公开(公告)号：US20140231122A1

公开(公告)日：2014-08-21

申请号：US14119122

申请日：2012-05-21

申请人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

发明人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

IPC分类号： H05K1/05 ,  C09K5/14

CPC分类号： H05K1/05 ,  C08G59/621 ,  C08G59/686 ,  C08K3/013 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08L63/00 ,  C09K5/14 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106

摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。

公开(公告)号：US09451695B2

公开(公告)日：2016-09-20

申请号：US14119122

申请日：2012-05-21

申请人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

发明人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

IPC分类号： C08L63/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  H05K1/05 ,  C08G59/62 ,  C08G59/68 ,  C09K5/14 ,  C08K3/28 ,  C08K3/00

CPC分类号： H05K1/05 ,  C08G59/621 ,  C08G59/686 ,  C08K3/013 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08L63/00 ,  C09K5/14 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106

摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，可以通过使用上述环氧树脂作为印刷电路板的绝缘材料来提供高辐射热板。

公开(公告)号：US5775455A

公开(公告)日：1998-07-07

申请号：US563592

申请日：1995-11-28

申请人： In Hee Cho

发明人： In Hee Cho

IPC分类号： A63G25/00 ,  B60K1/00 ,  B60K17/30

CPC分类号： B60K1/00 ,  B60K17/30

摘要： A steering device for an amusement car including a drive wheel mounted off-center on a wheel shaft to provide a rotation force for quick and automatic recovery of the steering device to steer the car away from an obstacle that is encountered during use. The drive wheel being mounted to the wheel shaft in an area bounded by a distance equal to the radius of the drive wheel and a distance equal to the diameter of the drive wheel, both measured from the center of the wheel shaft.

摘要翻译： 一种用于游乐车的转向装置，包括：驱动轮，其安装在轮轴上的偏心处，以提供用于快速和自动地恢复转向装置的转动力，以使车辆远离使用期间遇到的障碍物。 驱动轮在从轮轴的中心测量的区域中被限定在等于驱动轮的半径的距离的范围内并且与驱动轮的直径相等的距离安装到车轮轴。

公开(公告)号：US09844142B2

公开(公告)日：2017-12-12

申请号：US13811365

申请日：2011-07-15

申请人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

发明人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H01L23/367

CPC分类号： H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

公开(公告)号：US09307675B2

公开(公告)日：2016-04-05

申请号：US13878637

申请日：2011-10-10

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： F21V29/00 ,  H05K7/20 ,  H01L23/367 ,  H01L25/075 ,  H01L33/64 ,  H05K3/30 ,  H05K13/00 ,  G02F1/1335 ,  H05K1/02 ,  H05K3/46 ,  F21V29/70 ,  H05K1/05 ,  H05K1/11

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20140318839A1

公开(公告)日：2014-10-30

申请号：US14235692

申请日：2012-07-27

申请人： Sung Bae Moon ,  Jae Man Park ,  Jong Heum Yoon ,  Hae Yeon Kim ,  In Hee Cho

发明人： Sung Bae Moon ,  Jae Man Park ,  Jong Heum Yoon ,  Hae Yeon Kim ,  In Hee Cho

IPC分类号： H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0201 ,  C08G59/184 ,  C08K3/22 ,  C08K2003/2227 ,  C08L63/00 ,  H01L23/142 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H01L2924/00

摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。

公开(公告)号：US20140318835A1

公开(公告)日：2014-10-30

申请号：US14241961

申请日：2012-08-30

申请人： Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Jong Heum Yoon ,  In Hee Cho

发明人： Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Jong Heum Yoon ,  In Hee Cho

IPC分类号： H05K1/05 ,  C09K5/14

CPC分类号： H05K1/056 ,  C08G59/226 ,  C08G59/245 ,  C08G59/38 ,  C08K3/013 ,  C08L63/00 ,  C08L63/04 ,  C09K5/14 ,  C08K3/0033

摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂化合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。

公开(公告)号：US20140290986A1

公开(公告)日：2014-10-02

申请号：US14232510

申请日：2012-07-12

申请人： Eun Jin Kim ,  Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Hyun Gyu Park ,  Jong Heum Yoon ,  In Hee Cho ,  Jin Hwan Kim ,  Thanh Kieu Giang

发明人： Eun Jin Kim ,  Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Hyun Gyu Park ,  Jong Heum Yoon ,  In Hee Cho ,  Jin Hwan Kim ,  Thanh Kieu Giang

IPC分类号： H05K1/03 ,  H05K1/05

CPC分类号： H05K1/0373 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0212 ,  H05K1/0346 ,  H05K1/056

摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

公开(公告)号：US20140290996A1

公开(公告)日：2014-10-02

申请号：US14232489

申请日：2012-07-12

申请人： Sung Bae Moon ,  Hae Yeon Kim ,  Jae Man Park ,  Jong Heum Yoon ,  In Hee Cho

发明人： Sung Bae Moon ,  Hae Yeon Kim ,  Jae Man Park ,  Jong Heum Yoon ,  In Hee Cho

IPC分类号： H05K1/03 ,  H05K1/05 ,  H05K1/02

CPC分类号： H05K1/0373 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K3/38 ,  C08L21/00 ,  C08L63/00 ,  H05K1/0203 ,  H05K1/0346 ,  H05K1/056

摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 环氧树脂包括结晶环氧树脂和将无机填料分散到环氧树脂中的橡胶添加剂。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。

公开(公告)号：US20130206459A1

公开(公告)日：2013-08-15

申请号：US13878319

申请日：2011-10-05

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K1/02

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。