公开(公告)号：US20130270701A1

公开(公告)日：2013-10-17

申请号：US13539269

申请日：2012-06-29

申请人： Randolph Cruz ,  Nikhil Vishwanath Kelkar

发明人： Randolph Cruz ,  Nikhil Vishwanath Kelkar

IPC分类号： H01L23/49 ,  H01L21/28

CPC分类号： H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor package comprises a bond pad formed on a first semiconductor die, a surface of the bond pad exposed through an opening in a passivation layer on the first semiconductor die; a raised conductive area formed on top of a passivation layer on a second semiconductor die; and a bond wire having a first end coupled to the bond pad via a ball bond and a second end coupled directly to a surface of the raised conductive area via a stitch bond. The raised conductive area is comprised of a plurality of metal layers, each of the metal layers comprised of a respective material and having a respective thickness. The thickness and material of at least one of the plurality of metal layers is selected such that a hardness of the raised conductive area is at least as hard as a hardness of the bond wire.

摘要翻译： 半导体封装包括形成在第一半导体管芯上的接合焊盘，接合焊盘的表面通过第一半导体管芯上的钝化层中的开口暴露; 形成在第二半导体管芯上的钝化层的顶部上的凸起的导电区域; 以及接合线，其具有经由球接合耦合到接合焊盘的第一端，以及通过针脚接合直接连接到凸起的导电区域的表面的第二端。 凸起的导电区域由多个金属层组成，每个金属层由相应的材料组成并具有相应的厚度。 选择多个金属层中的至少一个的厚度和材料，使得凸起导电区域的硬度至少等于接合线的硬度。

公开(公告)号：US20130099366A1

公开(公告)日：2013-04-25

申请号：US13446489

申请日：2012-04-13

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49541 ,  H01L2224/32245

摘要： Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.

公开(公告)号：US5915149A

公开(公告)日：1999-06-22

申请号：US882230

申请日：1997-06-25

申请人： David G. Anderson ,  John H. Looney ,  Thomas Acquaviva ,  Randolph Cruz

发明人： David G. Anderson ,  John H. Looney ,  Thomas Acquaviva ,  Randolph Cruz

IPC分类号： B65H5/02 ,  G03G15/00

CPC分类号： G03G15/6558 ,  G03G15/1665 ,  G03G15/235

摘要： A ball-on-belt transport includes a belt with a steel ball positioned on top of the belt and a magnet on the back side of the belt with the ball forming a nip with the belt to provide necessary normal force against a conveyed sheet and thereby allowing easy lateral pulling of sheets in clearing jams from the nip. Alternatively, a steel ball is retained while in contact with a belt to apply a normal force to a sheet on the belt equal to the weight of the steel ball. The ball is encased in a housing that is surrounded by a solenoid coil such that when current is applied to the coil, it acts as a solenoid and raises the ball off the belt surface and thus releases the nip pressure.

摘要翻译： 球形皮带传送器包括具有位于皮带顶部的钢球的皮带和皮带后侧的磁体，其中球与皮带形成辊隙，以对传送的薄片提供必要的法向力，从而 允许在清除夹缝中的卡纸时容易地横向拉动纸张。 或者，钢球在与皮带接触的同时被保持，以对钢带上的片材施加与钢球重量相等的法向力。 球被包围在由螺线管线圈包围的壳体中，使得当电流施加到线圈时，其用作螺线管并将球从皮带表面提升，从而释放压区压力。

公开(公告)号：US08035221B2

公开(公告)日：2011-10-11

申请号：US12250525

申请日：2008-10-13

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/12

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using a copper clip that include a structural portion that is received within a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a halfetch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and also effect a reliable mechanical connection.

摘要翻译： 具有芯片的引线框架使用铜夹将管芯上的高电流导电区域连接到引线框接触件，该铜夹子包括结构部分，该结构部分被容纳在形成在引线框接触件中的凹槽状“ 以符合夹子的几何形状。 在优选实施例中，通过蚀刻制造的引线框架结构包括至少一个触点，其是接收夹结构的一端并通过粘合剂保持在桶中的半凹槽或“凹槽”。 容纳在桶中的夹子的端部在后续处理期间保持就位，直到夹子和引线框架经历回流焊以实现足以处理当前负载的电连接并且还实现可靠的机械连接。

公开(公告)号：US08035206B2

公开(公告)日：2011-10-11

申请号：US12252332

申请日：2008-10-15

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like “tub” formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and/or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by “drawing” at least one of the parts against a “stop” surface.

摘要翻译： 具有芯片的引线框架使用铜夹夹住管芯上的高电流导电区域，引线框架接触件包括形成在引线框接触件中的凹陷状“桶”的结构部分。 在优选实施例中，通过蚀刻制造的引线框架结构包括至少一个触点，其是接受夹子结构的一端并通过焊膏或粘合剂保持在桶中的半蚀刻凹槽或“凹槽”。 容纳在桶中的夹子的端部在随后的处理期间保持就位，直到夹子和引线框架经历回流焊，以实现足以处理当前负载的电连接并且还实现可靠的机械连接。 一个或多个焊料保持袋形成在桶的表面部分和/或夹子的端部，其被容纳在桶中，使得在焊料回流步骤期间形成的液化焊料的体积将导致任何错误对准 部件通过将“至少一个”零件“相对于”停止“表面”绘制“。

公开(公告)号：US5850589A

公开(公告)日：1998-12-15

申请号：US939895

申请日：1997-09-29

申请人： Randolph Cruz ,  Thomas Acquaviva

发明人： Randolph Cruz ,  Thomas Acquaviva

IPC分类号： B41F23/02 ,  B65H37/00 ,  G03G15/00 ,  G03G15/01 ,  G03G15/20 ,  G03G21/00

CPC分类号： G03G15/6573 ,  B41F23/02 ,  B65H37/00 ,  B65H2301/5142 ,  B65H2515/21 ,  G03G2215/00421 ,  G03G2215/00662 ,  G03G2215/0067 ,  G03G2215/00759

摘要： A device for adding controlled amounts of moisture to one or both sides of a copy sheet. The device includes a pair of water jets, a reservoir for storing a quantity of liquid and connected to the water jet, a pair of generally cylindrical, pressure rolls, each having an outer cylindrical surface with the rolls being aligned with respect to one another along their axes so as to define a nip between the outer cylindrical surfaces, and a controller for controlling application of water from the water jets to selected portions of each sheet passing thereunder before each sheet enters the nip formed between the outer cylindrical surfaces. Alternatively, the water jets could apply the liquid to the cylindrical surfaces of the pressure rolls.

摘要翻译： 用于在复印纸的一面或两面添加受控量的水分的装置。 该装置包括一对水射流，用于储存一定数量的液体并连接到水射流的储存器，一对大致圆柱形的压力辊，每个压力辊具有一个外圆柱形表面，其中辊相对于彼此对准 它们的轴线在外圆柱形表面之间限定一个辊隙，以及一个控制器，用于控制在每个纸片进入形成在外圆柱形表面之间的压区之前，将水从喷水喷射到每个纸张的选定部分的位置。 或者，水射流可以将液体施加到压力辊的圆柱形表面。

公开(公告)号：US08206836B2

公开(公告)日：2012-06-26

申请号：US12699811

申请日：2010-02-03

申请人： Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

发明人： Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

IPC分类号： H01L23/495 ,  H05K13/04

CPC分类号： H01L23/49562 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/37 ,  H01L24/38 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/12188 ,  Y10T428/12354 ,  H01L2924/00014

摘要： A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.

摘要翻译： 具有沿着其侧面形成的提升管或柱的导电夹具包括形成在提升管或柱中的切口或开口，以形成第一提升管或后部段，以及由连接杆延伸通过的切口或开口分开的第二提升管或后部段。 导电夹具组织将适合于形成为用于在集成电路封装环境中的导电夹子的自动化机器组装的这种导电夹的细长条带。

公开(公告)号：US20090121330A1

公开(公告)日：2009-05-14

申请号：US12250525

申请日：2008-10-13

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using copper clip that include a structure portion that is received with a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection.

摘要翻译： 具有芯片的引线框架将裸片上的高电流导电区域连接到使用铜夹的引线框架触点，铜夹具包括结构部分，该结构部分被形成在引线框接触件中的凹陷状“桶” 符合夹子的几何形状。 在优选实施例中，通过蚀刻制造的引线框架结构包括至少一个触点，其是接收夹结构的一端并通过粘合剂保持在桶中的半蚀刻凹槽或“凹槽”。 容纳在桶中的夹子的端部在随后的处理期间保持就位，直到夹子和引线框架经历回流焊，以实现足以处理当前负载的电连接并且还实现可靠的机械连接。

公开(公告)号：US08592963B2

公开(公告)日：2013-11-26

申请号：US13251846

申请日：2011-10-03

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame having a die thereon connects a conductive area on the die to a lead frame contact using a conductive clip that includes a structural portion that is received with a recess-like “tub” formed in the lead frame contact. The end of the clip received in the tub is held in place during subsequent handling by a solder paste deposit until the clip and leadframe undergo solder reflow to effect a reliable electrical connection. The effective surface area between one side of the clip and the other side of the clip within the tub is different so that the surface tension of the liquefied solder formed during the solder reflow step will “draw” the clip into a preferred alignment against a “stop” surface.

摘要翻译： 具有芯片的引线框架使用导电夹子将管芯上的导电区域连接到引线框架触点，该导电夹子包括形成在引线框接触件中的凹陷状“桶”的结构部分。 在随后通过焊膏沉积处理期间，容纳在桶中的夹子的端部被保持在适当的位置，直到夹子和引线框架经历回流焊以实现可靠的电连接。 夹子的一侧和桶内的夹子的另一侧之间的有效表面积是不同的，使得在焊料回流步骤期间形成的液化焊料的表面张力将“拉”到优选的对齐“ 停止“表面。

公开(公告)号：US08575747B2

公开(公告)日：2013-11-05

申请号：US13189074

申请日：2011-07-22

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/12

CPC分类号： H01L23/49524 ,  H01L23/3142 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys.

摘要翻译： 夹子互连件包括柱形部件，桥接部件和锁定部件。 桥部分具有多个侧面。 柱状部分和桥接部分构造成在柱状部分和桥接部分之间的界面处形成一个角度。 锁定特征位于桥接部分的多个侧面中的至少一个中。 锁定特征包括齿和谷的交替图案。