公开(公告)号：US07157309B2

公开(公告)日：2007-01-02

申请号：US10950241

申请日：2004-09-27

申请人： Nicholas J. Colella ,  Giles Humpston

发明人： Nicholas J. Colella ,  Giles Humpston

IPC分类号： H01L21/44

CPC分类号： B65B49/04 ,  B65B9/06 ,  B65B15/04 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.

摘要翻译： 带有诸如半导体芯片的微电子元件的片状基片的细长带沿下游方向前进通过一个或多个折叠站，其中基底的连续部分被折叠以形成包括多个折叠包装的条带，每个折叠包装件包括面对 顶部和底部运行以及具有一个或多个承载一个或多个微电子元件的运行的折叠区域。 包含多个折叠包装的条带可以卷绕在卷轴上或以其他方式处理，存储和运输到随后的制造操作，其中可以从带切断各个折叠包装。

公开(公告)号：US20120241976A1

公开(公告)日：2012-09-27

申请号：US13488930

申请日：2012-06-05

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

摘要翻译： 微电子单元可以包括具有前表面的半导体元件，与前表面相邻的微电子半导体器件，在前表面处的接触和远离前表面的后表面。 半导体元件可以具有从后表面穿过半导体元件并通过触点延伸的通孔。 电介质层可以对通孔进行排列。 导电层可覆盖通孔内的电介质层。 导电层可以将触点与单元触点导电互连。

公开(公告)号：US07719121B2

公开(公告)日：2010-05-18

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US07545029B2

公开(公告)日：2009-06-09

申请号：US11506472

申请日：2006-08-18

申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

IPC分类号： H01L23/02 ,  H05K7/00 ,  H01L21/00

CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

公开(公告)号：US20080165519A1

公开(公告)日：2008-07-10

申请号：US11650356

申请日：2007-01-05

申请人： Michael J. Nystrom ,  Giles Humpston

发明人： Michael J. Nystrom ,  Giles Humpston

IPC分类号： B23P17/04 ,  H05K7/04

CPC分类号： H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

摘要： A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

摘要翻译： 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。

公开(公告)号：US20080099900A1

公开(公告)日：2008-05-01

申请号：US11590616

申请日：2006-10-31

申请人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

发明人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/02

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/274 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and rear surfaces. At least some of the conductive features are insulated from the exposed semiconductive or conductive material. By electrodeposition, an insulative layer is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts and a plurality of conductive traces are formed overlying the electrodeposited insulative layer, the conductive traces connecting the conductive features to the conductive contacts. The unit can be incorporated in a camera module having an optical element in registration with an imaging area of the semiconductor element.

摘要翻译： 提供了一种用于制造包括诸如传感器单元的半导体元件的单元的方法，例如用于光学成像。 半导体元件具有在前表面处暴露的多个导电特征，并且暴露在前表面和后表面中的至少一个上的半导体或导电材料。 至少一些导电特征与暴露的半导电材料或导电材料绝缘。 通过电沉积，形成绝缘层以覆盖暴露的半导体材料或导电材料中的至少一种。 随后，多个导电触点和多个导电迹线形成在电沉积绝缘层上，导电迹线将导电特征连接到导电触点。 该单元可以结合在具有与半导体元件的成像区域对准的光学元件的相机模块中。

公开(公告)号：US20080090427A1

公开(公告)日：2008-04-17

申请号：US11546899

申请日：2006-10-12

申请人： Giles Humpston ,  Jesse Burl Thompson

发明人： Giles Humpston ,  Jesse Burl Thompson

IPC分类号： H01R12/00

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A microelectric component having a base and a plurality of conductive posts extending from said base. Each of the posts is formed from a connected lattice of metal having voids therein. The lattice may be formed by depositing metal onto a sacrificial element such as an open-celled polymeric foam. During use or during processing, the posts may be deformed, as by crushing the lattice.

摘要翻译： 一种微电子部件，其具有从所述基部延伸的基部和多个导电柱。 每个柱由其中具有空隙的金属的连接格子形成。 晶格可以通过将金属沉积到诸如开孔聚合物泡沫的牺牲元件上而形成。 在使用过程中或在加工过程中，柱可以通过粉碎格子而变形。

公开(公告)号：US07317249B2

公开(公告)日：2008-01-08

申请号：US11021627

申请日：2004-12-23

申请人： Richard Dewitt Crisp ,  Belgacem Haba ,  Giles Humpston

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/34

CPC分类号： H01L24/73 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.

摘要翻译： 具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。 导电柱从第一微电子元件的一个主表面延伸。 第一微电子元件经由导电柱与第二微电子元件电互连。 第一微电子元件优选地具有导电柱延伸的插入元件。 第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。 如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。 封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。 焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。

公开(公告)号：US07262368B2

公开(公告)日：2007-08-28

申请号：US10917978

申请日：2004-08-13

申请人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20070190747A1

公开(公告)日：2007-08-16

申请号：US11655739

申请日：2007-01-19

申请人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

发明人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

IPC分类号： H01L21/00

CPC分类号： B81C1/00285 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for making a plurality of lidded microelectronic elements. In an exemplary embodiment, a lid wafer is assembled with a device wafer. Desirably, the lid wafer is severed into a plurality of lid elements to remove portions of the lid wafer overlying contacts at a front face of the device wafer adjacent to dicing lanes of the device wafer. Thereafter, desirably, the device wafer is severed along the dicing lanes to provide a plurality of lidded microelectronic elements.

摘要翻译： 提供了制造多个带盖的微电子元件的方法。 在示例性实施例中，盖晶片与装置晶片组装在一起。 期望地，将盖晶片切割成多个盖元件以去除盖子晶片的覆盖在与器件晶片的切割通道相邻的器件晶片的正面处的触点的部分。 此后，期望地，器件晶片沿着切割通道切断以提供多个带盖的微电子元件。