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    Manufacturing method of a package substrate
    1.
    发明申请
    Manufacturing method of a package substrate 审中-公开
    封装衬底的制造方法

    公开(公告)号：US20070281390A1

    公开(公告)日：2007-12-06

    申请号：US11727852

    申请日：2007-03-28

    申请人： Myung-Sam Kang ,  Je-Gwang Yoo ,  Jung-Hyun Park ,  Ji-Eun Kim ,  Hoe-Ku Jung ,  Jin-Yong An

    发明人： Myung-Sam Kang ,  Je-Gwang Yoo ,  Jung-Hyun Park ,  Ji-Eun Kim ,  Hoe-Ku Jung ,  Jin-Yong An

    IPC分类号： H01L21/00

    CPC分类号： H01L21/4846 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/108 ,  H05K3/242 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/0376 ,  H05K2203/0361 ,  H05K2203/1394 ,  H01L2924/00

    摘要： The present invention relates to a manufacturing method of a package substrate. A manufacturing method of a package substrate for mounting an electric component by connecting electrodes of the electric component to bonding pads, includes: manufacturing a buried pattern substrate having a circuit pattern and bonding pads buried in an insulating layer and having a seed layer laminated on the insulating layer, laminating a dry film onto the seed layer and removing the seed layer and the dry film of the upper side of the bonding pads, performing surface-treatment using the remaining seed layer as a plating lead; and removing the remaining seed layer and the dry film such that the circuit pattern is exposed.

    摘要翻译： 本发明涉及封装基板的制造方法。 一种用于通过将电气部件的电极连接到接合焊盘来安装电气部件的封装基板的制造方法，包括：制造具有电路图案的掩埋图案基板和埋在绝缘层中并具有层叠在所述绝缘层上的种子层的接合焊盘 绝缘层，将干膜层压到种子层上，去除接合焊盘的上侧的种子层和干膜，使用剩余的种子层作为电镀引线进行表面处理; 并且除去剩余的种子层和干膜，使得电路图案被暴露。

    Multilayered printed circuit board and manufacturing method thereof
    2.
    发明申请
    Multilayered printed circuit board and manufacturing method thereof 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20090038837A1

    公开(公告)日：2009-02-12

    申请号：US12078176

    申请日：2008-03-27

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H05K1/11 ,  B32B38/10

    CPC分类号： H05K3/462 ,  H05K3/205 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096

    摘要： A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.

    摘要翻译： 公开了一种多层印刷电路板。 一种制造多层印刷电路板的方法，包括：在载体上依次形成金属层和下电路形成图案，并通过在下电路形成图案中填充导电材料形成下层电路; 去除下部电路形成图案，堆叠绝缘树脂，并形成与下部电路连接的至少一个通孔; 在所述绝缘树脂上形成至少一个内部电路和连接所述内部电路与所述下部电路的至少一个层间连接器，以形成一对电路部件; 并且将一对电路部件对准，将一对电路部件彼此连接，并且移除载体和金属层，允许形成精细的电路并提供薄板，同时防止板的弯曲和翘曲。

    Method of manufacturing printed circuit board
    5.
    发明授权
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US07971352B2

    公开(公告)日：2011-07-05

    申请号：US12213465

    申请日：2008-06-19

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H01R9/00 ,  H05K3/00

    CPC分类号： H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

    Method of manufacturing printed circuit board
    6.
    发明申请
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US20090151160A1

    公开(公告)日：2009-06-18

    申请号：US12213465

    申请日：2008-06-19

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H05K3/10 ,  H05K3/36

    CPC分类号： H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

    Substrate manufacturing method
    7.
    发明申请
    Substrate manufacturing method 审中-公开
    基板制造方法

    公开(公告)号：US20090084494A1

    公开(公告)日：2009-04-02

    申请号：US12007475

    申请日：2008-01-10

    申请人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    发明人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    IPC分类号： B29C65/00

    CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0228 ,  H05K2203/0384 ,  Y10T156/1052

    摘要： A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.

    摘要翻译： 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。

    Method of manufacturing a multi-layer board
    8.
    发明授权
    Method of manufacturing a multi-layer board 有权
    制造多层板的方法

    公开(公告)号：US08051559B2

    公开(公告)日：2011-11-08

    申请号：US12232820

    申请日：2008-09-24

    申请人： Ki-Hwan Kim ,  Jong-Kuk Hong ,  Jin-Yong An

    发明人： Ki-Hwan Kim ,  Jong-Kuk Hong ,  Jin-Yong An

    IPC分类号： H01K3/10 ,  H05K1/00

    CPC分类号： H05K3/4682 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/28 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.

    摘要翻译： 公开了制造多层板的方法。 该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。 该方法采用简单的方法降低制造成本，缩短制造时间。

    PACKAGE SUBSTRATE
    9.
    发明申请
    PACKAGE SUBSTRATE 审中-公开
    包装基板

    公开(公告)号：US20100148348A1

    公开(公告)日：2010-06-17

    申请号：US12480291

    申请日：2009-06-08

    申请人： Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

    发明人： Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

    IPC分类号： H01L23/498

    CPC分类号： H01L23/49822 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/09972 ,  H05K2203/1572

    摘要： A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.

    摘要翻译： 公开了封装衬底。 作为印刷电路板的封装基板，其中半导体芯片安装在其一侧并且另一侧安装在主板上，可以包括基板部分，第一焊盘，其形成在主体的一侧上 基板部分，使得第一焊盘电连接到半导体芯片;以及第一阻焊层，其形成在基板部分的一个表面上，使得第一焊盘露出。 这里，第一阻焊层被分成焊盘部分和虚设部分，第一焊盘暴露在焊盘部分中，并且虚设部分比焊盘部分薄。 封装基板有助于形成热膨胀系数在顶部和底部之间对称的结构，从而防止翘曲。

    MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20100126765A1

    公开(公告)日：2010-05-27

    申请号：US12569104

    申请日：2009-09-29

    申请人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

    发明人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

    IPC分类号： H05K1/11 ,  B32B38/00 ,  B32B38/10 ,  C23F1/00

    CPC分类号： H05K3/4007 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  Y10T156/1168

    摘要： A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.

    摘要翻译： 一种制造具有形成在一侧上的外部接触焊盘的多层PCB的方法可以包括：形成最外绝缘层，其中形成对应于外部接触焊盘的开口; 形成掩模，其中在最外绝缘层上形成对应于外部接触焊盘和电路图案的开口; 在外绝缘层的开口和掩模的开口中形成外部接触焊盘和电路图案; 去除面膜; 通过在最外层绝缘层上层叠层来形成堆积层，使得覆盖外部接触焊盘和电路图案; 在积层上形成第一阻焊层; 以及在最外绝缘层的相对侧上形成第二阻焊层; 以及在所述第二阻焊层中形成开口，使得所述外部接触焊盘露出。