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    METHOD OF PRODUCING AT LEAST ONE OPTOELECTRONIC SEMICONDUCTOR CHIP
    1.
    发明申请
    METHOD OF PRODUCING AT LEAST ONE OPTOELECTRONIC SEMICONDUCTOR CHIP 有权
    生产至少一个光电半导体芯片的方法

    公开(公告)号：US20140051194A1

    公开(公告)日：2014-02-20

    申请号：US14004442

    申请日：2012-03-12

    申请人： Siegfried Herrmann ,  Stefan Illek

    发明人： Siegfried Herrmann ,  Stefan Illek

    IPC分类号： H01L33/60

    CPC分类号： H01L33/60 ,  H01L24/19 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/46 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/32341 ,  H01L2924/00

    摘要： A method of producing at least one optoelectronic semiconductor chip includes providing at least one optoelectronic structure, including a growth support and a semiconductor layer sequence with an active region, the semiconductor layer sequence being deposited epitaxially on the growth support, providing a carrier, applying the at least one optoelectronic structure onto the carrier with its side remote from the growth support, coating the at least one optoelectronic structure with a protective material, the protective material covering the outer face, remote from the carrier, of the growth support and side faces of the growth support and of the semiconductor layer sequence, and detaching the growth support from the semiconductor layer sequence of the at least one optoelectronic structure.

    摘要翻译： 一种制造至少一个光电子半导体芯片的方法包括：提供至少一个光电结构，包括生长支持体和具有有源区域的半导体层序列，半导体层序列外延地沉积在生长支持体上，提供载体， 至少一个光电结构到其载体上，其侧面远离生长载体，用保护材料涂覆至少一个光电结构，该保护材料覆盖远离载体的生长载体和侧面的外表面 生长支持物和半导体层序列，以及从至少一个光电子结构的半导体层序列分离生长支持物。

    Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component
    5.
    发明授权
    Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component 有权
    光电半导体元件的制造方法以及光电半导体元件

    公开(公告)号：US09276138B2

    公开(公告)日：2016-03-01

    申请号：US13812880

    申请日：2011-07-13

    申请人： Siegfried Herrmann

    发明人： Siegfried Herrmann

    IPC分类号： H01L31/02 ,  H01L27/15 ,  H01L33/62 ,  H01L21/66 ,  H01L33/00

    CPC分类号： H01L31/02 ,  H01L22/14 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of producing an optoelectronic semiconductor component includes arranging a semiconductor layer stack with a pn-junction on a substrate, lateral patterning of the semiconductor layer sack into a plurality of pairs of first semiconductor bodies and second semiconductor bodies spaced from one another in a lateral direction, detaching the substrate from the pairs of first semiconductor bodies and second semiconductor bodies, applying at least one pair of first semiconductor bodies and second semiconductor bodies to a connection carrier including electrical connection points and/or at least one conductor track, and electrically connecting the semiconductor bodies of a pair of first semiconductor bodies and second semiconductor bodies by the connection points and/or the at least one conductor track such that the pn-junction of the first semiconductor body connects in antiparallel to the pn-junction of the second semiconductor body.

    摘要翻译： 一种制造光电子半导体部件的方法包括在衬底上布置具有pn结的半导体层堆叠，将半导体层袋横向图案化成多对第一半导体本体和第二半导体本体，所述第一半导体本体和第二半导体本体在侧向 将所述基板从所述第一半导体体和第二半导体体对分离，将至少一对第一半导体体和第二半导体体施加到包括电连接点和/或至少一个导体轨道的连接载体上，并电连接 通过连接点和/或至少一个导体轨道的一对第一半导体本体和第二半导体本体的半导体本体，使得第一半导体本体的pn结与第二半导体的pn结反向连接 身体。

    LED projector
    8.
    发明授权
    LED projector 有权
    LED投影机

    公开(公告)号：US08733950B2

    公开(公告)日：2014-05-27

    申请号：US13062792

    申请日：2009-09-09

    申请人： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

    发明人： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

    IPC分类号： G03B21/26 ,  H01J1/62 ,  H01J63/04

    CPC分类号： G03B21/2033

    摘要： An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

    摘要翻译： LED投影仪包括多个光源; 以及图像生成器，其包括像素的排列，每个像素包括至少一个光源; 其中所述LED是层叠的epi-LED，其包括不同颜色彼此排列的层，或者每个像素包括发射表面，并且至少两个LED在发射表面中彼此相邻地布置。

    Arrangement with a semiconductor chip and an optical waveguide layer
    9.
    发明授权
    Arrangement with a semiconductor chip and an optical waveguide layer 有权
    与半导体芯片和光波导层的布置

    公开(公告)号：US08393748B2

    公开(公告)日：2013-03-12

    申请号：US12528960

    申请日：2008-01-23

    申请人： Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

    发明人： Siegfried Herrmann ,  Berthold Hahn ,  Joerg Sorg ,  Stefan Gruber

    IPC分类号： F21V33/00

    CPC分类号： G02B6/0055 ,  G02B6/0018 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0076

    摘要： An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.

    摘要翻译： 一种装置，其包括：半导体芯片，其被设计为在操作期间发光;以及覆盖层，其覆盖半导体芯片的发光表面，使得从半导体芯片发射的光穿透到覆盖层。 在覆盖层的与芯片重叠的区域中，提供光偏转结构，通过该偏转结构，穿透到覆盖层中的光被偏转。 覆盖层用作光波导，并被设计成发射光，使得其分布在覆盖层的上表面上。

    Method for producing a luminous device and luminous device
    10.
    发明授权
    Method for producing a luminous device and luminous device 有权
    发光装置及发光装置的制造方法

    公开(公告)号：US08273588B2

    公开(公告)日：2012-09-25

    申请号：US12838075

    申请日：2010-07-16

    申请人： Berthold Hahn ,  Markus Maute ,  Siegfried Herrmann

    发明人： Berthold Hahn ,  Markus Maute ,  Siegfried Herrmann

    IPC分类号： H01L21/00

    CPC分类号： H01L25/167 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/00

    摘要： A method for producing a luminous device is specified. A number of light emitting diodes each have a radiation-transmissive carrier and at least two semiconductor bodies spatially separated from one another. Each semiconductor body is provided for generating electromagnetic radiation. The semiconductor bodies can be driven separately from one another and the semiconductor bodies are arranged at the top side of the radiation-transmissive carrier on the radiation-transmissive carrier. A chip assemblage is composed of CMOS chips each of which has at least two connection locations at its top side. At least one of the light emitting diodes is connected to one of the CMOS chips. The light emitting diode is arranged, at the top side of the radiation-transmissive carrier, at the top side of the CMOS chip and each semiconductor body of the light emitting diode is connected to a connection location of the CMOS chip.

    摘要翻译： 规定了发光装置的制造方法。 多个发光二极管各自具有辐射透射载体和在空间上彼此分离的至少两个半导体体。 每个半导体本体被提供用于产生电磁辐射。 半导体本体可以彼此分开地驱动，并且半导体本体被布置在辐射透射载体上的辐射透射性载体的顶侧。 芯片组合由CMOS芯片组成，每个芯片在其顶侧具有至少两个连接位置。 至少一个发光二极管连接到CMOS芯片之一。 发光二极管在辐射透射载体的顶侧设置在CMOS芯片的顶侧，并且发光二极管的每个半导体本体连接到CMOS芯片的连接位置。