公开(公告)号：US20050001044A1

公开(公告)日：2005-01-06

申请号：US10494047

申请日：2003-06-18

申请人： Takashi Masuko ,  Akira Mori ,  Toru Yoshihara

发明人： Takashi Masuko ,  Akira Mori ,  Toru Yoshihara

IPC分类号： F01P7/16 ,  F16K31/68 ,  G05D23/13 ,  G05D23/02

CPC分类号： F16K11/02 ,  F01P7/16 ,  F01P2003/027 ,  F01P2037/02 ,  G05D23/134

摘要： A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.

摘要翻译： 一种独立控制两个电路的冷却水通道的恒温器，包括具有恒定连通的第一和第二通道的第一阀体。 选择性地连接到第三通道。 当冷却水温度低于规定温度时，第三通道的通信断开，当冷却水温度等于或高于规定温度时，阀门打开。 具有选择性连通的第四和第五通道的第二阀体在冷却水温度低于规定温度时关闭阀门以断开这些通道，并且当冷却水通过操作第一阀体连接通道而打开阀门 温度等于或高于规定温度。 管状套筒防止分别包括第一和第二阀体的第一和第二控制室彼此连通。

公开(公告)号：US07172135B2

公开(公告)日：2007-02-06

申请号：US10494047

申请日：2003-06-18

申请人： Takashi Masuko ,  Akira Mori ,  Toru Yoshihara

发明人： Takashi Masuko ,  Akira Mori ,  Toru Yoshihara

IPC分类号： G05D23/02 ,  F01P7/14

CPC分类号： F16K11/02 ,  F01P7/16 ,  F01P2003/027 ,  F01P2037/02 ,  G05D23/134

摘要： A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.

摘要翻译： 一种独立控制两个电路的冷却水通道的恒温器，包括具有恒定连通的第一和第二通道的第一阀体。 选择性地连接到第三通道。 当冷却水温度低于规定温度时，第三通道的通信断开，当冷却水温度等于或高于规定温度时，阀门打开。 具有选择性连通的第四和第五通道的第二阀体在冷却水温度低于规定温度时关闭阀门以断开这些通道，并且当冷却水通过操作第一阀体连接通道而打开阀门 温度等于或高于规定温度。 管状套筒防止分别包括第一和第二阀体的第一和第二控制室彼此连通。

公开(公告)号：US5549244A

公开(公告)日：1996-08-27

申请号：US375109

申请日：1995-01-19

申请人： Kazuyuki Kai ,  Masahisa Hamano ,  Hitoshi Homma ,  Akira Mori ,  Takashi Masuko

发明人： Kazuyuki Kai ,  Masahisa Hamano ,  Hitoshi Homma ,  Akira Mori ,  Takashi Masuko

IPC分类号： F01P7/16 ,  F16K31/68 ,  G05D23/13 ,  F01P7/02

CPC分类号： F01P7/16 ,  G05D23/022

摘要： The present disclosure concerns a thermally controlled valve, such as may be installed in the cooling water system of internal combustion engines. The thermally controlled valve eliminates thermal hunting as the temperature of the cooling water increases by restricting the initial flow of cooling water. Subsequently, additional cooling water flow is permitted as the temperature of the cooling water further increases.

摘要翻译： 本公开涉及一种热控阀，例如可以安装在内燃机的冷却水系统中。 由于冷却水的温度通过限制冷却水的初始流量而增加，因此热控制阀消除了热量的捕获。 随后，随着冷却水的温度进一步增加，允许额外的冷却水流动。

公开(公告)号：US20120263946A1

公开(公告)日：2012-10-18

申请号：US13509362

申请日：2010-11-10

申请人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

发明人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Shinjiro Fujii

IPC分类号： B32B7/12 ,  C09J7/02 ,  H01L21/50

CPC分类号： H01L24/27 ,  C08F220/30 ,  H01L21/565 ,  H01L21/67132 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27002 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2224/93 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/2809 ,  Y10T428/31935 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.

摘要翻译： 本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

公开(公告)号：US20110121435A1

公开(公告)日：2011-05-26

申请号：US12863068

申请日：2009-01-09

申请人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

发明人： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

IPC分类号： H01L25/00 ,  C08J3/28 ,  B32B3/30 ,  H01L21/50

CPC分类号： C09J179/08 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08K5/0025 ,  C08K5/3417 ,  C08L79/08 ,  C08L2312/06 ,  C09J7/20 ,  C09J163/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.

摘要翻译： 一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％ 组合物中的整个光引发剂混合物为200℃或更高。

公开(公告)号：US20080176167A1

公开(公告)日：2008-07-24

申请号：US11969358

申请日：2008-01-04

申请人： Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

发明人： Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

IPC分类号： G03F7/004 ,  G03F7/26

CPC分类号： H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US20070098995A1

公开(公告)日：2007-05-03

申请号：US10560073

申请日：2004-06-10

申请人： Takashi Masuko ,  Keisuke Ookubo ,  Keiichi Hatakeyama ,  Masami Yusa

发明人： Takashi Masuko ,  Keisuke Ookubo ,  Keiichi Hatakeyama ,  Masami Yusa

IPC分类号： B32B27/00 ,  C08L63/00 ,  C08L79/08 ,  B32B37/00

CPC分类号： H01L21/6835 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/36 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2221/68395 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00014

摘要： An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.

摘要翻译： 本发明的目的是提供一种芯片粘附粘合剂膜，其可以在低于超薄晶片的保护带的软化温度或切割胶带的温度下层压在晶片的背面上 可以降低晶片的翘曲等热应力，能够简化半导体装置的制造工序，耐热性和耐湿性依赖性优异，粘贴薄膜和切割胶带的粘合片层叠， 以及半导体器件。

公开(公告)号：US5667899A

公开(公告)日：1997-09-16

申请号：US482516

申请日：1995-06-07

申请人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

发明人： Masami Yusa ,  Shinji Takeda ,  Takashi Masuko ,  Yasuo Miyadera ,  Mitsuo Yamazaki

IPC分类号： C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  B32B27/18 ,  C09J7/00

CPC分类号： C08J5/18 ,  C08K3/08 ,  C08L79/08 ,  H01B1/22 ,  C08J2379/08 ,  Y10S428/901 ,  Y10S525/928 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

摘要翻译： 用于将IC或LSI与引线框架接合的导电接合膜。 该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数 至少70摩尔％，与二胺; 和（B）导电填料。 任选地，该膜还可以包含每分子具有至少两个热交联的酰亚胺基的热固性树脂或酰亚胺化合物。

公开(公告)号：US09754603B2

公开(公告)日：2017-09-05

申请号：US13728287

申请日：2012-12-27

申请人： Masanobu Nakamura ,  Takashi Masuko

发明人： Masanobu Nakamura ,  Takashi Masuko

IPC分类号： G10L21/00 ,  G10L15/02 ,  G10L15/20

CPC分类号： G10L21/00 ,  G10L15/02 ,  G10L15/20

摘要： According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature.