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公开(公告)号：US09484504B2
公开(公告)日：2016-11-01
申请号：US13894255
申请日：2013-05-14
发明人： Andreas Bibl , Kelly McGroddy
CPC分类号： H01L33/504 , H01L27/156 , H01L33/06 , H01L33/502 , H01L2224/18 , H01L2224/24 , H01L2224/82
摘要： A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.
摘要翻译： 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。
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公开(公告)号：US20150356918A1
公开(公告)日：2015-12-10
申请号：US14830486
申请日：2015-08-19
发明人： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC分类号： G09G3/32 , H01L25/16 , H01L25/075
CPC分类号： G09G3/3426 , G09G3/2088 , G09G3/32 , G09G3/3216 , G09G3/3233 , G09G3/3266 , G09G2300/0828 , G09G2300/0842 , G09G2300/0857 , G09G2310/08 , G09G2320/029 , G09G2330/028 , H01L25/0753 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
摘要翻译： 描述发光组件。 在一个实施例中，一个或多个发光二极管（LED）器件和一个或多个微控制器被结合到衬底的同一侧，一个或多个微控制器用于切换和驱动一个或多个LED器件。
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公开(公告)号：US09450147B2
公开(公告)日：2016-09-20
申请号：US14194509
申请日：2014-02-28
IPC分类号： H01L33/14 , H01L27/01 , H01L33/06 , H01L23/00 , G09G3/32 , H01L25/075 , H01L27/15 , H01L33/16 , H01L33/20 , H01L33/00
CPC分类号： H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
摘要： Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
摘要翻译： 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US20150187991A1
公开(公告)日：2015-07-02
申请号：US14194509
申请日：2014-02-28
CPC分类号： H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
摘要： Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
摘要翻译： 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US20140168037A1
公开(公告)日：2014-06-19
申请号：US13717634
申请日：2012-12-17
发明人： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC分类号： G09G3/32
CPC分类号： G09G3/3426 , G09G3/2088 , G09G3/32 , G09G3/3216 , G09G3/3233 , G09G3/3266 , G09G2300/0828 , G09G2300/0842 , G09G2300/0857 , G09G2310/08 , G09G2320/029 , G09G2330/028 , H01L25/0753 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
摘要翻译： 描述发光组件。 在一个实施例中，一个或多个发光二极管（LED）器件和一个或多个微控制器被结合到衬底的同一侧，一个或多个微控制器用于切换和驱动一个或多个LED器件。
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公开(公告)号：US09111464B2
公开(公告)日：2015-08-18
申请号：US13920912
申请日：2013-06-18
发明人： Andreas Bibl , Kelly McGroddy
IPC分类号： H01L33/00 , G09F9/00 , H01L33/50 , H01L25/075 , G02F1/1335 , G09G3/32
CPC分类号： H01L25/167 , G02F1/133603 , G02F1/133617 , G02F2001/133614 , G09F9/00 , G09G3/32 , H01L24/95 , H01L25/0753 , H01L27/322 , H01L27/3246 , H01L33/38 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L51/5281 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
摘要： A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
摘要翻译： 描述了显示器和制造方法。 显示器可以包括包括像素阵列的基板，每个像素包括多个子像素，并且像素内的每个子像素被设计用于不同的发色光谱。 每个子像素中安装有一组微型LED器件对，以提供冗余。 包含磷光体粒子的波长转换层阵列形成在微型LED器件对阵列上，用于可调色彩发射光谱。
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公开(公告)号：US20150179876A1
公开(公告)日：2015-06-25
申请号：US14137847
申请日：2013-12-20
发明人： Hsin-Hua Hu , Kelly McGroddy
CPC分类号： H01L33/06 , H01L33/0095 , H01L33/14 , H01L33/20 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/95 , H01L2924/12044 , H01L2933/0016 , H01L2924/00
摘要： A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.
摘要翻译： 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括有限电流注入区域，嵌入式反射镜或侧壁钝化层及其任何组合。
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公开(公告)号：US20140339495A1
公开(公告)日：2014-11-20
申请号：US13894255
申请日：2013-05-14
发明人： Andreas Bibl , Kelly McGroddy
CPC分类号： H01L33/504 , H01L27/156 , H01L33/06 , H01L33/502 , H01L2224/18 , H01L2224/24 , H01L2224/82
摘要： A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.
摘要翻译： 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。
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公开(公告)号：US09768345B2
公开(公告)日：2017-09-19
申请号：US14137847
申请日：2013-12-20
发明人： Hsin-Hua Hu , Kelly McGroddy
IPC分类号： H01L29/06 , H01L33/06 , H01L33/20 , H01L33/60 , H01L33/40 , H01L33/62 , H01L33/00 , H01L33/14
CPC分类号： H01L33/06 , H01L33/0095 , H01L33/14 , H01L33/20 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/95 , H01L2924/12044 , H01L2933/0016 , H01L2924/00
摘要： A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.
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公开(公告)号：US09626908B2
公开(公告)日：2017-04-18
申请号：US14830486
申请日：2015-08-19
发明人： Kapil V. Sakariya , Andreas Bibl , Kelly McGroddy
IPC分类号： H01L25/075 , G09G3/3233 , H01L25/16 , G09G3/3266 , G09G3/3216
CPC分类号： G09G3/3426 , G09G3/2088 , G09G3/32 , G09G3/3216 , G09G3/3233 , G09G3/3266 , G09G2300/0828 , G09G2300/0842 , G09G2300/0857 , G09G2310/08 , G09G2320/029 , G09G2330/028 , H01L25/0753 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
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