公开(公告)号：US20080316764A1

公开(公告)日：2008-12-25

申请号：US12093607

申请日：2006-11-09

申请人： Ralph Hubert Peters ,  Marc Andre De Samber ,  Koen Van Os ,  Norbertus Antonius Maria Sweegers ,  Egbert Lenderink ,  Johannes Antonius Adrianus Maria Van Heeswijk ,  Johann-Josef Kohl

发明人： Ralph Hubert Peters ,  Marc Andre De Samber ,  Koen Van Os ,  Norbertus Antonius Maria Sweegers ,  Egbert Lenderink ,  Johannes Antonius Adrianus Maria Van Heeswijk ,  Johann-Josef Kohl

IPC分类号： F21V7/00 ,  B60Q1/00

CPC分类号： F21S41/43 ,  F21S41/143 ,  F21S41/147 ,  F21S41/19 ,  F21Y2115/10

摘要： An LED module is described with a base 10 made out of a heat conducting material. An LED element (32) is arranged in a cavity (11) of the base. A collimator reflector (70) is formed by reflective surfaces (24, 64, 66a). Three of these reflective surfaces (66a, 66b, 64) are provided on a plastic insert (60) received in the cavity (11). A further reflective surface (24) is provided on the base (10) itself. This surface (24) has a straight border line (50). The collimator reflector (70) is arranged to reflect light from the LED (32) so that a cut-off (72) is formed by the straight border line (50). By thus integrating the cut-off, as the most critical optical element, into the base (10) itself, high accuracy is achieved.

摘要翻译： LED模块被描述为具有由导热材料制成的基座10。 LED元件（32）布置在基座的空腔（11）中。 准直反射器（70）由反射表面（24,64,66a）形成。 这些反射表面（66a，66b，64）中的三个设置在容纳在空腔（11）中的塑料插入件（60）上。 另一反射表面（24）设置在基座（10）上。 该表面（24）具有直线边界线（50）。 准直反射器（70）被布置成反射来自LED（32）的光，使得由直线边界线（50）形成截止线（72）。 通过这样将作为最关键的光学元件的截止元件集成到基座（10）本身中，实现了高精度。

公开(公告)号：US20080278061A1

公开(公告)日：2008-11-13

申请号：US11570906

申请日：2005-06-23

申请人： Marc Andre De Samber ,  Christoph Gerard August Hoelen ,  Eric Cornelis Egbertus Van Grunsven ,  Koen Van Os

发明人： Marc Andre De Samber ,  Christoph Gerard August Hoelen ,  Eric Cornelis Egbertus Van Grunsven ,  Koen Van Os

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2224/0401

摘要： The present invention relates to a LED module (10) comprising a substrate (12), at least one LED chip (20) mounted on a first side of said substrate, and an optical element (21) covering the LED chip(s) (20). The substrate (12) is further provided with at least one via channel (22) extending from the first side of the substrate to a second opposite side of the substrate, whereby the via channel(s) is provided with conducting means for electrically connecting the at least one LED chip (20) to a control circuit (32). By providing the substrate with via channels with conducting means, the control circuit may be connected at the second side (the bottom side) or at the edge of the substrate. Thus, no top mounted electrical interface is required from the substrate, which is advantageous with respect to miniaturization, light emission, etcetera.

摘要翻译： 本发明涉及一种LED模块（10），其包括基板（12），安装在所述基板的第一侧上的至少一个LED芯片（20）和覆盖所述LED芯片的光学元件（21） 20）。 衬底（12）还设置有从衬底的第一侧延伸到衬底的第二相对侧的至少一个通孔（22），由此通孔通道设置有用于电连接 至少一个LED芯片（20）连接到控制电路（32）。 通过为基板提供具有导电装置的通孔，控制电路可以在基板的第二侧（底侧）或边缘处连接。 因此，从衬底不需要顶部安装的电接口，这对于小型化，发光等是有利的。

公开(公告)号：US20100012367A1

公开(公告)日：2010-01-21

申请号：US11722342

申请日：2005-12-14

申请人： Marc Andre De Samber ,  Koen Van Os

发明人： Marc Andre De Samber ,  Koen Van Os

IPC分类号： H05K1/11

CPC分类号： H05K1/0206 ,  H05K1/0263 ,  H05K2201/09509 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/09781

摘要： The present invention relates to a printed circuit board arrangement with a multi-layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).

摘要翻译： 本发明涉及具有多层衬底（1,2）的印刷电路板装置，该多层衬底具有埋入导体（4）和与该导体（4）连接的接触区域（3） 底物。 为了改善掩埋导体的冷却，金属冷却区域（6）设置在导体（4）上方，并通过一个或多个通孔导体（7）与导体连接。

公开(公告)号：US08541797B2

公开(公告)日：2013-09-24

申请号：US11719240

申请日：2005-11-14

申请人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

发明人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

IPC分类号： H01L27/15

CPC分类号： H01L33/60 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An illuminator includes a substrate, a structured conductive layer applied to one surface of the substrate, and at least one light source connected to the structured conductive layer. The illuminator further includes an unstructured reflective layer applied on top of the structured conductive layer. The unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source.

摘要翻译： 照明器包括衬底，施加到衬底的一个表面的结构化导电层和连接到结构化导电层的至少一个光源。 照明器还包括施加在结构化导电层顶部上的非结构化反射层。 所述非结构化反射层至少在所述至少一个光源的周围具有基本上连续的延伸。

公开(公告)号：US20090078948A1

公开(公告)日：2009-03-26

申请号：US11719240

申请日：2005-11-14

申请人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

发明人： Christoph Gerard August Hoelen ,  Antonius Constant Johanna Cornelis Van Den Ackerveken ,  Cornelius Franciscus Jozef Rutjes ,  Koen Van Os ,  Marc Andre De Samber ,  Theodoor Cornelis Treurniet

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.

摘要翻译： 本发明涉及一种包括衬底（12），施加到衬底的一个表面的结构化导电层（16）和连接到结构化导电层的至少一个光源（18,26）的照明器（10）。 照明器的特征在于，其还包括施加在所述结构化导电层顶部上的非结构化反射层（24），所述非结构化反射层至少在所述至少一个光源的周围具有基本上连续的延伸。 由于非结构化的反射层，可以提高照明器的光学效率。 本发明还涉及一种用于制造这种照明器的方法。

公开(公告)号：US20080203897A1

公开(公告)日：2008-08-28

申请号：US11912346

申请日：2006-04-21

申请人： Marc Andre De Samber ,  Koen Van Os

发明人： Marc Andre De Samber ,  Koen Van Os

IPC分类号： H01J1/62 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source comprising a substrate (1) having a first side and an opposing second side, at least one recess (2) being arranged in said first side of said substrate, a circuitry (4) at least partly arranged on said substrate (1), and at least one LED (3) being arranged in said at least one recess (2) and connected to said circuitry (4) is provided. The surface of said at least one recess (2) is continuous and is physically separated from said second side by substrate material. By arranging the LED in such a recess in the substrate, cross talk between adjacent LEDs is reduced, a good mechanical stability of the light source is maintained, and the thermal path through the substrate is reduced.

摘要翻译： 一种光源，包括具有第一侧和相对的第二侧的衬底（1），至少一个凹槽（2）布置在所述衬底的所述第一侧中，至少部分地布置在所述衬底（1）上的电路 ），并且设置在所述至少一个凹部（2）中并连接到所述电路（4）的至少一个LED（3）。 所述至少一个凹部（2）的表面是连续的，并且通过基底材料与所述第二侧物理分离。 通过将LED布置在基板的这种凹部中，相邻LED之间的串扰减少，保持了良好的光源的机械稳定性，并且减小了通过基板的热路径。

公开(公告)号：US09743521B2

公开(公告)日：2017-08-22

申请号：US13496539

申请日：2010-09-10

申请人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

发明人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC分类号： F21V9/00 ,  H05K1/18 ,  F21S2/00 ,  H05B33/08 ,  F21V23/06 ,  G02F1/1335 ,  H01L25/075 ,  H05K1/11 ,  F21Y115/10 ,  F21Y113/13

CPC分类号： H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

公开(公告)号：US20120170265A1

公开(公告)日：2012-07-05

申请号：US13496539

申请日：2010-09-10

申请人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

发明人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC分类号： F21V9/00 ,  F21V21/00 ,  F21V29/00 ,  F21V7/00

CPC分类号： H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

摘要翻译： 包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c），沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。 每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。 光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列， ，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光 沿着发光模块的第一延伸方向（X1）的源序列。

公开(公告)号：US20090040595A1

公开(公告)日：2009-02-12

申请号：US11718405

申请日：2005-11-03

申请人： Marc Andre De Samber ,  Michiel De Jong ,  Antonius Johannes Maria Nellissen ,  Nicolaas Johannes Anthonius Van Veen

发明人： Marc Andre De Samber ,  Michiel De Jong ,  Antonius Johannes Maria Nellissen ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： G02F1/00 ,  B23P11/00

CPC分类号： G03F7/70283 ,  G03F7/70291 ,  G03F7/70825 ,  Y10T29/49826

摘要： For the production of a SLM device, one mounts a spatial light modulator (SLM) (2) on a substrate (3) of the same material as the main material of the SLM (2) to be juxtaposed with the substrate (3). Particularly, silicon based SLMs (2) are mounted on a silicon substrate (3). This leads to arrays of SLMs (2) that maintain a high accuracy with respect to position of the SLMs (2) and planarity. To further improve the planarity, it is preferred to mount the SLMs (2) on the substrate (3) by soldering, using the self-aligning effect of solder connections (20).

摘要翻译： 为了制造SLM器件，将与空间光调制器（SLM）（2）安装在与衬底（3）并置的SLM（2）的主要材料相同材料的衬底（3）上。 特别地，硅基SLM（2）安装在硅衬底（3）上。 这导致SLM（2）的阵列相对于SLM（2）的位置和平面度保持高精度。 为了进一步提高平面性，优选使用焊料连接（20）的自对准效果通过焊接将SLM（2）安装在基板（3）上。

公开(公告)号：US06890797B2

公开(公告)日：2005-05-10

申请号：US10067425

申请日：2002-02-04

申请人： Nicolaas Johannes Anthonius Van Veen ,  Marc Andre De Samber ,  Thomas Weiss

发明人： Nicolaas Johannes Anthonius Van Veen ,  Marc Andre De Samber ,  Thomas Weiss

IPC分类号： H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/274 ,  H01L2224/81005 ,  H01L2224/81136 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2224/05599

摘要： The invention relates to the manufacture of a semiconductor device (10) which is suitable for surface mounting of a semiconductor body (1) provided with connection regions (2) for, for example, a diode.In a method, a flexible foil (6) comprises a conductor pattern (4) and an insulating layer (3), and is detachably secured, on the side of the conductor pattern (4), to a substrate (7).

摘要翻译： 本发明涉及适用于半导体本体（1）的表面安装的半导体器件（10）的制造，所述半导体器件（1）具有用于例如二极管的连接区域（2）。 在一种方法中，柔性箔（6）包括导体图案（4）和绝缘层（3），并且在导体图案（4）侧面上可拆卸地固定到基底（7）上。