公开(公告)号：US08206836B2

公开(公告)日：2012-06-26

申请号：US12699811

申请日：2010-02-03

Applicant: Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

Inventor： Loyde M. Carpenter, Jr. ,  Randolph Cruz ,  Nikhil Kelkar

IPC: H01L23/495 ,  H05K13/04

CPC classification number: H01L23/49562 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/37 ,  H01L24/38 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/12188 ,  Y10T428/12354 ,  H01L2924/00014

Abstract: A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.

Abstract translation: 具有沿着其侧面形成的提升管或柱的导电夹具包括形成在提升管或柱中的切口或开口，以形成第一提升管或后部段，以及由连接杆延伸通过的切口或开口分开的第二提升管或后部段。 导电夹具组织将适合于形成为用于在集成电路封装环境中的导电夹子的自动化机器组装的这种导电夹的细长条带。

公开(公告)号：US20110033724A1

公开(公告)日：2011-02-10

申请号：US12699811

申请日：2010-02-03

Applicant: Loyde M. Carpenter, JR. ,  Randolph Cruz ,  Nikhil Kelkar

Inventor： Loyde M. Carpenter, JR. ,  Randolph Cruz ,  Nikhil Kelkar

IPC: H01L23/495

CPC classification number: H01L23/49562 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/37 ,  H01L24/38 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/12188 ,  Y10T428/12354 ,  H01L2924/00014

Abstract: A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.

Abstract translation: 具有沿着其侧面形成的提升管或柱的导电夹具包括形成在提升管或柱中的切口或开口，以形成第一提升管或后部段，以及由连接杆延伸通过的切口或开口分开的第二提升管或后部段。 导电夹具组织将适合于形成为用于在集成电路封装环境中的导电夹子的自动化机器组装的这种导电夹的细长条带。

公开(公告)号：US09717146B2

公开(公告)日：2017-07-25

申请号：US13536827

申请日：2012-06-28

Applicant: Jian Yin ,  Nikhil Kelkar ,  Loyde M. Carpenter, Jr. ,  Nattorn Pongratananukul ,  Patrick J. Selby ,  Steven R. Rivet ,  Michael W. Althar

Inventor： Jian Yin ,  Nikhil Kelkar ,  Loyde M. Carpenter, Jr. ,  Nattorn Pongratananukul ,  Patrick J. Selby ,  Steven R. Rivet ,  Michael W. Althar

IPC: H05K1/18 ,  H01L23/49 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00

CPC classification number: H05K1/18 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

公开(公告)号：US07253078B1

公开(公告)日：2007-08-07

申请号：US10224291

申请日：2002-08-19

Applicant: Luu T. Nguyen ,  Hau T. Nguyen ,  Viraj A. Patwardhan ,  Nikhil Kelkar ,  Shahram Mostafazadeh

Inventor： Luu T. Nguyen ,  Hau T. Nguyen ,  Viraj A. Patwardhan ,  Nikhil Kelkar ,  Shahram Mostafazadeh

IPC: H01L21/44

CPC classification number: H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/27 ,  H01L24/73 ,  H01L24/92 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/1131 ,  H01L2224/1141 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2732 ,  H01L2224/274 ,  H01L2224/2747 ,  H01L2224/27515 ,  H01L2224/27849 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/05552 ,  H01L2224/27 ,  H01L2224/11

Abstract: An apparatus and method for forming a layer of underfill adhesive on an integrated circuit in wafer form is described. In one embodiment, the layer of underfill adhesive is disposed and partially cured on the active surface of the wafer. Once the underfill adhesive has partially cured, the wafer is singulated. The individual integrated circuits or die are then mounted onto a substrate such as a printed circuit board. When the solder balls of the integrated circuit are reflowed to form joints with corresponding contact pads on the substrate, the underfill adhesive reflows and is completely cured. In an alternative embodiment, the underfill adhesive is fully cured after it is disposed onto the active surface of the wafer.

Abstract translation: 描述了一种在晶片形式的集成电路上形成底层填料层的装置和方法。 在一个实施例中，底层填充粘合剂层被设置并部分地固化在晶片的活性表面上。 一旦底部填充粘合剂已部分固化，则晶片被切割。 然后将各个集成电路或管芯安装到诸如印刷电路板的基板上。 当集成电路的焊球回流以形成与基板上的相应接触焊盘的接头时，底部填充粘合剂回流并完全固化。 在替代实施例中，底部填充粘合剂在其被设置在晶片的有效表面之后被完全固化。

公开(公告)号：US06468892B1

公开(公告)日：2002-10-22

申请号：US09616475

申请日：2000-07-14

Applicant: Mark Harrison Baker ,  Nikhil Kelkar

Inventor： Mark Harrison Baker ,  Nikhil Kelkar

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Flip chips with improved solder bump strength are provided. A solder mask layer is placed and patterned on a front side of a wafer of semiconductor chips with semiconductor devices and bond pads. The solder mask is patterned to expose the bond pads. Solder bumps are electrically connected to the bond pads. The solder mask is thick enough to extend up to at least a quarter of the solder bumps and is in contact with the solder bumps. The wafer is then cut into individual chips. The chips may be sold to customers, who may mount the chip on a substrate without underfill.

Abstract translation: 提供了具有改善的焊料凸块强度的翻转芯片。 在具有半导体器件和接合焊盘的半导体芯片的晶片的正面上放置并图案化焊接掩模层。 图案化焊接掩模以暴露接合焊盘。 焊接凸块电连接到接合焊盘。 焊接掩模厚度足以延伸至至少四分之一的焊料凸块并与焊料凸块接触。 然后将晶片切成单独的芯片。 这些芯片可能会被销售给客户，他们可以将芯片安装在基板上，而不需要底部填充。

公开(公告)号：US06238949B1

公开(公告)日：2001-05-29

申请号：US09336037

申请日：1999-06-18

Applicant: Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

Inventor： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

IPC: H01L2144

CPC classification number: H01L24/17 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.

Abstract translation: 公开了一种用于形成芯片上的塑料芯片模块的方法和装置。 通过将堆叠的芯片组放置在适当地布置成接收密封剂的模制室中来形成芯片上的塑料芯片模块。 堆叠的芯片组包括电子和机械耦合到母芯片的子芯片，其中子芯片通过间隙与母芯片直接对准并与母芯片分离。 然后将封装剂填充到填充间隙的模制室中，同时围绕芯片组以形成芯片上的塑料芯片模块。

公开(公告)号：US20120098090A1

公开(公告)日：2012-04-26

申请号：US13069789

申请日：2011-03-23

Applicant: Francois Hebert ,  Shea Petricek ,  Nikhil Kelkar

Inventor： Francois Hebert ,  Shea Petricek ,  Nikhil Kelkar

IPC: H01L29/92 ,  H01L21/56

CPC classification number: H01L23/49589 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16265 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3718 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48265 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power converter device comprises a substrate, a power die mounted on the substrate, and a capacitor die mounted over the power die in a stacked configuration. The capacitor die is electrically coupled to the power die. A packaging material encapsulates the power die and the capacitor die. An integrated circuit die can also be mounted to the substrate and electrically coupled to the power die to receive power signals from the power die, with the packaging material also encapsulating the integrated circuit die.

Abstract translation: 功率转换器装置包括衬底，安装在衬底上的功率管芯和以堆叠构造安装在功率管芯上的电容器管芯。 电容器管芯电耦合到功率管芯。 封装材料封装了电源管芯和电容器管芯。 集成电路管芯也可以安装到衬底上并且电耦合到功率管芯以从功率管芯接收功率信号，封装材料也封装集成电路管芯。

公开(公告)号：US20100259766A1

公开(公告)日：2010-10-14

申请号：US12499693

申请日：2009-07-08

Applicant: Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

Inventor： Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

IPC: G01B11/14 ,  B23K26/38

CPC classification number: H01L25/167 ,  H01L33/58 ,  H01L2224/49171

Abstract: Provided herein are optical sensor devices, methods for making the same, and systems including the same. An optical sensor device, according to an embodiment, includes a light detector die and a light source die attached to the same or different die attachment substrates so that there is a space between the light source die and the light detector die. A light transmissive material covers the light detector die, the light source die and at least a portion of the space between the light detector die and the light source die. A groove is formed (e.g., saw, blade or laser cut, or cast) in the light transmissive material between the light detector die and the light source die, and an opaque material is put within the groove to provide a light barrier between the light detector die and the light source die.

Abstract translation: 本文提供了光学传感器装置及其制造方法，以及包括该传感器装置的系统。 根据实施例的光学传感器装置包括光检测器管芯和附接到相同或不同的管芯附接衬底的光源管芯，使得在光源管芯和光检测器管芯之间存在空间。 透光材料覆盖光检测器管芯，光源管芯和光检测器管芯与光源管芯之间的至少一部分空间。 在光检测器管芯和光源管芯之间的透光材料中形成凹槽（例如，锯，刀片或激光切割或铸造），并且将不透明材料放置在凹槽内以在光线之间提供光屏障 检测器管芯和光源管芯。

公开(公告)号：US07923300B2

公开(公告)日：2011-04-12

申请号：US12477818

申请日：2009-06-03

Applicant: David B. Bell ,  Francois Hebert ,  Nikhil Kelkar

Inventor： David B. Bell ,  Francois Hebert ,  Nikhil Kelkar

IPC: H01L21/00

CPC classification number: H01L27/088 ,  H01L21/26513 ,  H01L21/823437 ,  H01L21/823487 ,  H01L23/535 ,  H01L23/62 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/66696 ,  H01L29/66712 ,  H01L29/66734 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/7816 ,  H01L29/7835 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  H01L2924/00

Abstract: A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.

Abstract translation: 功率转换器可以包括具有可形成在单个管芯（“PowerDie”）上的高侧器件和低侧器件的输出电路。 功率转换器还可以包括形成在不同管芯上的控制器集成电路（IC），其可以与PowerDie电耦合并与其一体化。 PowerDie可以附接到引线框架的管芯焊盘，并且控制器IC管芯可以附接到第一管芯的有源表面，使得第一管芯插在控制器IC管芯和管芯焊盘之间。

公开(公告)号：US20100258712A1

公开(公告)日：2010-10-14

申请号：US12499723

申请日：2009-07-08

Applicant: Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

Inventor： Lynn K. Wiese ,  Nikhil Kelkar ,  Viraj Patwardhan

IPC: H01L31/0232 ,  H01L33/00 ,  H01L21/00

CPC classification number: H01L25/167 ,  H01L33/58 ,  H01L2224/49171

Abstract: An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.

Abstract translation: 光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。 光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量 如果将透光盖板放置在传感器上方，则会产生反射。 此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少 如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。 此外，偏心透镜可以覆盖光源的一部分。