公开(公告)号：US20100003771A1

公开(公告)日：2010-01-07

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/60 ,  H01L21/301 ,  H01L21/683 ,  C08L63/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US08034659B2

公开(公告)日：2011-10-11

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US20120101191A1

公开(公告)日：2012-04-26

申请号：US13040079

申请日：2011-03-03

申请人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： C08K3/36 ,  C08L71/12 ,  C08L63/02 ,  B82Y30/00

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

摘要翻译： 用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料 粒径不大于100nm的平均粒度大于100nm的无机填料。

公开(公告)号：US09431314B2

公开(公告)日：2016-08-30

申请号：US13040079

申请日：2011-03-03

申请人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  C08G59/42 ,  C08G59/62

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

摘要翻译： 用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料 粒径不大于100nm的平均粒度大于100nm的无机填料。

公开(公告)号：US20110241228A1

公开(公告)日：2011-10-06

申请号：US13040034

申请日：2011-03-03

申请人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya ENOMOTO ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： H01L23/29 ,  H01L21/56 ,  C08L63/00

CPC分类号： H01L21/563 ,  C08G59/4071 ,  C08G59/42 ,  C08G59/686 ,  C08K5/50 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/8121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512

摘要： An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor device and manufacturing method employing the same.

摘要翻译： 作为必要成分的环氧树脂，酸酐，固化促进剂，助熔剂的半导体底填充用环氧树脂组合物，其中固化促进剂为季鏻盐，以及半导体装置及其制造方法 一样。

公开(公告)号：US07692296B2

公开(公告)日：2010-04-06

申请号：US11085520

申请日：2005-03-22

申请人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

发明人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099

摘要： A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea

摘要翻译： 半导体器件在凸起电极和衬底电极之间具有连接可靠性。 用于电连接金属凸块和互连图案的粘合材料的弹性模量，并且在热固化之后密封LSI芯片的电路表面是Ea; 热固化后的封装基材表面层的绝缘材料的弹性模量为Eb; 如果使用的话，芯材的弹性模量为Ec，在粘接材料的常温或热接触粘合温度下满足以下有理表达式：至少Ea

公开(公告)号：US06223429B1

公开(公告)日：2001-05-01

申请号：US08981509

申请日：1998-07-30

申请人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

发明人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29384 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

摘要翻译： 为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括 面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电 粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

公开(公告)号：US20050230826A1

公开(公告)日：2005-10-20

申请号：US11085520

申请日：2005-03-22

申请人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

发明人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

IPC分类号： H01L23/29 ,  H01L21/00 ,  H01L21/58 ,  H01L21/60 ,  H01L21/607 ,  H01L21/98 ,  H01L23/12 ,  H01L23/31 ,  H01L25/065 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099

摘要： An object of the present invention is to manufacture a semiconductor device improved in the connection reliability between a bump electrode and a substrate electrode. Supposing that an elastic modulus of an adhesive material, which is used for the purpose of electrically connecting a metal bump and an interconnect pattern and sealing the circuit surface of LSI of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material constituting the surface layer of a packaging substrate after thermosetting is Eb; and an elastic modulus of a core material, if the substrate is a multilayer substrate having a core layer, is Ec, the material system of the present invention satisfies the following rational expression at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea

摘要翻译： 本发明的目的是制造改善凸起电极和衬底电极之间的连接可靠性的半导体器件。 假设用于电连接金属凸块和互连图案并且密封LSI芯片的LSI的电路表面在热固化之后的粘合材料的弹性模量为Ea; 构成热固化后的封装基板的表层的绝缘材料的弹性模量为Eb; 以及芯材的弹性模量，如果基板是具有芯层的多层基板，则为Ec，本发明的材料体系在常温或粘接材料的热接触接合温度下满足以下有理表达式： 至少Ea

公开(公告)号：US08578592B2

公开(公告)日：2013-11-12

申请号：US13509190

申请日：2011-04-01

申请人： Akira Nagai ,  Mei Arazoe ,  Go Kato

发明人： Akira Nagai ,  Mei Arazoe ,  Go Kato

IPC分类号： H02K15/03 ,  H02K1/27

CPC分类号： H02K15/03 ,  H02K1/276

摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.

摘要翻译： 一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个， 一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

公开(公告)号：US08273457B2

公开(公告)日：2012-09-25

申请号：US13166570

申请日：2011-06-22

申请人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： B32B27/38

CPC分类号： H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.