公开(公告)号：US08501547B2

公开(公告)日：2013-08-06

申请号：US13567366

申请日：2012-08-06

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC分类号： H01L21/56

CPC分类号： A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US07709961B2

公开(公告)日：2010-05-04

申请号：US11924486

申请日：2007-10-25

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC分类号： H01L29/40

CPC分类号： A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US20100197082A1

公开(公告)日：2010-08-05

申请号：US12726274

申请日：2010-03-17

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC分类号： H01L21/56

CPC分类号： A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US20120309134A1

公开(公告)日：2012-12-06

申请号：US13567366

申请日：2012-08-06

申请人： Robert J Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

发明人： Robert J Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC分类号： H01L21/56

CPC分类号： A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（IBAD）形成的氧化铝之类的绝缘体中，并且具有从器件上的接触焊盘延伸到密封层中的孔的生物相容性导电层的堆叠。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US08258635B2

公开(公告)日：2012-09-04

申请号：US12726274

申请日：2010-03-17

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Honggang Jiang

IPC分类号： H01L23/29

CPC分类号： A61N1/375 ,  A61N1/3754 ,  H01L23/291 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/04953 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.

摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。

公开(公告)号：US08322027B1

公开(公告)日：2012-12-04

申请号：US11926498

申请日：2007-10-29

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K1/00

CPC分类号： H05K3/06 ,  A61N1/0543 ,  H05K1/118 ,  H05K3/0041 ,  H05K3/28 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0554 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/1163 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

摘要翻译： 一种制造柔性电路电极阵列的方法，包括：a）在所述绝缘体聚合物基底层上沉积包含基底涂层，导电层和顶部涂层的金属迹线层; b）在所述金属迹线层上施加一层光致抗蚀剂，并图案化所述金属迹线层并在所述绝缘体聚合物基底层上形成金属迹线; c）激活所述绝缘体聚合物基层并沉积顶部绝缘体聚合物层并与所述基础绝缘体聚合物层形成单个绝缘聚合物层; d）在所述绝缘体聚合物层的表面上施加薄金属层和光致抗蚀剂层，并选择性地蚀刻所述绝缘体层和所述顶部涂层以获得至少一个通孔; 和e）用电极材料填充所述通孔。 放置一层聚合物。 将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。 将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。 因此阵列及其供电电缆由单体形成。 或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。 该方法提供了聚合物基底层和聚合物顶层之间的极好的粘合性，并且痕迹金属和电极的绝缘性。

公开(公告)号：US08374698B2

公开(公告)日：2013-02-12

申请号：US11893939

申请日：2007-08-18

申请人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

发明人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

IPC分类号： A61N1/375

CPC分类号： A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.

摘要翻译： 本发明是用于植入人体的改进的密封包装。 可植入装置包括具有导电通孔的非导电基底。 使用导电凸块将倒装芯片电路连接到基板，并电连接到通孔的第一子集。 倒装芯片电路可以包含一个或多个堆叠或折叠堆叠。 引线键合电路也附接到基板并电连接到通孔的第二子集。 盖子粘合到基底上。 盖，衬底和通孔形成改进的用于植入的密封包装。

公开(公告)号：US08406887B2

公开(公告)日：2013-03-26

申请号：US13224104

申请日：2011-09-01

申请人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

发明人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

IPC分类号： A61N1/375

CPC分类号： A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.

公开(公告)号：US20110319963A1

公开(公告)日：2011-12-29

申请号：US13224104

申请日：2011-09-01

申请人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

发明人： Jerry Ok ,  Robert J. Greenberg ,  Neil Hamilton Talbot ,  James Singleton Little ,  Rongqing Dai ,  Jordan Matthew Neysmith ,  Kelly H. McClure

IPC分类号： A61F9/08

CPC分类号： A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

摘要翻译： 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

公开(公告)号：US07914842B1

公开(公告)日：2011-03-29

申请号：US11702735

申请日：2007-02-06

申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Brian V. Mech

发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok ,  Brian V. Mech

IPC分类号： A61N1/04

CPC分类号： H05K3/0011 ,  A61N1/0543 ,  H05K3/0035 ,  H05K3/064 ,  H05K2203/0736 ,  H05K2203/095

摘要： Polymer materials form electrode array bodies for neural stimulation, especially for retinal stimulation to create vision. The method lays down a polymer layer. Apply a metal layer to the polymer and pattern to create electrodes and leads. Apply a second polymer layer over the metal layer and pattern to leave openings for electrodes. The array and its supply cable are a single body. A method for manufacturing a flexible circuit electrode array, is: deposit a metal trace layer on an insulator polymer base layer; apply a layer of photoresist on the metal trace layer and pattern the metal trace layer and form metal traces on the insulator polymer base layer; activate the insulator polymer base layer and deposit a top insulator polymer layer and form a single insulating polymer layer with the base insulator polymer layer; wherein the insulator polymer layers are heated at 80-150° C. and then at 230-350° C.

摘要翻译： 聚合物材料形成用于神经刺激的电极阵列体，特别是用于视网膜刺激以产生视觉。 该方法沉积聚合物层。 将金属层施加到聚合物和图案以产生电极和引线。 在金属层和图案上施加第二聚合物层以留下用于电极的开口。 阵列及其供电电缆是单体。 柔性电路电极阵列的制造方法是：在绝缘体聚合物基层上沉积金属迹线层; 在金属迹线层上施加一层光致抗蚀剂，并对金属迹线层进行图案化并在绝缘体聚合物基层上形成金属迹线; 激活绝缘体聚合物基层并沉积顶绝缘体聚合物层并与基底绝缘体聚合物层形成单个绝缘聚合物层; 其中将绝缘体聚合物层在80-150℃，然后在230-350℃下加热