公开(公告)号：US06890797B2

公开(公告)日：2005-05-10

申请号：US10067425

申请日：2002-02-04

申请人： Nicolaas Johannes Anthonius Van Veen ,  Marc Andre De Samber ,  Thomas Weiss

发明人： Nicolaas Johannes Anthonius Van Veen ,  Marc Andre De Samber ,  Thomas Weiss

IPC分类号： H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/274 ,  H01L2224/81005 ,  H01L2224/81136 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/29099 ,  H01L2224/05599

摘要： The invention relates to the manufacture of a semiconductor device (10) which is suitable for surface mounting of a semiconductor body (1) provided with connection regions (2) for, for example, a diode.In a method, a flexible foil (6) comprises a conductor pattern (4) and an insulating layer (3), and is detachably secured, on the side of the conductor pattern (4), to a substrate (7).

摘要翻译： 本发明涉及适用于半导体本体（1）的表面安装的半导体器件（10）的制造，所述半导体器件（1）具有用于例如二极管的连接区域（2）。 在一种方法中，柔性箔（6）包括导体图案（4）和绝缘层（3），并且在导体图案（4）侧面上可拆卸地固定到基底（7）上。

公开(公告)号：US20100164079A1

公开(公告)日：2010-07-01

申请号：US11993266

申请日：2006-06-23

申请人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： H01L23/488 ,  H01L21/56 ,  H01L23/28

CPC分类号： H01L24/16 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/6835 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y02P80/30 ,  H01L2924/00

摘要： The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.

摘要翻译： 组件（100）包括横向受限的半导体衬底区域（15），其中限定了电气元件（20）。 其中存在互连结构（21）。 在其第一侧（101）处设置有用于联接到电气设备（30）的接触焊盘（25,26），并且在其第二侧（102）处提供与电气元件（11）的连接（20）。 端子（52,53）存在于互连结构（21）的第二侧（102）处，并通过横向移位并与半导体衬底区域隔离的延伸部（22,23）耦合到互连结构（21） （15）。 电气装置（30）组装到互连结构（21）的第一侧（101），以及在互连结构（21）的第一侧（101）上延伸以便支撑它的封装（40） 存在电气装置（30）的封装。

公开(公告)号：US20090040595A1

公开(公告)日：2009-02-12

申请号：US11718405

申请日：2005-11-03

申请人： Marc Andre De Samber ,  Michiel De Jong ,  Antonius Johannes Maria Nellissen ,  Nicolaas Johannes Anthonius Van Veen

发明人： Marc Andre De Samber ,  Michiel De Jong ,  Antonius Johannes Maria Nellissen ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： G02F1/00 ,  B23P11/00

CPC分类号： G03F7/70283 ,  G03F7/70291 ,  G03F7/70825 ,  Y10T29/49826

摘要： For the production of a SLM device, one mounts a spatial light modulator (SLM) (2) on a substrate (3) of the same material as the main material of the SLM (2) to be juxtaposed with the substrate (3). Particularly, silicon based SLMs (2) are mounted on a silicon substrate (3). This leads to arrays of SLMs (2) that maintain a high accuracy with respect to position of the SLMs (2) and planarity. To further improve the planarity, it is preferred to mount the SLMs (2) on the substrate (3) by soldering, using the self-aligning effect of solder connections (20).

摘要翻译： 为了制造SLM器件，将与空间光调制器（SLM）（2）安装在与衬底（3）并置的SLM（2）的主要材料相同材料的衬底（3）上。 特别地，硅基SLM（2）安装在硅衬底（3）上。 这导致SLM（2）的阵列相对于SLM（2）的位置和平面度保持高精度。 为了进一步提高平面性，优选使用焊料连接（20）的自对准效果通过焊接将SLM（2）安装在基板（3）上。

公开(公告)号：US20080278061A1

公开(公告)日：2008-11-13

申请号：US11570906

申请日：2005-06-23

申请人： Marc Andre De Samber ,  Christoph Gerard August Hoelen ,  Eric Cornelis Egbertus Van Grunsven ,  Koen Van Os

发明人： Marc Andre De Samber ,  Christoph Gerard August Hoelen ,  Eric Cornelis Egbertus Van Grunsven ,  Koen Van Os

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2224/0401

摘要： The present invention relates to a LED module (10) comprising a substrate (12), at least one LED chip (20) mounted on a first side of said substrate, and an optical element (21) covering the LED chip(s) (20). The substrate (12) is further provided with at least one via channel (22) extending from the first side of the substrate to a second opposite side of the substrate, whereby the via channel(s) is provided with conducting means for electrically connecting the at least one LED chip (20) to a control circuit (32). By providing the substrate with via channels with conducting means, the control circuit may be connected at the second side (the bottom side) or at the edge of the substrate. Thus, no top mounted electrical interface is required from the substrate, which is advantageous with respect to miniaturization, light emission, etcetera.

摘要翻译： 本发明涉及一种LED模块（10），其包括基板（12），安装在所述基板的第一侧上的至少一个LED芯片（20）和覆盖所述LED芯片的光学元件（21） 20）。 衬底（12）还设置有从衬底的第一侧延伸到衬底的第二相对侧的至少一个通孔（22），由此通孔通道设置有用于电连接 至少一个LED芯片（20）连接到控制电路（32）。 通过为基板提供具有导电装置的通孔，控制电路可以在基板的第二侧（底侧）或边缘处连接。 因此，从衬底不需要顶部安装的电接口，这对于小型化，发光等是有利的。

公开(公告)号：US09034493B2

公开(公告)日：2015-05-19

申请号：US12953980

申请日：2010-11-24

申请人： Romano Hoofman ,  Coen Tak ,  Marc Andre De Samber

发明人： Romano Hoofman ,  Coen Tak ,  Marc Andre De Samber

IPC分类号： H01L23/498 ,  H01L23/14 ,  H01L23/58 ,  B81C1/00 ,  H01M10/04 ,  H01L23/00 ,  H01M10/0562 ,  H01M10/46

CPC分类号： H01L23/49855 ,  B81B2201/0235 ,  B81B2207/015 ,  B81B2207/03 ,  B81C1/00246 ,  H01L23/145 ,  H01L23/58 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01M10/0436 ,  H01M10/0562 ,  H01M10/46 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Consistent with an example embodiment, there is an apparatus comprising a carrier, a laminated battery provided on a major surface of the carrier, and an integrated circuit. The laminated battery includes a bottom electrode layer, an electrolyte layer, and a top electrode layer. The integrated circuit is connected to the bottom electrode layer and the top electrode layer. The integrated circuit is surrounded by the laminated battery on the major surface of the carrier.

摘要翻译： 与示例性实施例一致，存在包括载体，设置在载体的主表面上的层叠电池和集成电路的装置。 叠层电池包括底电极层，电解质层和顶电极层。 集成电路连接到底电极层和顶电极层。 集成电路被载体的主表面上的层叠电池包围。

公开(公告)号：US08622578B2

公开(公告)日：2014-01-07

申请号：US11909825

申请日：2006-03-22

申请人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Eggink

发明人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Eggink

IPC分类号： F21S4/00

CPC分类号： H05B33/26 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/189 ,  H01L2924/00

摘要： A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.

摘要翻译： 一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的​​电极 所述LED（3）。 结构化导电层包括多个散热焊盘（8），每个散热焊盘具有明显大于每个LED（3）的面积的面积，并且每个LED（3a）被热连接到所述焊盘（8a）中的至少一个， 并且在两个焊盘（8a，8b）之间串联电连接。 通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。 由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。 通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。

公开(公告)号：US20120170265A1

公开(公告)日：2012-07-05

申请号：US13496539

申请日：2010-09-10

申请人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

发明人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC分类号： F21V9/00 ,  F21V21/00 ,  F21V29/00 ,  F21V7/00

CPC分类号： H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

摘要翻译： 包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c），沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。 每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。 光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列， ，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光 沿着发光模块的第一延伸方向（X1）的源序列。

公开(公告)号：US20100012367A1

公开(公告)日：2010-01-21

申请号：US11722342

申请日：2005-12-14

申请人： Marc Andre De Samber ,  Koen Van Os

发明人： Marc Andre De Samber ,  Koen Van Os

IPC分类号： H05K1/11

CPC分类号： H05K1/0206 ,  H05K1/0263 ,  H05K2201/09509 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/09781

摘要： The present invention relates to a printed circuit board arrangement with a multi-layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).

摘要翻译： 本发明涉及具有多层衬底（1,2）的印刷电路板装置，该多层衬底具有埋入导体（4）和与该导体（4）连接的接触区域（3） 底物。 为了改善掩埋导体的冷却，金属冷却区域（6）设置在导体（4）上方，并通过一个或多个通孔导体（7）与导体连接。

公开(公告)号：US20080316764A1

公开(公告)日：2008-12-25

申请号：US12093607

申请日：2006-11-09

申请人： Ralph Hubert Peters ,  Marc Andre De Samber ,  Koen Van Os ,  Norbertus Antonius Maria Sweegers ,  Egbert Lenderink ,  Johannes Antonius Adrianus Maria Van Heeswijk ,  Johann-Josef Kohl

发明人： Ralph Hubert Peters ,  Marc Andre De Samber ,  Koen Van Os ,  Norbertus Antonius Maria Sweegers ,  Egbert Lenderink ,  Johannes Antonius Adrianus Maria Van Heeswijk ,  Johann-Josef Kohl

IPC分类号： F21V7/00 ,  B60Q1/00

CPC分类号： F21S41/43 ,  F21S41/143 ,  F21S41/147 ,  F21S41/19 ,  F21Y2115/10

摘要： An LED module is described with a base 10 made out of a heat conducting material. An LED element (32) is arranged in a cavity (11) of the base. A collimator reflector (70) is formed by reflective surfaces (24, 64, 66a). Three of these reflective surfaces (66a, 66b, 64) are provided on a plastic insert (60) received in the cavity (11). A further reflective surface (24) is provided on the base (10) itself. This surface (24) has a straight border line (50). The collimator reflector (70) is arranged to reflect light from the LED (32) so that a cut-off (72) is formed by the straight border line (50). By thus integrating the cut-off, as the most critical optical element, into the base (10) itself, high accuracy is achieved.

摘要翻译： LED模块被描述为具有由导热材料制成的基座10。 LED元件（32）布置在基座的空腔（11）中。 准直反射器（70）由反射表面（24,64,66a）形成。 这些反射表面（66a，66b，64）中的三个设置在容纳在空腔（11）中的塑料插入件（60）上。 另一反射表面（24）设置在基座（10）上。 该表面（24）具有直线边界线（50）。 准直反射器（70）被布置成反射来自LED（32）的光，使得由直线边界线（50）形成截止线（72）。 通过这样将作为最关键的光学元件的截止元件集成到基座（10）本身中，实现了高精度。

公开(公告)号：US20080225523A1

公开(公告)日：2008-09-18

申请号：US11909825

申请日：2006-03-22

申请人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Jan Eggink

发明人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Jan Eggink

IPC分类号： F21V21/00 ,  F21V29/00

CPC分类号： H05B33/26 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/189 ,  H01L2924/00

摘要： A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.

摘要翻译： 一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的​​电极 所述LED（3）。 结构化导电层包括多个散热焊盘（8），每个散热焊盘的面积明显大于每个LED（3）的面积，并且每个LED（3a）热连接到所述焊盘（8）中的至少一个 a），并且在两个焊盘（8a，8b）之间串联电连接。 通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。 由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。 通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。