公开(公告)号：US06684007B2

公开(公告)日：2004-01-27

申请号：US09853449

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： H01L24/82 ,  G02B6/06 ,  G02B6/10 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide. The method for making an optical apparatus also comprises inserting at least a portion of an optical device within the aperture so that the optical device is positioned to receive light from the first end of the waveguide.

摘要翻译： 一种光学装置，包括具有嵌入式波导的光学基板和适于接收从波导的端部传输的光的光学装置。 光学装置包括用于将光学装置耦合到基板的耦合结构。 耦合结构具有带孔的薄金属层。 光学装置的至少一部分设置在孔中。 一种制造光学装置的方法，包括：形成具有嵌入其中的波导的光学基板; 在所述波导的一端上沉积金属层; 以及在所述金属层上沉积聚合物层。 通过去除金属层的一部分和设置在波导端部上的聚合物层的一部分，在金属层和聚合物层中形成孔。 制造光学装置的方法还包括将光学装置的至少一部分插入孔内，使得光学装置被定位成接收来自波导的第一端的光。

公开(公告)号：US06785447B2

公开(公告)日：2004-08-31

申请号：US09767582

申请日：2001-01-22

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： G02B6/10 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveguide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. Methods of producing the optoreflective structure are disclosed.

摘要翻译： 一种用于反射遵循由光波导限定的路径的光信号的光反射结构，包括具有第一平面包层表面的第一包层; 布置在所述第一包层上的波导; 以及设置在波导上并具有第二平面包层表面的第二包覆层。 第一包层，第二包层和波导终止于具有斜面平坦表面的大致鸽尾结构中。 光反射器设置在倾斜平面上，用于通过波导的光信号的改变方向。 公开了制造光反射结构的方法。

公开(公告)号：US06669801B2

公开(公告)日：2003-12-30

申请号：US09853353

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

发明人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

IPC分类号： B32B3100

CPC分类号： H01L24/73 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

摘要： A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.

公开(公告)号：US06690845B1

公开(公告)日：2004-02-10

申请号：US09574422

申请日：2000-05-19

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

IPC分类号： G02B612

CPC分类号： H01L24/96 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： Three-dimensional opto-electronic modules having a plurality of opto-electronic (O/E) layers, with optical signals being routed between O/E layers within one or more three-dimensional volumes, are disclosed. In preferred embodiments, the O/E layers are disposed over and above one another with at least one of their edges aligned to one another. At least two of the O/E layers have waveguides with ends near the aligned edges. A plurality of Zconnector arrays are disposed between the O/E layers and within the three-dimensional volumes to provide a plurality of Zdirection waveguides. A first vertical optical coupler couples light from one waveguide in one O/E layer to a Z-direction waveguide, and a second vertical optical coupler couples the light from the Z-direction waveguide to a second waveguide in a second O/E layer. In further preferred embodiments, segments of the Z-connector arrays are held by a holding unit.

摘要翻译： 公开了具有多个光电子（O / E）层的三维光电模块，光信号在一个或多个三维体积内的O / E层之间布线。 在优选实施例中，O / E层设置在彼此之上并且彼此之间，其边缘中的至少一个彼此对准。 至少两个O / E层具有端部靠近对准边缘的波导。 多个Z连接器阵列设置在O / E层之间并且在三维体积内以提供多个Z方向波导。 第一垂直光耦合器将来自一个O / E层中的一个波导的光耦合到Z向波导，并且第二垂直光耦合器将来自Z方向波导的光耦合到第二O / E层中的第二波导。 在另外的优选实施例中，Z连接器阵列的段由保持单元保持。

公开(公告)号：US06343171B1

公开(公告)日：2002-01-29

申请号：US09295813

申请日：1999-04-20

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

IPC分类号： G02B626

CPC分类号： H01L24/96 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/73 ,  H01L24/82 ,  H01L25/167 ,  H01L31/0203 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： Opto-electrical systems having electrical and optical interconnections formed in thin layers with thin-film active devices are disclosed. In one embodiment, optical connections are made between the edge of one substrate and the surface of another substrate with the use of photorefractive materials. In another embodiment, the optical connection is made by separating a optical film from the first substrate and coupling the first substrate and the optical film to separate receptacles located on the second substrate. Film optical link modules employing aspects of the invention are also disclosed.

摘要翻译： 公开了具有用薄膜有源器件形成在薄层中的电和光互连的光电系统。 在一个实施例中，使用光折射材料在一个基板的边缘和另一个基板的表面之间形成光学连接。 在另一个实施例中，通过将光学膜与第一基板分离并将第一基板和光学膜耦合到位于第二基板上的分离的接收器来进行光学连接。 还公开了采用本发明方面的薄膜光链路模块。

公开(公告)号：US06611635B1

公开(公告)日：2003-08-26

申请号：US09295628

申请日：1999-04-20

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

IPC分类号： G02B612

CPC分类号： H01L24/96 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/43 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/82 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated with optical waveguides in ultra thin polymer layers on the order of 1 &mgr;m to 250 &mgr;m in thickness.

摘要翻译： 公开了将薄的光电子层的器件和/或材料集成到一起，这增加了用于芯片安装的空间，并且通过消除光电子器件和光波导之间的光学对准的难度来降低总系统成本。 光电子器件与厚度为1〜250μm的超薄聚合物层的光波导集成。

公开(公告)号：US06845184B1

公开(公告)日：2005-01-18

申请号：US09295431

申请日：1999-04-20

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Masaaki Inao ,  Michael G. Lee ,  William Chou ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  James J. Roman ,  Thomas J. Massingill

IPC分类号： H01L31/12 ,  G02B6/12 ,  G02B6/122 ,  G02B6/132 ,  G02B6/42 ,  G02B6/43 ,  H01L21/60 ,  H01L21/68 ,  H01L23/48 ,  H01L23/538 ,  H01L25/16

CPC分类号： G02B6/43 ,  G02B6/12002 ,  G02B6/132 ,  G02B6/4214 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals are conveyed by stack optical waveguide coupling means. Yet other preferred embodiments have electrical via means formed in one or more layers to covey electrical signals between two or more layers.

摘要翻译： 公开了具有形成在薄层中的电和光互连的光电系统。 在一组优选实施例中，光信号通过设置在层上的相应的垂直光耦合器在层之间传送。 在其它优选实施例中，光信号由堆叠光波导耦合装置传送。 其他优选实施例具有形成在一个或多个层中的电通路装置，以在两层或更多层之间传送电信号。

公开(公告)号：US06706546B2

公开(公告)日：2004-03-16

申请号：US09757052

申请日：2001-01-08

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Kiyoshi Kuwabara ,  Solomon I. Beilin ,  Michael Peters ,  Wen-Chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Kiyoshi Kuwabara ,  Solomon I. Beilin ,  Michael Peters ,  Wen-Chou Vincent Wang ,  Masaaki Inao

IPC分类号： H01L2100

CPC分类号： G02B6/10 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.

摘要翻译： 一种构造电子电路组件的方法，包括在衬底上形成至少一个电极; 在衬底上并在电极上形成下层材料层; 以及在包层材料层上形成波导芯层。 波导层被图案化以产生至少一个光波导和暴露的底层材料。 构造方法还包括在暴露的下包层材料上并在光波导上形成一层外包材料; 通过所述外包层材料和所述下包层材料形成至少一个通孔; 并将导电材料设置在通孔中以产生电子电路组件。