公开(公告)号：US20110024066A1

公开(公告)日：2011-02-03

申请号：US12935153

申请日：2009-03-31

申请人： Takashi Matsumura ,  Kiyoshi Taira ,  Katsuaki Kokubo

发明人： Takashi Matsumura ,  Kiyoshi Taira ,  Katsuaki Kokubo

IPC分类号： D21H21/00

CPC分类号： A47K10/16 ,  D21H21/22 ,  D21H27/002 ,  D21H27/005 ,  Y10T428/24455

摘要： [Problems] It is a main object to provide sanitary thin paper that changes little in hand feel due to ambient humidity[Measure for Solving Problems] This is solved by sanitary thin paper, containing 5 to 40 wt % of thin paper treating agent, which exhibits a fluent liquid state at ordinary temperatures and includes an effective ingredient containing a predetermined amount of moisturizing agent, a predetermined amount of softening agent and 0.001 to 1.0 wt % of hydrophilic high molecular compound.

摘要翻译： [问题]主要目的是提供由于环境湿度而改变手感的卫生薄纸[解决问题的措施]这是由卫生薄纸解决的，含有5〜40重量％的薄纸处理剂，其中 在常温下呈现流动的液体状态，并且包括含有预定量的保湿剂，预定量的软化剂和0.001至1.0重量％的亲水性高分子化合物的有效成分。

公开(公告)号：US08313613B2

公开(公告)日：2012-11-20

申请号：US12935153

申请日：2009-03-31

申请人： Takashi Matsumura ,  Kiyoshi Taira ,  Katsuaki Kokubo

发明人： Takashi Matsumura ,  Kiyoshi Taira ,  Katsuaki Kokubo

IPC分类号： D21F11/00

CPC分类号： A47K10/16 ,  D21H21/22 ,  D21H27/002 ,  D21H27/005 ,  Y10T428/24455

摘要： It is a main object to provide sanitary paper comprising: a base thin paper including 5 to 40 wt % of a treating agent wherein bending rigidity B value is 0.03 to 0.07 g cm2/cm and moisture regain is 4.5 to 6.0 wt %, which are measured at a temperature of 25° C. with a humidity of 40% R.H., and the thin paper includes a fluent liquid state at ordinary temperatures with 70 to 100 wt % of effective ingredient including 1) 80.0 to 97.0 wt % of a moisturizing agent 2) 0.5 to 10.0 wt % of a softening agent selected from anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. 3) 0.001 to 1.0 wt % of a hydrophilic high molecular compound.

摘要翻译： 主要目的在于提供卫生纸，其特征在于，包括：基材薄纸，其含有5〜40重量％的处理剂，其中弯曲刚性B值为0.03〜0.07g·cm / cm，回潮率为4.5〜6.0重量％ 在25℃的温度下在40％RH的湿度下测定，薄纸在常温下包含70〜100重量％的有效成分的流动液体状态，包括1）80.0〜97.0重量％的保湿剂 2）0.5〜10.0重量％的选自阴离子表面活性剂，阳离子表面活性剂，非离子表面活性剂和两性表面活性剂的软化剂。 3）0.001〜1.0重量％的亲水性高分子化合物。

公开(公告)号：US20230289959A1

公开(公告)日：2023-09-14

申请号：US18040008

申请日：2021-07-30

申请人： Tatsuya Niimi ,  Takashi Matsumura ,  Takuya Saito

发明人： Tatsuya Niimi ,  Takashi Matsumura ,  Takuya Saito

IPC分类号： G06T7/00 ,  G16H30/40

CPC分类号： G06T7/0012 ,  G16H30/40 ,  G06T2207/10088

摘要： A three-dimensional object can be produced based on biological property information indicating a biological property obtained by MRE measurement of an organism. The three-dimensional object has a distribution of a strength property corresponding to a distribution of the biological property.

公开(公告)号：US20230264422A1

公开(公告)日：2023-08-24

申请号：US18169986

申请日：2023-02-16

申请人： Yoichi Ito ,  Tsuyoshi Arao ,  Tomomi Akieda ,  Takashi Matsumura

发明人： Yoichi Ito ,  Tsuyoshi Arao ,  Tomomi Akieda ,  Takashi Matsumura

IPC分类号： B29C64/35 ,  B33Y30/00 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/112 ,  B33Y40/00 ,  B33Y10/00

CPC分类号： B29C64/35 ,  B29C64/112 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

摘要： A three-dimensional fabricating apparatus includes a discharge head, a detector, a non-contact cleaner, and a controller. The discharge head discharges droplets to fabricate a three-dimensional object. The detector detects a state of the discharge head. The non-contact cleaner cleans the discharge head in a non-contact manner. The controller controls an operation of the three-dimensional fabricating apparatus according to the state of the discharge head detected by the detector after the non-contact cleaner cleans the discharge head.

公开(公告)号：US10854113B2

公开(公告)日：2020-12-01

申请号：US15450720

申请日：2017-03-06

申请人： Yoshihiro Norikane ,  Tatsuya Niimi ,  Takashi Matsumura ,  Hiroshi Iwata ,  Hiroyuki Naito

发明人： Yoshihiro Norikane ,  Tatsuya Niimi ,  Takashi Matsumura ,  Hiroshi Iwata ,  Hiroyuki Naito

IPC分类号： G09B23/30 ,  B29C64/20 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29L31/00 ,  B29K105/00 ,  B29L31/40

摘要： A solid freeform fabrication object includes a hydrogel including a polymer, water, and a coloring material inclusion substance.

公开(公告)号：US10442181B2

公开(公告)日：2019-10-15

申请号：US15209268

申请日：2016-07-13

申请人： Hiroshi Iwata ,  Tatsuya Niimi ,  Yoshihiro Norikane ,  Takashi Matsumura

发明人： Hiroshi Iwata ,  Tatsuya Niimi ,  Yoshihiro Norikane ,  Takashi Matsumura

IPC分类号： B33Y70/00 ,  B29C64/112 ,  C08K5/053 ,  C08K5/05 ,  B29C64/40 ,  B33Y10/00 ,  B29L31/00

摘要： A hydrogel object includes a polymer and water, wherein the rate of mass loss is not greater than 20 percent by mass when the hydrogel object is left undone for one week at 25 degrees C. and relative humidity of 50 percent.

公开(公告)号：US09368374B2

公开(公告)日：2016-06-14

申请号：US13131427

申请日：2010-02-23

申请人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

发明人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

公开(公告)号：US08802776B2

公开(公告)日：2014-08-12

申请号：US13517415

申请日：2010-12-20

申请人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

发明人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

IPC分类号： C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08L63/00 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K1/0269 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y02P70/613 ,  C08L33/068 ,  C08L61/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).

摘要翻译： 公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。 该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序 相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。 该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和 电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。

公开(公告)号：US08441507B2

公开(公告)日：2013-05-14

申请号：US12880525

申请日：2010-09-13

申请人： Yoshinori Yamaguchi ,  Hirohito Yoneyama ,  Yohei Nishino ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

发明人： Yoshinori Yamaguchi ,  Hirohito Yoneyama ,  Yohei Nishino ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

IPC分类号： G01D15/06

CPC分类号： B41J2/45 ,  G03G15/04045 ,  G03G15/326 ,  G03G2215/0409 ,  G03G2215/0412

摘要： The present invention provides an annular exposure device, including: plural light emitting members that are provided two-dimensionally along an outer circumferential surface of the annular exposure device, the annular exposure device rotating when the annular exposure device contacts a surface of an image holding member.

摘要翻译： 本发明提供了一种环形曝光装置，包括：沿着环形曝光装置的外圆周表面二维设置的多个发光部件，环形曝光装置在环形曝光装置接触图像保持部件的表面时旋转 。

公开(公告)号：US08421339B2

公开(公告)日：2013-04-16

申请号：US12620182

申请日：2009-11-17

申请人： Yohei Nishino ,  Hirohito Yoneyama ,  Yoshinori Yamaguchi ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

发明人： Yohei Nishino ,  Hirohito Yoneyama ,  Yoshinori Yamaguchi ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

IPC分类号： H01L51/52

CPC分类号： B41J2/451 ,  G03G15/04072 ,  G03G15/326 ,  G03G2215/0412 ,  H01L51/5012 ,  H01L2251/564

摘要： An organic electroluminescent device includes: a pair of electrodes; a first light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that one of the pair of electrodes serves as an anode; and a second light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that the other of the pair of electrodes serves as an anode.

摘要翻译： 一种有机电致发光器件包括：一对电极; 第一发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的一个用作阳极; 以及第二发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的另一个用作阳极。