RESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    RESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电阻随机存取存储器及其制造方法

    公开(公告)号:US20130252395A1

    公开(公告)日:2013-09-26

    申请号:US13892881

    申请日:2013-05-13

    IPC分类号: H01L45/00

    摘要: Example embodiments relate to a resistive random access memory (RRAM) and a method of manufacturing the RRAM. A RRAM according to example embodiments may include a lower electrode, which may be formed on a lower structure (e.g., substrate). A resistive layer may be formed on the lower electrode, wherein the resistive layer may include a transition metal dopant. An upper electrode may be formed on the resistive layer. Accordingly, the transition metal dopant may form a filament in the resistive layer that operates as a current path.

    摘要翻译: 示例实施例涉及电阻随机存取存储器(RRAM)和制造RRAM的方法。 根据示例性实施例的RRAM可以包括下电极,其可以形成在下结构(例如,衬底)上。 电阻层可以形成在下电极上,其中电阻层可以包括过渡金属掺杂剂。 上电极可以形成在电阻层上。 因此,过渡金属掺杂剂可以在作为电流路径工作的电阻层中形成丝。

    MICROPROCESSOR CHIP, DATA CENTER, AND COMPUTING SYSTEM
    5.
    发明申请
    MICROPROCESSOR CHIP, DATA CENTER, AND COMPUTING SYSTEM 有权
    微处理器芯片,数据中心和计算系统

    公开(公告)号:US20130177323A1

    公开(公告)日:2013-07-11

    申请号:US13611839

    申请日:2012-09-12

    IPC分类号: H04B10/14

    CPC分类号: H04B10/801

    摘要: A microprocessor chip includes a plurality of processors; at least one first optical input/output unit configured to receive optical signals from an external device and transmit optical signals to the external device; and an optical system bus that is connected between the plurality of processors and the at least one first optical input/output unit.

    摘要翻译: 微处理器芯片包括多个处理器; 至少一个第一光输入/输出单元,被配置为从外部设备接收光信号并将光信号传输到所述外部设备; 以及连接在所述多个处理器与所述至少一个第一光学输入/输出单元之间的光学系统总线。

    SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING HOLE INJECTION LAYER
    7.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING HOLE INJECTION LAYER 有权
    半导体发光器件,包括孔注入层

    公开(公告)号:US20150060762A1

    公开(公告)日:2015-03-05

    申请号:US14288824

    申请日:2014-05-28

    IPC分类号: H01L33/00 H01L33/06

    摘要: According to example embodiments, a semiconductor light emitting device includes a first semiconductor layer, a pit enlarging layer on the first semiconductor layer, an active layer on the pit enlarging layer, a hole injection layer, and a second semiconductor layer on the hole injection layer. The first semiconductor layer is doped a first conductive type. An upper surface of the pit enlarging layer and side surfaces of the active layer define pits having sloped surfaces on the dislocations. The pits are reverse pyramidal spaces. The hole injection layer is on a top surface of the active layer and the sloped surfaces of the pits. The second semiconductor layer doped a second conductive type that is different than the first conductive type.

    摘要翻译: 根据示例性实施例,半导体发光器件包括第一半导体层,第一半导体层上的凹坑放大层,凹坑放大层上的有源层,空穴注入层和空穴注入层上的第二半导体层 。 第一半导体层掺杂有第一导电类型。 凹坑扩大层的上表面和活性层的侧表面限定了在位错上具有倾斜表面的凹坑。 凹坑是反锥形空间。 空穴注入层位于有源层的顶表面和凹坑的倾斜表面上。 第二半导体层掺杂与第一导电类型不同的第二导电类型。

    BOTTOM GATE THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    BOTTOM GATE THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    底部薄膜薄膜晶体管及其制造方法

    公开(公告)号:US20070287232A1

    公开(公告)日:2007-12-13

    申请号:US11760043

    申请日:2007-06-08

    IPC分类号: H01L21/84 H01L21/00

    摘要: A method of manufacturing a bottom gate thin film transistor (“TFT”), in which a polycrystalline channel region having a large grain size is formed relatively simply and easily, includes forming a bottom gate electrode on a substrate, forming a gate insulating layer on the substrate to cover the gate electrode, forming an amorphous semiconductor layer on the gate insulating layer, patterning the amorphous semiconductor layer to form an amorphous channel region on the gate electrode, melting the amorphous channel region using a laser annealing method to form a melted amorphous channel region, and crystallizing the melted amorphous channel region to form a laterally grown polycrystalline channel region.

    摘要翻译: 相对简单且容易地形成具有大晶粒尺寸的多晶硅沟道区的底栅薄膜晶体管(“TFT”)的制造方法包括:在基板上形成栅极绝缘层,形成栅极绝缘层 所述基板覆盖所述栅极电极,在所述栅极绝缘层上形成非晶半导体层,图案化所述非晶半导体层以在所述栅电极上形成非晶态沟道区域,使用激光退火方法熔化所述非晶态沟道区域以形成熔融无定形 并使熔融的无定形沟道区域结晶,形成横向生长的多晶沟道区域。

    HYBRID LASER LIGHT SOURCES FOR PHOTONIC INTEGRATED CIRCUITS
    10.
    发明申请
    HYBRID LASER LIGHT SOURCES FOR PHOTONIC INTEGRATED CIRCUITS 有权
    用于光电集成电路的混合激光光源

    公开(公告)号:US20130188904A1

    公开(公告)日:2013-07-25

    申请号:US13614432

    申请日:2012-09-13

    IPC分类号: G02B6/12 H01L21/02

    摘要: A light source for a photonic integrated circuit may comprise a reflection coupling layer formed on a substrate in which an optical waveguide is provided, at least one side of the reflection coupling layer being optically connected to the optical waveguide; an optical mode alignment layer provided on the reflection coupling layer; and/or an upper structure provided on the optical mode alignment layer and including an active layer for generating light and a reflection layer provided on the active layer. A light source for a photonic integrated circuit may comprise a lower reflection layer; an optical waveguide optically connected to the lower reflection layer; an optical mode alignment layer on the lower reflection layer; an active layer on the optical mode alignment layer; and/or an upper reflection layer on the active layer.

    摘要翻译: 用于光子集成电路的光源可以包括形成在其中设置有光波导的基板上的反射耦合层,反射耦合层的至少一侧光学连接到光波导; 设置在反射耦合层上的光学模式取向层; 和/或设置在光学模式对准层上的上部结构,并且包括用于产生光的有源层和设置在有源层上的反射层。 光子集成电路的光源可以包括下反射层; 与下反射层光学连接的光波导; 在下反射层上的光学取向层; 光学对准层上的有源层; 和/或有源层上的上反射层。