-
公开(公告)号：US20170117209A1
公开(公告)日：2017-04-27
申请号：US15129250
申请日：2015-03-26
发明人： Michael BENEDIKT , Thomas KREBS , Michael SCHÄFER , Wolfgang SCHMITT , Andreas HINRICH , Andreas KLEIN , Alexander BRAND , Martin BLEIFUSS
IPC分类号： H01L23/495 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49513 , H01L21/4821 , H01L23/49524 , H01L23/49548 , H01L23/49551 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/27318 , H01L2224/2732 , H01L2224/27418 , H01L2224/27505 , H01L2224/27848 , H01L2224/29294 , H01L2224/29295 , H01L2224/29339 , H01L2224/2939 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/371 , H01L2224/37639 , H01L2224/4005 , H01L2224/40095 , H01L2224/40245 , H01L2224/40499 , H01L2224/73263 , H01L2224/83192 , H01L2224/83439 , H01L2224/8384 , H01L2224/8385 , H01L2224/8484 , H01L2224/8485 , H01L2224/9221 , H01L2924/181 , H01L2924/00014 , H01L2924/01047 , H01L2224/83 , H01L2224/84 , H01L2924/00012
摘要： A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the carrier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
-
公开(公告)号：US20170239728A1
公开(公告)日：2017-08-24
申请号：US15329508
申请日：2015-03-18
发明人： Michael SCHÄFER , Wolfgang SCHMITT
CPC分类号： B22F5/006 , B22F3/1003 , B22F3/24 , B22F7/04 , B22F2003/242 , B22F2301/255 , B22F2302/25 , B22F2302/45 , B22F2998/10 , C25D11/34 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05186 , H01L2224/27003 , H01L2224/27505 , H01L2224/29139 , H01L2224/29147 , H01L2224/29164 , H01L2224/29186 , H01L2224/2957 , H01L2224/29686 , H01L2224/32221 , H01L2224/83005 , H01L2224/8302 , H01L2224/83055 , H01L2224/83201 , H01L2224/83203 , H01L2224/8384 , H01L2924/13055 , H01L2924/13091 , H05K3/32 , H05K2203/1131 , H01L2924/00 , H01L2924/00014 , H01L2924/053
摘要： A method for connecting components involves providing an arrangement of at least two components each containing at least one metallic contact surface and a metallic sintering agent in the form of a metallic solid body having metal oxide surfaces arranged between the components and pressuring sintering the arrangement whereby metal oxide surfaces of the metallic sintering agent and the metallic contact surfaces of the components each form a joint contact surface. The pressure sintering is carried out in an atmosphere containing at least one oxidizable compound and/or the metal oxide surfaces are provided with at least one oxidizable organic compound before formation of the corresponding joint contact surface.
-
公开(公告)号：US20170141074A1
公开(公告)日：2017-05-18
申请号：US15320959
申请日：2015-05-26
发明人： Michael SCHÄFER , Wolfgang SCHMITT
CPC分类号： H01L24/83 , B22F1/0055 , B22F1/0062 , B22F1/02 , B22F7/04 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/34 , B23K35/36 , B23K35/3602 , B23K35/3612 , B23K35/3615 , B23K35/3618 , B23K35/365 , B23K2101/40 , B23K2103/08 , H01L24/32 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29164 , H01L2224/29169 , H01L2924/12041 , H01L2924/13055 , H01L2924/14 , H01L2924/00
摘要： A metal preparation is provided which contains (A) 40 to 20 to 50 by weight organic solvent.
-
公开(公告)号：US20160082512A1
公开(公告)日：2016-03-24
申请号：US14888777
申请日：2014-04-30
发明人： Michael SCHÄFER , Wolfgang SCHMITT
CPC分类号： B22F9/02 , B22F1/0059 , B22F1/0062 , B22F1/02 , B23K1/00 , B23K1/19 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3612 , B23K35/3613 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/26 , B23K2103/50 , H01L24/29 , H01L24/83 , H01L2224/29006 , H01L2224/8384 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A sinterable mixture and method of producing the mixture are provided containing: (a) metal particles and (b) an organic compound represented by Formula I: R1—COR2 (I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, and R2 comprises either an —OM moiety or an —X—R3 moiety, wherein M is a cation, wherein X is selected from the group consisting of O, S, N—R4, and wherein R3 is a hydrogen atom or an aliphatic residue and R4 is a hydrogen atom or an aliphatic residue, wherein a molar ratio of carbon present in the organic compound (b) to oxygen present in the metal particles (a) is in a range of 3 to 50. The mixture is used for connecting components in a sandwich arrangement with the mixture in between and sintering the sandwich arrangement.
摘要翻译： 提供一种可烧结混合物和制备该混合物的方法，其包含：（a）金属颗粒和（b）由式I表示的有机化合物：R1-COR2（I），其中R1是具有8至32个碳原子的脂肪族残基， 并且R 2包括-OM部分或-X-R 3部分，其中M是阳离子，其中X选自O，S，N-R 4，并且其中R 3是氢原子或脂族残基 R4为氢原子或脂肪族残基，其中存在于有机化合物（b）中的碳与存在于金属粒子（a）中的氧的摩尔比在3〜50的范围内。该混合物用于连接 夹层结构中的组分与混合物在其中并烧结夹层结构。
-
公开(公告)号：US20240033860A1
公开(公告)日：2024-02-01
申请号：US18257037
申请日：2021-07-22
发明人： Ly May CHEW , Wolfgang SCHMITT , Michael SCHÄFER
CPC分类号： B23K35/025 , B23K35/3006 , B23K35/3613 , B23K2103/10
摘要： The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).
-
公开(公告)号：US20170326640A1
公开(公告)日：2017-11-16
申请号：US15523830
申请日：2015-05-08
CPC分类号： B22F1/0062 , B22F1/0011 , B22F1/0055 , B22F3/10 , B22F7/062 , B22F7/064 , B22F7/08 , B22F2301/255 , C22C5/00 , C22C5/06 , C22C9/00 , C22C21/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27505 , H01L2224/29224 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29255 , H01L2224/29264 , H01L2224/29269 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/32145 , H01L2224/8384 , H01L2924/00014
摘要： A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.
-
公开(公告)号：US20170194169A1
公开(公告)日：2017-07-06
申请号：US15308739
申请日：2014-09-03
IPC分类号： H01L21/48 , H01L23/14 , H01L23/15 , B23K35/02 , H01L23/498 , H05K3/20 , H05K3/00 , H01L23/495 , H01L23/373
CPC分类号： H01L21/4867 , B23K35/0244 , B23K35/025 , H01L21/4825 , H01L21/4871 , H01L23/142 , H01L23/15 , H01L23/3735 , H01L23/3736 , H01L23/49582 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/83 , H01L25/16 , H01L2224/04026 , H01L2224/05571 , H01L2224/27003 , H01L2224/271 , H01L2224/2744 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2949 , H01L2224/32225 , H01L2224/743 , H01L2224/7598 , H01L2224/83192 , H01L2224/83385 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/8384 , H01L2224/97 , H01L2225/06572 , H01L2225/06575 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H05K3/007 , H05K3/207 , H05K2203/1131 , H01L2924/00012 , H01L2924/00014 , H01L2224/83 , H01L2924/00
摘要： A method for the application of multiple discrete layer fragments made of dried metal sintering preparation to pre-determined electrically-conductive surface fractions of a substrate for electronic components is provided. The method includes (1) applying multiple discrete layer fragments made of metal sintering preparation to one side of a transfer substrate in an arrangement that is mirror-symmetrical to the pre-determined electrically-conductive surface fractions; (2) drying the applied metal sintering preparation while preventing sintering; (3) arranging and contacting the transfer substrate with the multiple discrete layer fragments to face the surface of the substrate for electronic components, while assuring coincident positioning of the surface fractions of the transfer substrate provided with the dried metal sintering preparation and the pre-determined electrically-conductive surface fractions of the substrate for electronic components; (4) applying compressive force to the contact arrangement of step (3); and (5) removing the transfer substrate from the contact arrangement.
-
公开(公告)号：US20230395552A1
公开(公告)日：2023-12-07
申请号：US18235181
申请日：2023-08-17
CPC分类号： H01L24/29 , B22F3/10 , B22F7/062 , B22F7/08 , C22C5/06 , H01L24/83 , B22F1/102 , B22F1/05 , B22F1/068 , B22F7/064 , H01L24/27 , H01L2224/29339 , H01L2224/29344 , H01L2224/32145 , C22C5/00
摘要： A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.
-
公开(公告)号：US20210276085A1
公开(公告)日：2021-09-09
申请号：US17331361
申请日：2021-05-26
摘要： A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm−1.
-
10.发明申请公开(公告)号：US20180311774A1
公开(公告)日：2018-11-01
申请号：US15968712
申请日：2018-05-01
CPC分类号： B23K35/3601 , B23K35/025 , C01G3/02 , C01G5/00 , C01G55/004 , C01P2004/02 , C01P2004/04 , C01P2004/20 , C01P2004/61 , C01P2004/62 , C01P2006/22 , C09C3/08 , H01L24/29 , H01L24/83 , H01L2224/8384 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H05K1/11 , H01L2924/00
摘要： A mixture contains metal oxide particles that are coated with an organic compound. The organic compound is represented by Formula I: R1—COR2 (I), wherein R1 is an aliphatic residue having 8 to 32 carbon atoms, wherein R2 is either —OM or comprises the moiety —X—R3, wherein X is selected from the group consisting of O, S, N—R4, wherein R4 is a hydrogen atom or an aliphatic residue, wherein R3 is a hydrogen atom or an aliphatic residue, and wherein M is a cation. The mixture may be used to connect components and/or to produce a module. A method for producing the mixture is also provided.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.017 秒)
