摘要:
A method for calculating ink-jet printing data is disclosed. A preset pattern is first obtained. Ink-jet points required for the preset pattern are calculated to select a filtering mode. A filtering operation is implemented on the preset pattern according to the filtering mode, resulting in an applicable number of ink-jet points for the preset pattern. The preset pattern is printed on a base board based on the resulting ink-jet points.
摘要:
A method of forming micro holes metal membrane by inkjet printing spray micro droplets of a catalyst in the holes after the substrate surface is treated. The catalyst adsorbs and dries on the inner walls of the holes. After that, the surface properties of the substrate are changed so that the coating solution readily enters the holes and forms a membrane on their inner walls. This can avoid incomplete metal coating due to residual air in the holes and forming a disconnected circuit. Moreover, the adhesive force between the inner wall of the holes and the metal improves the situation of coated layer peeling. The method reduces the use of precious catalyst, the fabrication procedure, and the production of photo resist etching waste. Since it does not require expensive equipment and space for exposure, developing, laser drilling, the method lowers the production cost and satisfies the environmental protection requirements.
摘要:
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
摘要:
A method for forming metal wires by microdispensing a pattern is disclosed. The method includes the steps of microdispensing a catalyst pattern on the substrate and forming metal wires by electroless plating. Before the step of microdispensing catalyst pattern, the surface properties of the substrate have been improved by a surface modification treatment.
摘要:
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
摘要:
A fabrication method of a radio frequency identification (RFID) antenna coil is provided. First, a substrate is processed by a surface modified procedure, to form a self-assembly membranes (SAMs) on a surface of the substrate. A catalyst is sprayed on the SAMs of the substrate according to patterning. After that, the first electroless plating procedure is first carried out for the substrate to generate a magnetic metal layer corresponding to the wiring pattern on the catalyst, and the second electroless plating procedure is then carried out for the substrate to generate the metal layer on the magnetic metal layer.
摘要:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.
摘要:
An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.
摘要:
A method of forming a conductive via plug is disclosed. The conductive via plug is formed by printing a solution comprising a solvent with insulating material dissolve capability and a conductive material by an inkjet method. The formed conductive via plug has a low resistivity and thus may serve as an electrical connection between two separate conductive layers. This manufacturing method of the conductive via plug may achieve simultaneously deposition, patterning and etching purposes, which significantly simplifies the manufacturing process.
摘要:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.