadiene based block copolymer by polycondensing an aromatic diamine with an aromatic dicarboxylic acid to form a polyamide having an aminoaryl group at each terminal thereof, and then polycondensing it with a poiybutadiene/acrylonitrile copolymer having a carboxyl group at each terminal thereof, preferably in the presence of an aromatic phosphite and a pyridine derivative.

摘要翻译： 公开了可用于各种应用的聚酰胺/聚丁二烯/丙烯腈嵌段共聚物，例如粘合剂膜，其包含包含其末端具有羧基的聚丁二烯/丙烯腈共聚物和在其末端具有氨基芳基的聚酰胺的缩聚物 其中R为二价有机基团，Ar为二价芳族基团，x，y，z，m和n各自表示平均值，表示通式（I） 聚合度为x = 3〜7，y = 1〜4，z = 5〜15，n = 1〜30，nm = 2〜20的整数。 此外，还公开了通过使芳族二胺与芳族二羧酸缩聚以在其每个末端形成具有氨基芳基的聚酰胺，然后与聚丁二烯/丙烯腈共聚物进行缩聚来制造聚酰胺/聚丁二烯系嵌段共聚物的方法，所述聚丁二烯/ 羧基，优选在芳香族亚磷酸酯和吡啶衍生物的存在下进行。

公开(公告)号：US06426138B1

公开(公告)日：2002-07-30

申请号：US09374257

申请日：1999-08-13

申请人： Hitoshi Narushima ,  Toshihiro Nakajima

发明人： Hitoshi Narushima ,  Toshihiro Nakajima

IPC分类号： C09J702

CPC分类号： H01L24/32 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/128 ,  C09J2421/006 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2483/006 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/0058 ,  H05K3/386 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2887 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/0532 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an adhesive film for electronic parts, for example, an adhesive agent in a tape BGA (Ball Grid Array) or &mgr;-BGA (trade name) package, in which embedding and adhesion to copper patterns on circuit boards are excellent, in which feeding and punching quality in the film state are superior, and which can reduce stress caused by thermal expansion difference between a circuit board and a reinforcing metal board or an IC chip. Adhesive film for electronic parts comprises a resin layer in which the dynamic modulus of elasticity at −30 to 125° C. is from 1 to 30 MPa and adhesive layers are coated on surfaces of the resin layer.

摘要翻译： 本发明提供一种电子部件用粘合膜，例如在电路板上嵌入和附着到铜图案上的胶带BGA（Ball Grid Array）或mu-BGA（商品名）封装中的粘合剂， 其中膜状态的进给和冲压质量优异，并且可以减少电路板和加强金属板或IC芯片之间的热膨胀差引起的应力。 用于电子部件的粘合膜包括在-30至125℃的动态弹性模量为1至30MPa并且粘合剂层涂覆在树脂层的表面上的树脂层。

公开(公告)号：US06329050B1

公开(公告)日：2001-12-11

申请号：US09643743

申请日：2000-08-23

申请人： Ken Yoshioka ,  Hitoshi Narushima ,  Osamu Oka

发明人： Ken Yoshioka ,  Hitoshi Narushima ,  Osamu Oka

IPC分类号： B32B1504

CPC分类号： H01L24/29 ,  C08L63/00 ,  C08L79/08 ,  C09J163/00 ,  C09J179/08 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/386 ,  Y10T428/287 ,  Y10T428/2896 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/05341 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I) structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin, wherein W means a single bond, an alkylene group, —O—, —SO2— or —CO—, Ar1 denotes a divalent aromatic group such as a diphenylmethane group, and Ar2 represents a divalent aromatic group having OH group(s) or COOH groups.

摘要翻译： 本发明提供一种电子部件用粘合剂，其具有耐热性和形成粘合剂层的能力以及低温粘合性的两个粘合剂，以及使用这种粘合剂的电子部件用胶带。 粘合剂作为树脂组分包含彼此在玻璃化转变温度不同至少20℃的两种聚酰亚胺树脂和环氧树脂。 两种聚酰亚胺树脂中的至少一种是具有由下式（I）表示的结构单元和由下式（II）表示的结构单元和由下式（III）表示的结构单元表示的结构单元的反应性聚酰亚胺，另一种是聚酰亚胺 具有由式（I）表示的结构单元和由式（II）表示的结构单元，反应性聚酰亚胺和环氧树脂的含量分别为至少25重量份和10至100重量份， 相对于整个聚酰亚胺树脂100重量份，其中W表示单键，亚烷基，-O - ， - SO 2 - 或-CO-，Ar 1表示二苯基甲烷基等二价芳基，Ar 2表示 具有OH基团或COOH基团的二价芳族基团。

公开(公告)号：US06187874B1

公开(公告)日：2001-02-13

申请号：US09373606

申请日：1999-08-13

申请人： Ken Yoshioka ,  Hitoshi Narushima ,  Osamu Oka

发明人： Ken Yoshioka ,  Hitoshi Narushima ,  Osamu Oka

IPC分类号： C08L7908

CPC分类号： H01L24/29 ,  C08L63/00 ,  C08L79/08 ,  C09J163/00 ,  C09J179/08 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/386 ,  Y10T428/287 ,  Y10T428/2896 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/05341 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I), structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin, wherein W means a single bond, an alkylene group, —O—, —SO2— or —CO—, Ar1 denotes a divalent aromatic group such as a diphenylmethane group, and Ar2 represents a divalent aromatic group having OH group(s) or COOH groups.

摘要翻译： 本发明提供一种电子部件用粘合剂，其具有耐热性和形成粘合剂层的能力以及低温粘合性的两个粘合剂，以及使用这种粘合剂的电子部件用胶带。 粘合剂作为树脂组分包含彼此在玻璃化转变温度不同至少20℃的两种聚酰亚胺树脂和环氧树脂。 两种聚酰亚胺树脂中的至少一种是具有由下式（I）表示的结构单元，由下式（II）表示的结构单元和由下式（III）表示的结构单元）的反应性聚酰亚胺，另一种是 由式（I）表示的结构单元和由式（II）表示的结构单元的聚酰亚胺和反应性聚酰亚胺和环氧树脂的含量分别为至少25重量份和10至100重量份 相对于整个聚酰亚胺树脂100重量份，其中W表示单键，亚烷基，-O - ， - SO 2 - 或-CO-，Ar 1表示二苯基甲烷基等二价芳基，Ar 2表示 具有OH基或COOH基团的二价芳族基团。