Method of forming a metal thin film in a micro hole by ink-jet printing
    2.
    发明申请
    Method of forming a metal thin film in a micro hole by ink-jet printing 审中-公开
    通过喷墨印刷在微孔中形成金属薄膜的方法

    公开(公告)号:US20060121199A1

    公开(公告)日:2006-06-08

    申请号:US11201127

    申请日:2005-08-11

    IPC分类号: H05K3/00 B05D3/04

    摘要: A method of forming micro holes metal membrane by inkjet printing spray micro droplets of a catalyst in the holes after the substrate surface is treated. The catalyst adsorbs and dries on the inner walls of the holes. After that, the surface properties of the substrate are changed so that the coating solution readily enters the holes and forms a membrane on their inner walls. This can avoid incomplete metal coating due to residual air in the holes and forming a disconnected circuit. Moreover, the adhesive force between the inner wall of the holes and the metal improves the situation of coated layer peeling. The method reduces the use of precious catalyst, the fabrication procedure, and the production of photo resist etching waste. Since it does not require expensive equipment and space for exposure, developing, laser drilling, the method lowers the production cost and satisfies the environmental protection requirements.

    摘要翻译: 通过喷墨印刷形成微孔金属膜的方法,在处理基板表面之后,在孔中喷射催化剂的微滴。 催化剂吸附并干燥在孔的内壁上。 之后,改变基板的表面特性,使涂层溶液容易进入孔内并在其内壁上形成膜。 这可以避免由于孔中的残留空气而形成不完整的金属涂层并形成断开的电路。 此外,孔内壁和金属之间的粘合力改善了涂层剥离的情况。 该方法减少了贵重催化剂的使用,制造过程和光蚀刻蚀刻废物的生产。 由于不需要昂贵的设备和空间进行曝光,开发,激光钻孔,降低了生产成本,满足了环保要求。

    Method for forming metal wires by microdispensing pattern
    3.
    发明授权
    Method for forming metal wires by microdispensing pattern 有权
    通过微分散图案形成金属丝的方法

    公开(公告)号:US07367118B2

    公开(公告)日:2008-05-06

    申请号:US10864331

    申请日:2004-06-10

    IPC分类号: H05K3/10

    摘要: A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.

    摘要翻译: 提供了通过微分散图案形成金属线的方法。 在该方法中,首先提供通过SAM处理的基板。 然后,在用于形成金属丝的位置处,在基板的表面上微量分配催化剂,并且形成催化剂图案。 接着,形成通过化学镀处理的催化剂图案上的金属线,并且在微分散步骤期间提供喷墨排出和墨水干燥期间的振动。 此外,振动是由包括通过化学镀处理在催化剂图案上形成金属线并在微分散步骤期间在喷墨排出和油墨干燥期间提供振动的装置产生的,其中振动 由包括支撑框架和振动产生模块的装置产生。