Light Emitting Diode Module
    1.
    发明申请
    Light Emitting Diode Module 审中-公开
    发光二极管模块

    公开(公告)号:US20080278061A1

    公开(公告)日:2008-11-13

    申请号:US11570906

    申请日:2005-06-23

    IPC分类号: H01L33/00

    摘要: The present invention relates to a LED module (10) comprising a substrate (12), at least one LED chip (20) mounted on a first side of said substrate, and an optical element (21) covering the LED chip(s) (20). The substrate (12) is further provided with at least one via channel (22) extending from the first side of the substrate to a second opposite side of the substrate, whereby the via channel(s) is provided with conducting means for electrically connecting the at least one LED chip (20) to a control circuit (32). By providing the substrate with via channels with conducting means, the control circuit may be connected at the second side (the bottom side) or at the edge of the substrate. Thus, no top mounted electrical interface is required from the substrate, which is advantageous with respect to miniaturization, light emission, etcetera.

    摘要翻译: 本发明涉及一种LED模块(10),其包括基板(12),安装在所述基板的第一侧上的至少一个LED芯片(20)和覆盖所述LED芯片的光学元件(21) 20)。 衬底(12)还设置有从衬底的第一侧延伸到衬底的第二相对侧的至少一个通孔(22),由此通孔通道设置有用于电连接 至少一个LED芯片(20)连接到控制电路(32)。 通过为基板提供具有导电装置的通孔,控制电路可以在基板的第二侧(底侧)或边缘处连接。 因此,从衬底不需要顶部安装的电接口,这对于小型化,发光等是有利的。

    PRINTED CIRCUIT BOARD ARRANGEMENT
    4.
    发明申请
    PRINTED CIRCUIT BOARD ARRANGEMENT 审中-公开
    印刷电路板布置

    公开(公告)号:US20100012367A1

    公开(公告)日:2010-01-21

    申请号:US11722342

    申请日:2005-12-14

    IPC分类号: H05K1/11

    摘要: The present invention relates to a printed circuit board arrangement with a multi-layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).

    摘要翻译: 本发明涉及具有多层衬底(1,2)的印刷电路板装置,该多层衬底具有埋入导体(4)和与该导体(4)连接的接触区域(3) 底物。 为了改善掩埋导体的冷却,金属冷却区域(6)设置在导体(4)上方,并通过一个或多个通孔导体(7)与导体连接。

    Light Source Comprising Led Arranged in Recess
    6.
    发明申请
    Light Source Comprising Led Arranged in Recess 审中-公开
    光源包括安装在凹陷中的LED

    公开(公告)号:US20080203897A1

    公开(公告)日:2008-08-28

    申请号:US11912346

    申请日:2006-04-21

    IPC分类号: H01J1/62 H01L33/00

    摘要: A light source comprising a substrate (1) having a first side and an opposing second side, at least one recess (2) being arranged in said first side of said substrate, a circuitry (4) at least partly arranged on said substrate (1), and at least one LED (3) being arranged in said at least one recess (2) and connected to said circuitry (4) is provided. The surface of said at least one recess (2) is continuous and is physically separated from said second side by substrate material. By arranging the LED in such a recess in the substrate, cross talk between adjacent LEDs is reduced, a good mechanical stability of the light source is maintained, and the thermal path through the substrate is reduced.

    摘要翻译: 一种光源,包括具有第一侧和相对的第二侧的衬底(1),至少一个凹槽(2)布置在所述衬底的所述第一侧中,至少部分地布置在所述衬底(1)上的电路 ),并且设置在所述至少一个凹部(2)中并连接到所述电路(4)的至少一个LED(3)。 所述至少一个凹部(2)的表面是连续的,并且通过基底材料与所述第二侧物理分离。 通过将LED布置在基板的这种凹部中,相邻LED之间的串扰减少,保持了良好的光源的机械稳定性,并且减小了通过基板的热路径。