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1.发明授权Anti-skew mounting pads and processing method for electronic surface mount components 失效防倾斜安装垫和电子表面贴装元件的加工方法
公开(公告)号：US5663529A
公开(公告)日：1997-09-02
申请号：US528369
申请日：1995-09-14
CPC分类号： H05K1/0209 , H05K1/111 , H05K3/341 , H05K2201/09381 , H05K2201/09427 , H05K2201/09781 , H05K2201/10166 , H05K2201/10969 , H05K2203/048 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144
摘要： A footprint, and method for forming the footprint, of the type for mounting a surface mount component having a heatsink which defines a first registration edge thereon. The substrate pad is positioned on the substrate for registrated engagement with the heatsink. The substrate pad has an area substantially larger than the area of the heatsink to improve the dissipation of thermal energy. The substrate pad includes notches for defining registration edges which are juxtaposed with corresponding registration edges on the heatsink when the electronic component is in proper alignment with the substrate pad. Surface tension forces produced by melting solder interposed between the heatsink and the substrate pad act upon the registration edges to maintain proper alignment of the component with the substrate pad.
摘要翻译： 用于形成用于安装具有限定其上的第一对准边缘的散热器的表面安装部件的类型的覆盖区和方法。 衬底垫定位在衬底上以与散热器配准接合。 衬底焊盘的面积明显大于散热器的面积，以改善热能耗散。 衬底焊盘包括用于定义配准边缘的凹口，当电子部件与衬底焊盘正确对准时，它们与散热器上的对应配准边缘并置。 通过熔化置于散热器和基板焊盘之间的焊料产生的表面张力作用在对准边缘上，以保持部件与基板焊盘的适当对准。
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公开(公告)号：US06303872B1
公开(公告)日：2001-10-16
申请号：US08882482
申请日：1997-06-25
IPC分类号： H01R909
CPC分类号： H05K3/3442 , H01L2224/0401 , H01L2224/04026 , H01L2224/16105 , H01L2224/16238 , H01L2924/384 , H05K2201/10636 , H05K2203/0465 , Y02P70/611 , Y02P70/613
摘要： An electronic circuit assembly having anti-tombstoning solder joints, including: a substrate 10 having at least one mounting pad 20 thereon; an SMD 30 having at least one termination 40; and at least one solder joint 50 connecting each termination 40 to its respective mounting pad 20. Each solder joint 50 is convex in shape, having a continuous and substantially circular arcuate outer profile 60 and covering substantially all of the mounting pad 20 and substantially all of a top portion 42 of each termination 40. Each mounting pad 20 has a predetermined length lp and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD 30 when at least one solder joint 50 is in a molten state.
摘要翻译： 一种具有防抱死焊点的电子电路组件，包括：衬底10，其上具有至少一个安装垫20; 具有至少一个终端40的SMD 30; 以及至少一个将每个终端40连接到其相应的安装垫20的焊接接头50.每个焊接接头50的形状是凸的，具有连续且大致圆弧形的外轮廓60，并且基本上覆盖所有的安装垫20， 每个端子40的顶部42.每个安装垫20具有预定的长度lp，并且每个焊点具有预定体积的焊料选择，使得当至少一个焊点 50处于熔融状态。
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公开(公告)号：US5931371A
公开(公告)日：1999-08-03
申请号：US784333
申请日：1997-01-16
申请人： Yi-Hsin Pao , Chan-Jiun Jih , Jun Ming Hu , Vivek Amir Jairazbhoy , Richard Keith McMillan, II , Xu Song
发明人： Yi-Hsin Pao , Chan-Jiun Jih , Jun Ming Hu , Vivek Amir Jairazbhoy , Richard Keith McMillan, II , Xu Song
CPC分类号： H01L24/81 , B23K35/0244 , H05K3/3421 , H05K3/3442 , H01L2224/13111 , H01L2224/17517 , H01L2224/81136 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H05K2201/10166 , H05K2201/10636 , H05K2201/10689 , H05K2201/10727 , H05K2201/10992 , H05K2201/2036 , H05K3/305 , Y02P70/611 , Y02P70/613
摘要： A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.
摘要翻译： 用于将部件接合到基板的方法将基底焊接部分施加到基板，并在基底焊接部分中提供支撑焊接部分。 隔离焊料部分具有比基底焊料部分更高的熔化温度和基本上对应于部件和基板之间期望的间隔高度的高度。 该部件位于支座焊接部分上，并且基底焊料部分在回流条件下熔化以在部件和基板之间形成焊接接头。 该接头基本上封装了支座焊接部分，其中回流条件在基底焊料部分和支座焊接部分之间产生树枝状结构。
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4.发明授权Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips 失效优化的焊点和升降垫，以提高表面贴装芯片的焊接寿命
公开(公告)号：US5936846A
公开(公告)日：1999-08-10
申请号：US786389
申请日：1997-01-16
CPC分类号： H05K3/3442 , H05K2201/09427 , H05K2201/09781 , H05K2201/10636 , H05K2203/0465 , H05K2203/306 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.
摘要翻译： 这里公开了一种表面贴装印刷电路板，其具有衬底，至少一个表面贴装器件，每个器件至少两个安装焊盘，将器件的端子连接到其相应的安装焊盘的焊点，至少一个矩形升降器垫 在安装焊盘之间的衬底，以及每个升降器衬垫上与接触器件的底表面的焊料质量。 安装垫的内部和外部延伸部分，升降器垫的尺寸，数量和形状以及沉积在安装和升降器垫上的焊料的量被设计成使得焊接接头具有优选的凸形外圆角，该装置是 保持在安装焊盘上方的预定高度处，内圆角保持在预定的最小角度以上以增加焊点裂纹的起始时间，并且总的焊点裂纹扩展长度增加。 替代实施例还包括在升降器垫和/或安装垫之下的插入通孔，其中气囊被捕获在焊料块/焊接接头和堵塞的通孔之间。 这种被捕获的气体袋在回流焊时在SMD上提供额外的浮力。
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5.发明授权
公开(公告)号：US5842275A
公开(公告)日：1998-12-01
申请号：US524097
申请日：1995-09-05
申请人： Richard Keith McMillan, II , Vivek Amir Jairazbhoy , Robert Joseph Gordon , George Albert Garfinkel
发明人： Richard Keith McMillan, II , Vivek Amir Jairazbhoy , Robert Joseph Gordon , George Albert Garfinkel
CPC分类号： H01L24/81 , H05K1/0206 , H05K1/113 , H05K3/341 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H05K1/0272 , H05K2201/09036 , H05K2201/091 , H05K2201/0959 , H05K2201/10166 , H05K2201/10651 , H05K2201/10969 , H05K2203/0455 , H05K2203/1178 , H05K3/0061 , H05K3/0094 , H05K3/42 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.
摘要翻译： 将电子部件表面安装在其上承载有平面印刷电路的支撑绝缘板的一侧上的接合焊盘的方法，该焊盘通过使用经受一个或多个气体捕获的焊料材料连接到板上的一个或多个导体 通孔通孔，包括：（a）在印刷电路的顶面下方形成至少一个通气通道，并且从位于或接近其中一个通孔的位置延伸到基本上接近焊料材料周边的位置， 放在其上 （b）在部件和焊盘之间种植焊料的沉积物; （c）使部件，焊料和焊盘一起形成组件; 和（d）加热组件以将焊料材料短暂地回流到位，而不会移动，倾斜或倾斜组件，允许所述一个通孔中的任何被捕获的空气膨胀并通过通道迁移至至少外围 垫。
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6.发明授权
公开(公告)号：US5639013A
公开(公告)日：1997-06-17
申请号：US363768
申请日：1994-12-23
IPC分类号： H05K3/34
CPC分类号： H05K3/3442 , H05K2201/09427 , H05K2201/10636 , H05K2201/2081 , H05K2203/0465 , Y02P70/611 , Y02P70/613
摘要： A method for improving the reliability of solder joints is disclosed for use in reflow soldering. In the method, a predetermined amount of solder is applied to at least two solder pads on a circuit board and a component having at least two terminals is fixed in relation to the solder pads. The solder is melted so that the component floats to a predetermined height above the solder pads and, when solidified, the solder fillet formed at each terminal holds the component a predetermined height above the circuit board and forms a convex shape.
摘要翻译： 公开了一种用于提高焊点可靠性的方法，用于回流焊接。 在该方法中，将预定量的焊料施加到电路板上的至少两个焊盘，并且具有至少两个端子的部件相对于焊盘固定。 焊料熔化，使得部件浮动到焊盘上方的预定高度，并且当固化时，形成在每个端子处的焊接圆角将部件保持在电路板上方的预定高度并形成凸形。
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公开(公告)号：US06449839B1
公开(公告)日：2002-09-17
申请号：US09655986
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
发明人： Andrew Z. Glovatsky , Thomas Krautheim , Robert E. Belke, Jr. , Vivek Amir Jairazbhoy , Cuong V. Pham
IPC分类号： H05K302
CPC分类号： H05K3/4084 , H05K1/056 , H05K3/062 , H05K3/4092 , H05K3/44 , H05K3/445 , H05K2201/0305 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09554 , H05K2203/0195 , H05K2203/063 , Y10T29/49128 , Y10T29/49144 , Y10T29/49156
摘要： A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.
摘要翻译： 一种用于在多层电子电路板10内形成连接的方法。在一个非限制性实施例中，该方法包括在电路板10的部分上选择性地形成空气桥，并用冶金接合工具选择性地折叠气桥， 电路板10的互连层。
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8.发明授权公开(公告)号：US06274407B1
公开(公告)日：2001-08-14
申请号：US09619546
申请日：2000-07-19
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2924/01048 , H01L2924/01083 , H01L2924/0132 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.
摘要翻译： 用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙 尺寸。 在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合 并且随后固化粘结材料。
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公开(公告)号：US06169253A
公开(公告)日：2001-01-02
申请号：US09093079
申请日：1998-06-08
IPC分类号： H05K118
CPC分类号： H05K3/3452 , H05K3/3442 , H05K3/3484 , H05K2201/0989 , H05K2201/10166 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49144
摘要： There is disclosed herein an electronic circuit assembly, such as a printed circuit board, having solder resist windows with one or more enlarged solder resist pullback zones, thereby facilitating solder paste overprinting.
摘要翻译： 这里公开了一种电子电路组件，例如印刷电路板，其具有具有一个或多个扩大的阻焊剂回拉区的阻焊窗，从而便于焊膏叠印。
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公开(公告)号：US6115262A
公开(公告)日：2000-09-05
申请号：US93025
申请日：1998-06-08
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/0939 , H05K2201/10636 , H05K2203/0465 , H05K3/3484 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.
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