公开(公告)号：US08786070B2

公开(公告)日：2014-07-22

申请号：US13940582

申请日：2013-07-12

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed

IPC分类号： H01L23/02

CPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/48 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/24 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/14181 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25171 ,  H01L2224/2518 ,  H01L2224/29099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/73209 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82105 ,  H01L2224/82947 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A microelectronic package may include a stacked microelectronic unit including at least first and second vertically stacked microelectronic elements each having a front face facing a top surface of the package. The front face of the first element may be adjacent the top surface, and the first element may overlie the front face of the second element such that at least a portion of the front face of the second element having an element contact thereon extends beyond an edge of the first element. A conductive structure may electrically connect a first terminal at the top surface to an element contact at the front face of the second element, and include a continuous monolithic metal feature extending along the top surface and through at least a portion of an encapsulant, which is between the top surface and the front face of the second element, towards the element contact.

摘要翻译： 微电子封装可以包括堆叠的微电子单元，其包括至少第一和第二垂直堆叠的微电子元件，每个微电子元件具有面向封装的顶表面的正面。 第一元件的前表面可以与顶表面相邻，并且第一元件可以覆盖在第二元件的前表面上，使得具有元件接触的第二元件的前表面的至少一部分延伸超过边缘 的第一个元素。 导电结构可以将顶表面处的第一端子与第二元件的前表面处的元件接触电连接，并且包括沿着顶表面延伸并通过至少一部分密封剂的连续整体金属特征， 在第二元件的顶表面和前表面之间，朝向元件接触。

公开(公告)号：US20130203216A1

公开(公告)日：2013-08-08

申请号：US13792521

申请日：2013-03-11

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L21/48

CPC分类号： H01L21/4885 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

公开(公告)号：US10062661B2

公开(公告)日：2018-08-28

申请号：US15628851

申请日：2017-06-21

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L27/146 ,  H01L25/04 ,  H01L21/56 ,  H01L23/538

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00

摘要： Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

公开(公告)号：US09716075B2

公开(公告)日：2017-07-25

申请号：US14851925

申请日：2015-09-11

申请人： Tessera, Inc.

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： B23K31/02 ,  H01L23/00 ,  B23K1/00 ,  H05K1/11 ,  H05K3/40 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H05K3/34 ,  H01L23/31

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

公开(公告)号：US20160005711A1

公开(公告)日：2016-01-07

申请号：US14851925

申请日：2015-09-11

申请人： Tessera, Inc.

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H01L23/00 ,  H01L21/48 ,  H05K3/34 ,  H01L21/56

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。

公开(公告)号：US09224717B2

公开(公告)日：2015-12-29

申请号：US14564640

申请日：2014-12-09

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L25/04 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L27/146 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

公开(公告)号：US10833044B2

公开(公告)日：2020-11-10

申请号：US16778899

申请日：2020-01-31

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L25/04 ,  H01L27/146 ,  H01L21/56 ,  H01L23/538

摘要： Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

公开(公告)号：US09691731B2

公开(公告)日：2017-06-27

申请号：US14979053

申请日：2015-12-22

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L25/04 ,  H01L27/146 ,  H01L21/56 ,  H01L23/538

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

公开(公告)号：US20160211237A1

公开(公告)日：2016-07-21

申请号：US14979053

申请日：2015-12-22

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/00

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

公开(公告)号：US09093435B2

公开(公告)日：2015-07-28

申请号：US13792521

申请日：2013-03-11

申请人： Tessera, Inc.

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/13 ,  H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4885 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

摘要翻译： 制造微电子封装的方法包括在具有第一表面和远离其的第二表面的衬底的工艺单元上形成电介质封装层。 微电子元件安装到基板的第一表面，并且多个导电元件暴露在第一表面处，其中至少一些电连接到微电子元件。 导线键具有连接到远离基座的导电元件和端表面的基部，并且限定在基部和端面之间延伸的边缘表面。 封装层形成为至少部分地覆盖第一表面，并且引线接合的部分与引线接合的未封装部分由端盖表面或边缘表面的未被覆盖的部分中的至少一个限定。