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公开(公告)号：US20060289972A1
公开(公告)日：2006-12-28
申请号：US11474406
申请日：2006-06-26
IPC分类号： H01L23/495
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/49811 , H01L23/49833 , H01L24/13 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13027 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/1411 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06558 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/351 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。
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公开(公告)号：US08810043B2
公开(公告)日：2014-08-19
申请号：US13195325
申请日：2011-08-01
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/31 , H01L21/56 , H01L23/498 , H01L25/065
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/49811 , H01L23/49833 , H01L24/13 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13027 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/1411 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06558 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/351 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。
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公开(公告)号：US08404980B2
公开(公告)日：2013-03-26
申请号：US12824117
申请日：2010-06-25
申请人： Takao Nishimura , Kouichi Nakamura
发明人： Takao Nishimura , Kouichi Nakamura
IPC分类号： H05K1/16
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/5382 , H01L23/5386 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48475 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.
摘要翻译： 设置在半导体器件中的中继板包括第一端子和通过布线连接到第一端子的多个第二端子。 连接到第一端子的布线在路上分开，使得布线连接到每个第二端子。
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公开(公告)号：US20100258926A1
公开(公告)日：2010-10-14
申请号：US12824117
申请日：2010-06-25
申请人： Takao Nishimura , Kouichi Nakamura
发明人： Takao Nishimura , Kouichi Nakamura
IPC分类号： H01L23/49 , H01L23/495
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/5382 , H01L23/5386 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48475 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.
摘要翻译： 设置在半导体器件中的中继板包括第一端子和通过布线连接到第一端子的多个第二端子。 连接到第一端子的布线在路上分开，使得布线连接到每个第二端子。
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公开(公告)号：US07687319B2
公开(公告)日：2010-03-30
申请号：US12098710
申请日：2008-04-07
申请人： Takao Nishimura , Kouichi Nakamura
发明人： Takao Nishimura , Kouichi Nakamura
CPC分类号： H01L24/27 , H01L21/563 , H01L21/67126 , H01L21/67144 , H01L21/6715 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/75 , H01L24/83 , H01L24/90 , H01L24/97 , H01L2221/68354 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29 , H01L2224/29012 , H01L2224/29036 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/3003 , H01L2224/30151 , H01L2224/30156 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75317 , H01L2224/756 , H01L2224/75743 , H01L2224/75745 , H01L2224/81001 , H01L2224/81191 , H01L2224/81193 , H01L2224/83001 , H01L2224/8303 , H01L2224/83047 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S1/S0>1 is satisfied, where S0 is the total contact surface area with the substrate of the adhesive supplied to the substrate, and S1 is the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.
摘要翻译： 本发明提供一种制造半导体器件的方法，该方法至少包括将具有多个凸起的电子部件与具有多个与该凸起相对应的焊盘的基板接合的粘合剂，至少部分 电子部件和基板之间的基板通过流延单元将粘合剂流延在基板上，使得满足表达式S1 / S0> 1，其中S0是与 提供给基板的粘合剂的基材S1是在流延之后与粘合剂的基材的总接触表面积，并且在使粘合剂与电子部件和基板接触的同时固化粘合剂， 凸块抵靠接合垫。
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公开(公告)号：US20070075437A1
公开(公告)日：2007-04-05
申请号：US11295472
申请日：2005-12-07
申请人： Takao Nishimura , Kouichi Nakamura
发明人： Takao Nishimura , Kouichi Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/5382 , H01L23/5386 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48475 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85951 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.
摘要翻译： 设置在半导体器件中的中继板包括第一端子和通过布线连接到第一端子的多个第二端子。 连接到第一端子的布线在路上分开，使得布线连接到每个第二端子。
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公开(公告)号：US08076785B2
公开(公告)日：2011-12-13
申请号：US11474406
申请日：2006-06-26
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/49811 , H01L23/49833 , H01L24/13 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13027 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/1411 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06558 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/351 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。
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公开(公告)号：US20110278723A1
公开(公告)日：2011-11-17
申请号：US13195325
申请日：2011-08-01
IPC分类号： H01L23/498
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/49811 , H01L23/49833 , H01L24/13 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13027 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/1411 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2224/81801 , H01L2225/06558 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/351 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05541 , H01L2224/05005
摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。
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公开(公告)号：US20080188058A1
公开(公告)日：2008-08-07
申请号：US12098710
申请日：2008-04-07
申请人： Takao NISHIMURA , Kouichi Nakamura
发明人： Takao NISHIMURA , Kouichi Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L24/27 , H01L21/563 , H01L21/67126 , H01L21/67144 , H01L21/6715 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/75 , H01L24/83 , H01L24/90 , H01L24/97 , H01L2221/68354 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29 , H01L2224/29012 , H01L2224/29036 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/3003 , H01L2224/30151 , H01L2224/30156 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75317 , H01L2224/756 , H01L2224/75743 , H01L2224/75745 , H01L2224/81001 , H01L2224/81191 , H01L2224/81193 , H01L2224/83001 , H01L2224/8303 , H01L2224/83047 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S1/S0>1 is satisfied, where S0 is the total contact surface area with the substrate of the adhesive supplied to the substrate, and S1 is the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.
摘要翻译： 本发明提供一种制造半导体器件的方法，该方法至少包括将具有多个凸起的电子部件与具有多个与该凸起相对应的焊盘的基板接合的粘合剂，至少部分 电子部件和基板之间的基板通过流铸单元将粘合剂流延在基板上，使得表达式S 1 / S 0 < SUB >> 1满足，其中S
是与提供给基板的粘合剂的基材的总接触表面积，S 1 <1是总接触表面积 与流延铸造之后的粘合剂基材一起固化，同时使粘合剂在凸起抵靠接合焊盘的状态下与电子部件和基板接触。 -
公开(公告)号：US08607608B2
公开(公告)日：2013-12-17
申请号：US12527294
申请日：2007-02-20
申请人： Susumu Shioya , Kouichi Nakamura
发明人： Susumu Shioya , Kouichi Nakamura
CPC分类号： B21D7/04
摘要： A bending apparatus (1) is for bending a workpiece (object to be worked), using a bending die (2) formed in accordance with a bent form of the workpiece, and a linear die (3) linearly extended, and includes a table (10) having a work face (11a) where the bending die (2) and the linear die (3) are placed; and a pair of rollers (40, 50) configured to move along the work face (11a), wherein each of the rollers (40, 50) is configured to move from one end side of the bending die (2) and the linear die (3) to the other end side thereof in a state of pinching the bending die (2) and the linear die (3) in a die closing direction. According to this configuration, it is possible to configure the bending apparatus (1), to make a work space small, and to improve the work efficiency of the bending.
摘要翻译： 弯曲装置（1）用于使用根据工件的弯曲形状形成的弯曲模具（2）和线性延伸的线性模具（3）来弯曲工件（待加工物体），并且包括工作台 （10）具有放置弯曲模（2）和线模（3）的工作面（11a） 以及构造成沿着工作面（11a）移动的一对辊（40,50），其中，每个辊（40,50）构造成从弯曲模具（2）的一端侧和直线模具 （3）在模具闭合方向上夹持弯曲模具（2）和线性模具（3）的状态下的另一端侧。 根据该结构，能够构成弯曲装置（1），使工作空间小，提高弯曲加工效率。
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