摘要:
According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature.
摘要:
According to one embodiment, a speech feature extraction apparatus includes an extraction unit and a calculation unit. The extraction unit extracts speech segments over a predetermined period at intervals of a unit time from either an input speech signal or a plurality of subband input speech signals obtained by extracting signal components of a plurality of frequency bands from the input speech signal, to generate either a unit speech signal or a plurality of subband unit speech signals. The calculation unit calculates either each average time of the unit speech signal in each of the plurality of frequency bands or each average time of each of the plurality of subband unit speech signals to obtain a speech feature.
摘要:
Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
摘要:
A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
摘要:
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.
摘要:
A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.
摘要:
An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.
摘要:
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.