公开(公告)号：US08034659B2

公开(公告)日：2011-10-11

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US20100003771A1

公开(公告)日：2010-01-07

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/60 ,  H01L21/301 ,  H01L21/683 ,  C08L63/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US07070670B2

公开(公告)日：2006-07-04

申请号：US10240265

申请日：2001-03-30

申请人： Takeo Tomiyama ,  Teiichi Inada ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Yuuji Hasegawa ,  Masaya Nishiyama ,  Takayuki Matsuzaki ,  Michio Uruno ,  Masao Suzuki ,  Tetsurou Iwakura ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya ,  Keiji Sumiya

发明人： Takeo Tomiyama ,  Teiichi Inada ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Yuuji Hasegawa ,  Masaya Nishiyama ,  Takayuki Matsuzaki ,  Michio Uruno ,  Masao Suzuki ,  Tetsurou Iwakura ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya ,  Keiji Sumiya

IPC分类号： B32B37/00

CPC分类号： H01L21/6835 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T156/1052 ,  Y10T428/24 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

公开(公告)号：US08198176B2

公开(公告)日：2012-06-12

申请号：US12682254

申请日：2008-10-07

申请人： Keiichi Hatakeyama ,  Yuuki Nakamura

发明人： Keiichi Hatakeyama ,  Yuuki Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film.

摘要翻译： 本发明的具有粘合膜的半导体芯片的制造方法包括以下步骤：制备层压体，其中至少包含多个半导体芯片的分割半导体晶片，其通过形成将半导体晶片分离成多个 在半导体晶片的一侧的半导体芯片的厚度小于半导体晶片的半导体芯片，并且通过研磨未形成切口的半导体晶片的另一侧到达切割部分，半导体用粘合膜和切割带 层压时，厚度为1〜15μm，拉伸断裂伸长率小于5％的半导体用粘合膜，断裂伸长率小于最大载荷伸长率的110％ ; 并且通过在层叠体的层压方向上拾取多个半导体芯片来分割半导体用粘合膜，由此制备具有粘合剂膜的半导体芯片。

公开(公告)号：US08119737B2

公开(公告)日：2012-02-21

申请号：US13084773

申请日：2011-04-12

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L33/14 ,  C08L63/02 ,  C08L63/04 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US08071465B2

公开(公告)日：2011-12-06

申请号：US12682256

申请日：2008-10-07

申请人： Keiichi Hatakeyama ,  Yuuki Nakamura

发明人： Keiichi Hatakeyama ,  Yuuki Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10156 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a section, for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film, by expanding the dicing tape; and dividing the adhesive film by picking up the plurality of semiconductor chips.

摘要翻译： 一种用于制造具有粘合膜的半导体芯片的方法，其包括：制备其中半导体晶片，粘合剂膜和切割带依次层叠的层压体，所述粘合剂膜的厚度在1至15的范围内 μm，拉伸断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷伸长率的110％，半导体晶片具有用于将半导体晶片分成多个半导体的部分 通过用激光照射形成的芯片; 通过扩大切割带，将半导体晶片分割成多个半导体芯片而不分割粘合膜; 并且通过拾取多个半导体芯片来分割粘合剂膜。

公开(公告)号：US20110021005A1

公开(公告)日：2011-01-27

申请号：US12900092

申请日：2010-10-07

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： H01L21/78 ,  B32B7/12 ,  B32B27/04

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20120244347A1

公开(公告)日：2012-09-27

申请号：US13420266

申请日：2012-03-14

申请人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

发明人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

IPC分类号： C09J7/02 ,  C09J163/00 ,  C09J179/08 ,  B32B37/02 ,  B32B38/04

CPC分类号： C09J201/00 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B28D5/0082 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： There is an adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip. The method includes preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5%, and the tensile breaking elongation is less than 110% of the elongation at maximum load. The semiconductor wafer is partitioned into multiple semiconductor chips and notches are formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction. The method also includes stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches.

摘要翻译： 在半导体芯片的制造方法中使用半导体用粘接膜。 该方法包括制备具有半导体晶片，半导体用粘合剂膜和切割带的叠层体。 半导体用粘合膜的拉伸断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷下伸长率的110％。 将半导体晶片划分成多个半导体芯片，并且从半导体晶片侧形成切口，使得用于半导体的粘合膜的至少一部分在其厚度方向上保持未切割。 该方法还包括沿着使多个半导体芯片分开的方向伸出切割带，以沿着切口分离半导体用粘合剂膜。

公开(公告)号：US20110057145A1

公开(公告)日：2011-03-10

申请号：US12876562

申请日：2010-09-07

申请人： Tadashi Matsunaga ,  Tsuyoshi Tanaka ,  Keiichi Hatakeyama ,  Takeo Tanaami ,  Hitoshi Wake ,  Tomoyuki Taguchi ,  Takeyuki Mogi

发明人： Tadashi Matsunaga ,  Tsuyoshi Tanaka ,  Keiichi Hatakeyama ,  Takeo Tanaami ,  Hitoshi Wake ,  Tomoyuki Taguchi ,  Takeyuki Mogi

IPC分类号： H01F1/00

CPC分类号： H01F1/42

摘要： There is provided a method for preparing dendrimer-modified magnetic fine particles wherein such particles can be made within a shorter time and more inexpensively than in the above-stated prior art processes and lot-to-lot variations in properties are lessened. The method for preparing dendrimer-fixed magnetic fine particles comprises the steps of providing magnetic particles having a functional group at a surface thereof, providing a dendrimer having a functional group at a base end portion thereof and synthesized to a desired generation and binding the functional group of the magnetic particles and the functional group of the dendrimer directly or indirectly through a crosslinking agent.

摘要翻译： 提供了一种制备树枝状聚合物改性的磁性细颗粒的方法，其中这种颗粒可以在比上述现有技术方法更短的时间和更廉价的情况下制备，并且批次间的性质变化减少。 制备树枝状大分子固定磁性微粒的方法包括以下步骤：在其表面提供具有官能团的磁性颗粒，提供在其基端部分具有官能团的树枝状聚合物，并合成所需的一代并结合官能团 的磁性颗粒和树枝状聚合物的官能团直接或间接地通过交联剂。

公开(公告)号：US20100311227A1

公开(公告)日：2010-12-09

申请号：US12682254

申请日：2008-10-07

申请人： Keiichi Hatakeyama ,  Yuuki Nakamura

发明人： Keiichi Hatakeyama ,  Yuuki Nakamura

IPC分类号： H01L21/78 ,  C09J7/00

CPC分类号： H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film.

摘要翻译： 本发明的具有粘合膜的半导体芯片的制造方法包括以下步骤：制备层压体，其中至少包含多个半导体芯片的分割半导体晶片，其通过形成将半导体晶片分离成多个 在半导体晶片的一侧的半导体芯片的厚度小于半导体晶片的半导体芯片，并且通过研磨未形成切口的半导体晶片的另一侧到达切割部分，半导体用粘合膜和切割带 层压时，厚度为1〜15μm，拉伸断裂伸长率小于5％的半导体用粘合膜，断裂伸长率小于最大载荷伸长率的110％ ; 并且通过在层叠体的层压方向上拾取多个半导体芯片来分割半导体用粘合膜，由此制备具有粘合剂膜的半导体芯片。