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公开(公告)号：US10412838B2
公开(公告)日：2019-09-10
申请号：US15582807
申请日：2017-05-01
发明人： Arata Kishi , Hiroki Maruo
摘要： There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.
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公开(公告)号：US10464153B2
公开(公告)日：2019-11-05
申请号：US15582794
申请日：2017-05-01
发明人： Arata Kishi , Hiroki Maruo
IPC分类号： B23K35/26 , H01L23/00 , B23K1/00 , C22C12/00 , B23K101/36 , B23K103/08
摘要： A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.
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公开(公告)号：US10037960B2
公开(公告)日：2018-07-31
申请号：US15582801
申请日：2017-05-01
发明人： Arata Kishi , Hiroki Maruo
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/05 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/05609 , H01L2224/05611 , H01L2224/05686 , H01L2224/13109 , H01L2224/13113 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/81203 , H01L2224/9202 , H01L2224/92125 , H01L2924/014 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H05K1/111 , H05K1/181 , H05K3/3457 , H05K2201/0326
摘要： There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.
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公开(公告)号：US10786876B2
公开(公告)日：2020-09-29
申请号：US15962899
申请日：2018-04-25
发明人： Teppei Kojio , Koji Motomura , Hiroki Maruo
IPC分类号： H01L21/00 , H01L21/44 , H01L23/48 , B23K35/36 , H01L23/00 , B23K35/365 , B23K35/362 , H01L23/31
摘要： The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.
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公开(公告)号：US09795036B2
公开(公告)日：2017-10-17
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
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公开(公告)号：US20150116970A1
公开(公告)日：2015-04-30
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
摘要翻译： 安装结构包括将电路板（105）的第二电极（104）和半导体封装（101）的凸块（103）接合的接合材料（106），所述接合材料（106）被第一增强树脂 （107）。 此外，半导体封装（101）的外周与电路基板（105）之间的部分被第二增强树脂（108）覆盖。 即使接合材料（106）是具有比常规接合材料低的熔点的焊料，也可获得高的耐滴落性。
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公开(公告)号：US20150096651A1
公开(公告)日：2015-04-09
申请号：US14403156
申请日：2013-03-15
发明人： Teppei Kojio , Koji Motomura , Hiroki Maruo
IPC分类号： B23K35/36 , B23K35/362
CPC分类号： B23K35/3612 , B23K35/362 , B23K35/365 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/7501 , H01L2224/75251 , H01L2224/75252 , H01L2224/75343 , H01L2224/75349 , H01L2224/75353 , H01L2224/75701 , H01L2224/75745 , H01L2224/75753 , H01L2224/75804 , H01L2224/75822 , H01L2224/75824 , H01L2224/759 , H01L2224/81002 , H01L2224/81011 , H01L2224/81022 , H01L2224/81024 , H01L2224/81055 , H01L2224/81085 , H01L2224/81132 , H01L2224/81149 , H01L2224/81191 , H01L2224/81192 , H01L2224/81203 , H01L2224/81207 , H01L2224/81447 , H01L2224/81801 , H01L2224/81912 , H01L2224/81914 , H01L2924/12041 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.
摘要翻译： 目的是在将半导体器件安装到基板上以便容易地识别辅助接合剂的剩余量，以稳定辅助接合剂的分配量，并且防止辅助接合剂的短缺。 另外，为了有效地维护安装机器，提供了一种辅助接合剂，其适用于辅助金属的接合并通过将着色剂溶解在具有除去金属表面上的氧化膜的还原性能的溶剂中制备。 辅助接合剂通过包括在金属表面上混合除去氧化膜还原性的溶剂的步骤和具有溶解在溶剂中的性质的着色剂的方法制备。
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公开(公告)号：US10412834B2
公开(公告)日：2019-09-10
申请号：US15699570
申请日：2017-09-08
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
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公开(公告)号：US20180236613A1
公开(公告)日：2018-08-23
申请号：US15962899
申请日：2018-04-25
发明人： Teppei Kojio , Koji Motomura , Hiroki Maruo
IPC分类号： B23K35/36 , H01L23/00 , B23K35/365 , B23K35/362 , H01L23/31
摘要： The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.
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