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公开(公告)号：US20090181476A1
公开(公告)日：2009-07-16
申请号：US11972129
申请日：2008-01-10
IPC分类号： H01L21/02
CPC分类号： H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06596 , H01L2924/0002 , H01L2924/00
摘要： A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.
摘要翻译： 一种将包括集成电路的芯片堆叠在基板上的方法，包括将各向异性导电膜（ACF）或焊料填充导电膜施加到其表面上，该表面被配置为电耦合到膜，将芯片 芯片被配置为电耦合到膜，对芯片，膜和表面进行压缩加压，使得芯片经由膜电耦合到表面，测试芯片以确定芯片是否正在操作 通常，如果芯片被确定为不正常工作，重复测试以确定芯片是否正常工作，并且一旦芯片确定正常工作，则将芯片放置在膜上并重复压缩加压， 粘合芯片，薄膜和表面。
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公开(公告)号：US07523852B2
公开(公告)日：2009-04-28
申请号：US11005557
申请日：2004-12-05
申请人： Stephen L. Buchwalter , Claudius Feger , Peter A. Gruber , Sung K. Kang , Paul A. Lauro , Da-Yuan Shih
发明人： Stephen L. Buchwalter , Claudius Feger , Peter A. Gruber , Sung K. Kang , Paul A. Lauro , Da-Yuan Shih
IPC分类号： B23K35/12
CPC分类号： H05K3/3436 , B23K35/26 , H01L24/11 , H01L24/12 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13176 , H01L2224/13181 , H01L2224/13184 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H05K3/3426 , H05K3/3468 , H05K2201/10287 , H05K2201/10992 , H05K2203/0113 , H05K2203/0415 , H05K2203/128 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.
摘要翻译： 改进的互连通过注射成型的焊料生产，该焊料用熔融焊料填充模具阵列，使得形成具有大于1的高宽比宽高比的柱而不是传统的倒装芯片凸块。 该列可以在其中具有填料颗粒或增强导体。 在所生产的互连结构中，减少或避免了后续底部填充步骤的成本和时间。 与芯片之间的光学互连不兼容的问题，因为底部填充物需要高散射光的二氧化硅填料的高负载，因此可以使倒装芯片结合光学互连。
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公开(公告)号：US06924171B2
公开(公告)日：2005-08-02
申请号：US09782494
申请日：2001-02-13
申请人： Stephen L. Buchwalter , David Danovitch , Fuad Elias Doany , Claudius Feger , Peter A. Gruber , Revathi Iyengar , Nancy C. LaBianca
发明人： Stephen L. Buchwalter , David Danovitch , Fuad Elias Doany , Claudius Feger , Peter A. Gruber , Revathi Iyengar , Nancy C. LaBianca
CPC分类号： H01L24/27 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/29 , H01L24/94 , H01L2224/05571 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/19041 , H01L2924/01083 , H01L2924/0665 , H01L2924/00 , H01L2224/05599
摘要： Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.
摘要翻译： 公开了制造微电子互连结构的方法以及通过这些方法形成的结构，其提高了组装倒装芯片半导体器件的制造吞吐量。 在切割之前使用在晶片上施加的聚合物材料的双层，消除了在封装级别为每个半导体分配和固化底部填充物的需要，从而提高制造产量并降低成本。
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公开(公告)号：US20110192887A1
公开(公告)日：2011-08-11
申请号：US13088727
申请日：2011-04-18
IPC分类号： B23K1/20
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
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5.发明授权Sprocket opening alignment process and apparatus for multilayer solder decal 失效用于多层焊料贴花的链轮开口对准工艺和装置公开(公告)号：US07928585B2
公开(公告)日：2011-04-19
申请号：US11869573
申请日：2007-10-09
IPC分类号： H01L23/488
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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公开(公告)号：US08376207B2
公开(公告)日：2013-02-19
申请号：US13367466
申请日：2012-02-07
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。
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公开(公告)号：US20120132694A1
公开(公告)日：2012-05-31
申请号：US13367466
申请日：2012-02-07
IPC分类号： B23K3/06
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。
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公开(公告)号：US07980446B2
公开(公告)日：2011-07-19
申请号：US12399244
申请日：2009-03-06
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。
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9.发明申请Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal 失效用于多层焊料贴花的链轮开口对准工艺和装置公开(公告)号：US20110097892A1
公开(公告)日：2011-04-28
申请号：US12983292
申请日：2011-01-01
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.
摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。
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公开(公告)号：US08162200B2
公开(公告)日：2012-04-24
申请号：US13156736
申请日：2011-06-09
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。
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