公开(公告)号：US09207477B2

公开(公告)日：2015-12-08

申请号：US14113886

申请日：2012-04-23

申请人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

发明人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

IPC分类号： G02F1/1333 ,  G02F1/1345 ,  F21V8/00

CPC分类号： G02F1/133308 ,  G02B6/0001 ,  G02F1/1333 ,  G02F1/13336 ,  G02F1/13452

摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.

摘要翻译： 本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。

公开(公告)号：US20140092338A1

公开(公告)日：2014-04-03

申请号：US14113886

申请日：2012-04-23

申请人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

发明人： Hiroki Miyazaki ,  Motoji Shiota ,  Takatoshi Kira ,  Gen Nagaoka ,  Seiji Muraoka ,  Makoto Tamaki ,  Keiji Aota ,  Yukio Shimizu ,  Takashi Matsui ,  Hiroki Nakahama ,  Hiroki Makino ,  Minoru Horino

IPC分类号： G02F1/1333 ,  F21V8/00

CPC分类号： G02F1/133308 ,  G02B6/0001 ,  G02F1/1333 ,  G02F1/13336 ,  G02F1/13452

摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.

摘要翻译： 本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。 基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到 第一板3和第二板4.电路构件2形成在基膜5上。

公开(公告)号：US20090044967A1

公开(公告)日：2009-02-19

申请号：US12281811

申请日：2007-03-14

申请人： Hiroki Nakahama ,  Seiji Muraoka

发明人： Hiroki Nakahama ,  Seiji Muraoka

IPC分类号： H05K1/02

CPC分类号： H05K1/0271 ,  G02F1/13452 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/0401

摘要： A circuit board, an electronic circuit device, and a display device, in which generation of an edge short-circuit is prevented, includes wirings that are arranged much more densely. A circuit board includes a substrate having a first main surface on which a semiconductor integrated circuit is mounted and a second main surface; a plurality of first wirings including a bump connecting terminal on the first main surface; and a plurality of second wirings on the second main surface, wherein the plurality of the second wirings are arranged independently from each other and overlap with a region where the semiconductor integrated circuit is mounted, and the circuit board includes a wiring portion on the second main surface in a region overlapping with a region where the bump connecting terminal is arranged.

摘要翻译： 防止边缘短路的产生的电路板，电子电路装置和显示装置包括布置得更密集的布线。 电路板包括具有安装有半导体集成电路的第一主表面和第二主表面的基板; 多个第一布线，包括在所述第一主表面上的凸块连接端子; 以及多个第二布线，其中多个第二布线彼此独立地布置并与安装半导体集成电路的区域重叠，并且电路板包括在第二主表面上的布线部分 在与突起连接端子配置的区域重叠的区域中的表面。

公开(公告)号：US20120236230A1

公开(公告)日：2012-09-20

申请号：US13510721

申请日：2010-09-15

申请人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

发明人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

IPC分类号： G02F1/1335 ,  H01J9/00 ,  H05K13/04 ,  H05K1/18

CPC分类号： G02F1/1345 ,  G02F2001/13456 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02185 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1146 ,  H01L2224/13006 ,  H01L2224/13019 ,  H01L2224/16 ,  H01L2224/16013 ,  H01L2224/16112 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81424 ,  H01L2224/81481 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T156/10 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

摘要翻译： 公开了一种器件基板，其中在其表面上形成有端子（24）的绝缘层（60）形成在除了显示部分之外的玻璃基板（20）的整个表面上，因此，边界（外围 绝缘层（60）不接近设置有NCF（81）的区域，即靠近LSI芯片（40）的区域。 这防止绝缘层（60）被NCF（81）从其边界剥离，从而防止端子（24）断裂。 此外，端子（24）和突起电极（40a）通过绝缘层（60）的弹性而彼此永久地压接，并且可以确保其间的稳定的电连接。

公开(公告)号：US20130335940A1

公开(公告)日：2013-12-19

申请号：US14002346

申请日：2012-03-01

申请人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

发明人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  G02F1/13454 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10165 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).

摘要翻译： 布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。 多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部 部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

公开(公告)号：US20120080789A1

公开(公告)日：2012-04-05

申请号：US13377780

申请日：2010-02-02

申请人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

发明人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

IPC分类号： H01L23/498

CPC分类号： H01L24/14 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13013 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/13099 ,  H01L2224/81 ,  H01L2224/83

摘要： Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface.

摘要翻译： 提供了一种在端子之间具有窄间距的半导体芯片，该芯片能够抑制芯片与其上安装芯片的基板之间的连接不良的发生。 在包括输入凸块组的LSI芯片中，所述输入凸块组由沿其底面的一个长边排列的多个输入凸块和输出凸块组组成，所述输出凸块组由多个输出凸块组成， 沿着底面的另一长边交错排列，在设置有输入凸块组的区域和设置有输出凸块组的区域之间的区域中设置有虚设凸块组，该虚设凸块组包括多个 具有沿着与底面的长边垂直的方向延伸的长边的矩形伪凸块。

公开(公告)号：US20110019125A1

公开(公告)日：2011-01-27

申请号：US12933159

申请日：2008-11-10

申请人： Hiroki Nakahama ,  Kiyoshi Inada

发明人： Hiroki Nakahama ,  Kiyoshi Inada

IPC分类号： G02F1/1333 ,  H05K1/00 ,  H05K1/09

CPC分类号： H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a mounted board (11) comprising a feed wire (13) for supplying a current to a circuit element (21). In this mounted board (11), when a region of a mounting surface (12A) of the mounted board (11) overlapping the circuit element (21) is defined as a mounting area (MA), a reinforcing wire (17) overlapping a corner (PP) of the mounting area (MA) is formed on the mounting surface (12A).

摘要翻译： 公开了一种安装板（11），其包括用于向电路元件（21）提供电流的馈线（13）。 在该安装板（11）中，当安装板（11）的与电路元件（21）重叠的安装面（12A）的区域被定义为安装区域（MA）时，将与 安装面（MA）的角部（PP）形成在安装面（12A）上。

公开(公告)号：US08390115B2

公开(公告)日：2013-03-05

申请号：US12866921

申请日：2009-03-06

申请人： Hiroki Nakahama

发明人： Hiroki Nakahama

IPC分类号： H01L23/48

CPC分类号： H05K3/3452 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/303 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/0401

摘要： Provided is a wiring board wherein a circuit is not short-circuited when a IC chip is mounted on the wiring board. A wiring board (2) is provided with a substrate (4); wiring layers (5-8), which are formed on a surface of the substrate (4) and have prescribed wiring patterns; connecting terminals (9-12), which are formed on a part of the wiring layers (5-8) and electrically connected with bumps (18-21) of an integrated circuit chip (IC chip) (3); a mounting region (14), which is arranged on the surface of the substrate (4) and has the integrated circuit chip (3) mounted therein; and an insulating layer (13), which is formed on the surface of the substrate (4) so as to surround the circumference of the mounting region (14) for protecting wiring layers (5-8). A part of the insulating layer (3) is arranged inside the mounting region (14), and the thickness of the insulating layer (13) is more than that of the bumps (18-21) of the integrated circuit chip (3).

摘要翻译： 提供了当IC芯片安装在布线板上时电路不会短路的布线板。 布线板（2）设置有基板（4）; 布线层（5-8），其形成在所述基板（4）的表面上并具有规定的布线图案; 连接端子（9-12），其形成在所述布线层（5-8）的一部分上并与集成电路芯片（IC芯片）（3）的凸块（18-21）电连接; 安装区域（14），其布置在所述基板（4）的表面上并且具有安装在其中的集成电路芯片（3）; 以及绝缘层（13），其形成在所述基板（4）的表面上，以围绕所述安装区域（14）的周围，用于保护布线层（5-8）。 绝缘层（3）的一部分布置在安装区域（14）的内部，绝缘层（13）的厚度大于集成电路芯片（3）的凸块（18-21）的厚度。

公开(公告)号：US20120133876A1

公开(公告)日：2012-05-31

申请号：US13262216

申请日：2010-01-15

申请人： Hiroki Nakahama ,  Keigo Aoki ,  Gen Nagaoka ,  Kiyoshi Inada ,  Motoji Shiota

发明人： Hiroki Nakahama ,  Keigo Aoki ,  Gen Nagaoka ,  Kiyoshi Inada ,  Motoji Shiota

IPC分类号： G02F1/1343

CPC分类号： G02F1/133528

摘要： A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate (10) and a second glass substrate (20) which face each other with a liquid crystal therebetween. The first glass substrate (10) and the second glass substrate (20) are formed in substantially the same size in plan view and bonded together in a state in which these substrates are shifted from each other by a predetermined distance in the direction of the longer side or in the direction of the shorter side. Regions to become a frame (frame regions) are provided on both the first glass substrate (10) and the second glass substrate (20), and pads (60) are provided on both of these frame regions.

摘要翻译： 在配置有液晶面板的玻璃基板上充分确保了用于安装诸如IC芯片的部件的区域，而不会减少从大面板取出的面板件的数量。 液晶面板由第一玻璃基板（10）和第二玻璃基板（20）构成，第一玻璃基板（10）和第二玻璃基板（20）之间具有液晶。 第一玻璃基板（10）和第二玻璃基板（20）在平面图中形成为大致相同的尺寸，并且在这些基板沿较长的方向彼此偏移预定距离的状态下接合在一起 侧或在短边方向。 在第一玻璃基板（10）和第二玻璃基板（20）两者上设置成为框架（框架区域）的区域，并且在这两个框架区域上设置焊盘（60）。

公开(公告)号：US09148957B2

公开(公告)日：2015-09-29

申请号：US14002346

申请日：2012-03-01

申请人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

发明人： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

IPC分类号： H05K7/00 ,  H05K1/18 ,  H01L23/00 ,  H05K1/11 ,  G02F1/1345 ,  H01L23/498

CPC分类号： H05K1/18 ,  G02F1/13454 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10165 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).

摘要翻译： 布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。 多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部 部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。