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公开(公告)号：US20130203216A1
公开(公告)日：2013-08-08
申请号：US13792521
申请日：2013-03-11
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L21/48
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
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公开(公告)号：US09349672B2
公开(公告)日：2016-05-24
申请号：US13661927
申请日：2012-10-26
申请人： Tessera, Inc.
发明人： Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
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公开(公告)号：US10833044B2
公开(公告)日：2020-11-10
申请号：US16778899
申请日：2020-01-31
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146 , H01L21/56 , H01L23/538
摘要： Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
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公开(公告)号：US09691731B2
公开(公告)日：2017-06-27
申请号：US14979053
申请日：2015-12-22
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146 , H01L21/56 , H01L23/538
CPC分类号： H01L24/48 , H01L21/56 , H01L23/13 , H01L23/3107 , H01L23/3128 , H01L23/4952 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/73 , H01L25/043 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/14618 , H01L27/14625 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/1713 , H01L2224/17179 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48455 , H01L2224/48464 , H01L2224/49105 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01049 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
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公开(公告)号：US20160211237A1
公开(公告)日：2016-07-21
申请号：US14979053
申请日：2015-12-22
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/00
CPC分类号： H01L24/48 , H01L21/56 , H01L23/13 , H01L23/3107 , H01L23/3128 , H01L23/4952 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/73 , H01L25/043 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/14618 , H01L27/14625 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/1713 , H01L2224/17179 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48455 , H01L2224/48464 , H01L2224/49105 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01049 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
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6.发明授权公开(公告)号：US09093435B2
公开(公告)日：2015-07-28
申请号：US13792521
申请日：2013-03-11
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L21/00 , H01L21/48 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L23/13 , H01L23/495 , H01L21/56
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
摘要翻译： 制造微电子封装的方法包括在具有第一表面和远离其的第二表面的衬底的工艺单元上形成电介质封装层。 微电子元件安装到基板的第一表面，并且多个导电元件暴露在第一表面处，其中至少一些电连接到微电子元件。 导线键具有连接到远离基座的导电元件和端表面的基部，并且限定在基部和端面之间延伸的边缘表面。 封装层形成为至少部分地覆盖第一表面，并且引线接合的部分与引线接合的未封装部分由端盖表面或边缘表面的未被覆盖的部分中的至少一个限定。
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公开(公告)号：US20150091118A1
公开(公告)日：2015-04-02
申请号：US14564640
申请日：2014-12-09
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L25/04 , H01L23/31 , H01L23/00 , H01L27/146
CPC分类号： H01L24/48 , H01L21/56 , H01L23/13 , H01L23/3107 , H01L23/3128 , H01L23/4952 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/73 , H01L25/043 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/14618 , H01L27/14625 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/1713 , H01L2224/17179 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48455 , H01L2224/48464 , H01L2224/49105 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01049 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
摘要翻译： 制造微电子封装的方法包括在具有第一表面和远离其的第二表面的衬底的工艺单元上形成电介质封装层。 微电子元件安装到基板的第一表面，并且多个导电元件暴露在第一表面处，其中至少一些电连接到微电子元件。 导线键具有连接到远离基座的导电元件和端表面的基部，并且限定在基部和端面之间延伸的边缘表面。 封装层形成为至少部分地覆盖第一表面，并且引线接合的部分与引线接合的未封装部分由端盖表面或边缘表面的未被覆盖的部分中的至少一个限定。
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公开(公告)号：US20130249116A1
公开(公告)日：2013-09-26
申请号：US13661927
申请日：2012-10-26
申请人： TESSERA, INC.
发明人： Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。
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公开(公告)号：US20210050322A1
公开(公告)日：2021-02-18
申请号：US17086785
申请日：2020-11-02
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146
摘要： Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
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公开(公告)号：US10593643B2
公开(公告)日：2020-03-17
申请号：US16058425
申请日：2018-08-08
申请人： Tessera, Inc.
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146 , H01L21/56 , H01L23/538
摘要： Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
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