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公开(公告)号：US09437574B2
公开(公告)日：2016-09-06
申请号：US14042662
申请日：2013-09-30
申请人： Tu-Anh N. Tran , Chu-Chung Lee
发明人： Tu-Anh N. Tran , Chu-Chung Lee
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/04042 , H01L2224/05017 , H01L2224/05085 , H01L2224/05558 , H01L2224/05624 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48824 , H01L2224/78301 , H01L2224/85181 , H01L2224/85207 , H01L2224/8581 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , Y10T29/49124 , H01L2924/01004 , H01L2924/0102 , H01L2924/01046 , H01L2924/01047 , H01L2924/01026 , H01L2924/01028 , H01L2924/01012 , H01L2924/01016 , H01L2924/00014 , H01L2924/00
摘要： An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located over the dielectric structure. A ball bond electrically couples the bond pad and a bond wire. An intermetallic compound located between the ball bond and bond pad is formed of material of the ball bond and bond pad and electrically couples the bond pad to the ball bond. A portion of the bond pad is vertically located between a portion of the lower portion of the top surface of the dielectric structure and the intermetallic compound. No portion of the bond pad is vertically located between at least a portion of the protrusion portion and the intermetallic compound.
摘要翻译： 电子部件封装包括基板和电介质结构。 电介质结构包括具有突出部分和下部分的顶表面。 突出部位于大于下部的第二高度的第一高度。 导电接合焊盘位于电介质结构之上。 球接合电耦合接合焊盘和接合线。 位于球焊接和焊盘之间的金属间化合物由球焊和焊盘的材料形成，并将焊接焊盘电连接到球焊上。 接合焊盘的一部分垂直地位于电介质结构的顶表面的下部的一部分和金属间化合物之间。 接合焊盘的没有部分垂直地位于突出部分的至少一部分和金属间化合物之间。
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公开(公告)号：US09324675B2
公开(公告)日：2016-04-26
申请号：US14262381
申请日：2014-04-25
CPC分类号： H01L24/49 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/05624 , H01L2224/431 , H01L2224/432 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/45664 , H01L2224/45687 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48451 , H01L2224/48456 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85439 , H01L2224/85444 , H01L2224/85931 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/013 , H01L2924/01047 , H01L2924/01024 , H01L2924/01029 , H01L2924/01079 , H01L2924/01013 , H01L2924/01014 , H01L2924/00013 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.
摘要翻译： 半导体结构包括接合焊盘和耦合到接合焊盘的引线键合。 引线键合包括与接合焊盘接触的键。 引线接合包括在引线键合的表面上的涂层，以及在选定位置的引线键合的第一暴露部分。 引线接合在引线键合的选定位置上没有涂层，并且第一暴露部分的面积为至少一平方微米。
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公开(公告)号：US20150318240A1
公开(公告)日：2015-11-05
申请号：US14267378
申请日：2014-05-01
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/4853 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48228 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
摘要翻译： 一种电子部件封装，其包括具有由铝包铜结构形成的铝接合焊盘的封装基板。 铝包铜结构附着在电介质层上。 电子部件附接到基板并且包括电耦合到铝接合焊盘的导电结构。 铝合金焊盘，电子部件以及基板的至少一部分用密封剂封装。
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公开(公告)号：US08791582B2
公开(公告)日：2014-07-29
申请号：US12844922
申请日：2010-07-28
申请人： Chu-Chung Lee , Kian Leong Chin , Kevin J. Hess , Patrick Johnston , Tu-Anh N. Tran , Heng Keong Yip
发明人： Chu-Chung Lee , Kian Leong Chin , Kevin J. Hess , Patrick Johnston , Tu-Anh N. Tran , Heng Keong Yip
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , H01L21/56 , H01L23/62 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/4911 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19104 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.
摘要翻译： 集成电路封装包括附接到封装支撑件的半导体管芯。 所述管芯具有沿着所述管芯的周边的多个外围接合焊盘和所述管芯的内部部分上的第一接合焊盘，其中所述第一接合焊盘是电源接合焊盘。 导电分布器在模具之上并且在模具的周边内并且具有第一开口。 多个接合焊盘位于模具的周边和导电分配器的周边之间。 第一个焊盘在第一个开口。 第一接合线连接在第一接合焊盘和导电分布器之间。 第二接合线连接在多个外围接合焊盘的第一外围接合焊盘和导电分布器之间。
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5.发明授权Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure 有权一种电子元件封装的铝包铜结构体及一种制造具有铝包铜结构的电子元器件封装的方法公开(公告)号：US09437459B2
公开(公告)日：2016-09-06
申请号：US14267378
申请日：2014-05-01
IPC分类号： H01L21/48 , H01L21/56 , H01L23/498 , H01L23/31
CPC分类号： H01L21/4853 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48228 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
摘要翻译： 一种电子部件封装，其包括具有由铝包铜结构形成的铝接合焊盘的封装基板。 铝包铜结构附着在电介质层上。 电子部件附接到基板并且包括电耦合到铝接合焊盘的导电结构。 铝合金焊盘，电子部件以及基板的至少一部分用密封剂封装。
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公开(公告)号：US20150303169A1
公开(公告)日：2015-10-22
申请号：US14255450
申请日：2014-04-17
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/05644 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48464 , H01L2224/48465 , H01L2224/48507 , H01L2224/78268 , H01L2224/78301 , H01L2224/78303 , H01L2224/85045 , H01L2224/85181 , H01L2224/85444 , H01L2224/85801 , H01L2924/00014 , H01L2924/15747 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A method for forming a semiconductor device includes forming a first ball bond on a first contact pad, in which the first ball bond has a first wire segment of a bonding wire extending from the ball bond; forming a mid-span ball in the first wire segment at a first distance from the ball bond; and after the forming the mid-span ball, attaching the mid-span ball to a second contact pad to form a second ball bond.
摘要翻译： 一种形成半导体器件的方法包括在第一接触焊盘上形成第一球焊，其中第一球焊接具有从球焊接延伸的接合线的第一线段; 在距离球接头的第一距离处在第一线段中形成中跨球; 并且在形成中跨球之后，将中跨球附接到第二接触垫以形成第二球接合。
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公开(公告)号：US20150090480A1
公开(公告)日：2015-04-02
申请号：US14042662
申请日：2013-09-30
申请人： TU-ANH N. TRAN , Chu-Chung Lee
发明人： TU-ANH N. TRAN , Chu-Chung Lee
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/04042 , H01L2224/05017 , H01L2224/05085 , H01L2224/05558 , H01L2224/05624 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48824 , H01L2224/78301 , H01L2224/85181 , H01L2224/85207 , H01L2224/8581 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , Y10T29/49124 , H01L2924/01004 , H01L2924/0102 , H01L2924/01046 , H01L2924/01047 , H01L2924/01026 , H01L2924/01028 , H01L2924/01012 , H01L2924/01016 , H01L2924/00014 , H01L2924/00
摘要： An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located over the dielectric structure. A ball bond electrically couples the bond pad and a bond wire. An intermetallic compound located between the ball bond and bond pad is formed of material of the ball bond and bond pad and electrically couples the bond pad to the ball bond. A portion of the bond pad is vertically located between a portion of the lower portion of the top surface of the dielectric structure and the intermetallic compound. No portion of the bond pad is vertically located between at least a portion of the protrusion portion and the intermetallic compound.
摘要翻译： 电子部件封装包括基板和电介质结构。 电介质结构包括具有突出部分和下部分的顶表面。 突出部位于大于下部的第二高度的第一高度。 导电接合焊盘位于电介质结构之上。 球接合电耦合接合焊盘和接合线。 位于球焊接和焊盘之间的金属间化合物由球焊和焊盘的材料形成，并将焊接焊盘电连接到球焊上。 接合焊盘的一部分垂直地位于电介质结构的顶表面的下部的一部分和金属间化合物之间。 接合焊盘的没有部分垂直地位于突出部分的至少一部分和金属间化合物之间。
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公开(公告)号：US10325876B2
公开(公告)日：2019-06-18
申请号：US14314260
申请日：2014-06-25
IPC分类号： H01L23/00 , H01L23/495 , H01L23/498 , H01L23/532
摘要： The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.
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公开(公告)号：US20100270663A1
公开(公告)日：2010-10-28
申请号：US12599625
申请日：2007-05-10
IPC分类号： H01L23/538 , H01L21/98 , H01L21/50
CPC分类号： H01L23/49816 , H01L23/3128 , H01L23/4951 , H01L23/49833 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48471 , H01L2224/49175 , H01L2224/49433 , H01L2224/4945 , H01L2224/85191 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要： A packaging assembly (30), such as a ball grid array package, is formed which distributes power across an interior region of an integrated circuit die (52) by using an encapsulated patterned leadframe conductor (59) that is disposed over the die (52) and bonded to a plurality of bonding pads (45) formed in a BGA carrier substrate (42) and in the interior die region, thereby electrically coupling the interior die region to an externally provided reference voltage.
摘要翻译： 形成诸如球栅阵列封装的封装组件（30），其通过使用设置在模具（52）上的封装的图案化引线框导体（59）来分布跨集成电路管芯（52）的内部区域的电力 ）并且接合到形成在BGA载体衬底（42）中的多个接合焊盘（45）和内部管芯区域中，从而将内部管芯区域电连接到外部提供的参考电压。
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公开(公告)号：US20150380376A1
公开(公告)日：2015-12-31
申请号：US14314260
申请日：2014-06-25
IPC分类号： H01L23/00 , H01L23/495 , H01L23/498
CPC分类号： H01L24/49 , H01L23/49582 , H01L23/49811 , H01L23/49816 , H01L23/49866 , H01L23/53238 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L2224/02166 , H01L2224/04042 , H01L2224/05082 , H01L2224/05147 , H01L2224/05657 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45657 , H01L2224/45664 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48257 , H01L2224/48463 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48482 , H01L2224/73265 , H01L2224/83101 , H01L2224/85051 , H01L2224/85207 , H01L2224/85801 , H01L2224/92247 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/01075 , H01L2924/013 , H01L2924/00013 , H01L2924/0665 , H01L2924/00
摘要： The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.
摘要翻译： 本公开提供了用于制造用于半导体管芯的封装器件的封装器件和方法的实施例。 一个实施例包括具有完成的接合焊盘的管芯安装结构，该焊接垫在铜焊盘的顶表面上包括铜接合焊盘和含钴层，以及引线键合结构，其结合到钴 - 其中含钴层的含钴材料位于引线键合结构的底表面和铜键合焊盘的顶表面之间，使得含钴材料存在于 引线接合结构的中心部分。
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