公开(公告)号：US06684007B2

公开(公告)日：2004-01-27

申请号：US09853449

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： H01L24/82 ,  G02B6/06 ,  G02B6/10 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide. The method for making an optical apparatus also comprises inserting at least a portion of an optical device within the aperture so that the optical device is positioned to receive light from the first end of the waveguide.

摘要翻译： 一种光学装置，包括具有嵌入式波导的光学基板和适于接收从波导的端部传输的光的光学装置。 光学装置包括用于将光学装置耦合到基板的耦合结构。 耦合结构具有带孔的薄金属层。 光学装置的至少一部分设置在孔中。 一种制造光学装置的方法，包括：形成具有嵌入其中的波导的光学基板; 在所述波导的一端上沉积金属层; 以及在所述金属层上沉积聚合物层。 通过去除金属层的一部分和设置在波导端部上的聚合物层的一部分，在金属层和聚合物层中形成孔。 制造光学装置的方法还包括将光学装置的至少一部分插入孔内，使得光学装置被定位成接收来自波导的第一端的光。

公开(公告)号：US06785447B2

公开(公告)日：2004-08-31

申请号：US09767582

申请日：2001-01-22

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： G02B6/10 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveguide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. Methods of producing the optoreflective structure are disclosed.

摘要翻译： 一种用于反射遵循由光波导限定的路径的光信号的光反射结构，包括具有第一平面包层表面的第一包层; 布置在所述第一包层上的波导; 以及设置在波导上并具有第二平面包层表面的第二包覆层。 第一包层，第二包层和波导终止于具有斜面平坦表面的大致鸽尾结构中。 光反射器设置在倾斜平面上，用于通过波导的光信号的改变方向。 公开了制造光反射结构的方法。

公开(公告)号：US06669801B2

公开(公告)日：2003-12-30

申请号：US09853353

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

发明人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

IPC分类号： B32B3100

CPC分类号： H01L24/73 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

摘要： A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.

公开(公告)号：US06572780B2

公开(公告)日：2003-06-03

申请号：US09872629

申请日：2001-05-31

申请人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

IPC分类号： H01B1300

CPC分类号： B32B37/26 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K3/025 ,  H05K3/205 ,  Y10S438/957 ,  Y10S438/968 ,  Y10S438/976 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T156/1082 ,  Y10T156/1158

摘要： Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.

公开(公告)号：US06544430B2

公开(公告)日：2003-04-08

申请号：US09872795

申请日：2001-05-31

申请人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

IPC分类号： C03C2568

CPC分类号： B32B37/26 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K3/025 ,  H05K3/205 ,  Y10S438/957 ,  Y10S438/968 ,  Y10S438/976 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T156/1082 ,  Y10T156/1158

摘要： Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

公开(公告)号：US20080025009A1

公开(公告)日：2008-01-31

申请号：US11866186

申请日：2007-10-02

申请人： Sergey Savastiouk ,  Valentin Kosenko ,  James Roman

发明人： Sergey Savastiouk ,  Valentin Kosenko ,  James Roman

IPC分类号： H05K7/02

CPC分类号： H01L28/40 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/53238 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/3025

摘要： A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the electrode but insulated from the electrode. Capacitor dielectric (320) can be formed by anodizing tantalum while a nickel layer (314) protects an underlying copper (310) from the anodizing solution. This protection allows the tantalum layer to be made thin to obtain large capacitance. Chemical mechanical polishing of a layer (610) is made faster, and hence possibly less expensive, by first patterning the layer photolithographically to form, and/or increase in height, upward protrusions of this layer.

摘要翻译： 导电层（310,910）的一部分提供电容器电极（310.0,910.0）。 电介质沟槽（410,414,510）形成在导电层中，以将电容器电极与用于穿过电极但与电极绝缘的导电路径的导电层的那些部分绝缘。 可以通过阳极氧化钽形成电容器电介质（320），同时镍层（314）保护底层铜（310）与阳极氧化溶液。 该保护允许使钽层变薄以获得大的电容。 通过首先对该层进行光刻图案化以形成和/或增加该层的向上突起，使层（610）的化学机械抛光更快，因此可能更便宜。

公开(公告)号：US20070257367A1

公开(公告)日：2007-11-08

申请号：US11418801

申请日：2006-05-05

申请人： Sergey Savastiouk ,  Valentin Kosenko ,  James Roman

发明人： Sergey Savastiouk ,  Valentin Kosenko ,  James Roman

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/4763

CPC分类号： H01L28/40 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/53238 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/3025

摘要： A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the electrode but insulated from the electrode. Capacitor dielectric (320) can be formed by anodizing tantalum while a nickel layer (314) protects an underlying copper (310) from the anodizing solution. This protection allows the tantalum layer to be made thin to obtain large capacitance. Chemical mechanical polishing of a layer (610) is made faster, and hence possibly less expensive, by first patterning the layer photolithographically to form, and/or increase in height, upward protrusions of this layer.

摘要翻译： 导电层（310,910）的一部分提供电容器电极（310.0,910.0）。 电介质沟槽（410,414,510）形成在导电层中，以将电容器电极与用于穿过电极但与电极绝缘的导电路径的导电层的那些部分绝缘。 可以通过阳极氧化钽形成电容器电介质（320），同时镍层（314）保护底层铜（310）与阳极氧化溶液。 该保护允许使钽层变薄以获得大的电容。 通过首先对该层进行光刻图案化以形成和/或增加该层的向上突起，使层（610）的化学机械抛光更快，因此可能更便宜。

公开(公告)号：US06898343B2

公开(公告)日：2005-05-24

申请号：US09932526

申请日：2001-08-17

申请人： Alexei Glebov ,  Michael Peters ,  Michael Lee ,  James Roman ,  David Kudzuma

发明人： Alexei Glebov ,  Michael Peters ,  Michael Lee ,  James Roman ,  David Kudzuma

IPC分类号： G02B6/12 ,  G02B6/13 ,  G02F1/31 ,  G02F1/313 ,  G02B6/42

CPC分类号： G02F1/31

摘要： A hybrid integration process for fabrication of an optical cross-connect switching apparatus. The switching element is based on the deflection of light beam in electro-optic materials by applying electric field across electrodes of an appropriate configuration. The integration process includes fabrication of a substrate (e.g. silicon substrate) with 2D imaging optics from polymeric materials (or silica), fabrication of the light deflecting element, and assembly of the deflecting element on the substrate with imaging optics. The fabrication of the light deflecting element includes fabrication of a LN (lithium niobate) block. The LN block assembled in an optical switching apparatus includes a two-dimensional waveguide formed on a surface of the LN block and an electrode on a surface of the LN block.

摘要翻译： 一种用于制造光交叉连接开关装置的混合集成方法。 开关元件基于通过在适当配置的电极上施加电场而在光电材料中的光束的偏转。 整合过程包括使用来自聚合材料（或二氧化硅）的2D成像光学器件制造衬底（例如硅衬底），制造光偏转元件，以及使用成像光学器件将偏转元件组装在衬底上。 光偏转元件的制造包括制造LN（铌酸锂）块。 组装在光开关装置中的LN块包括形成在LN块表面上的二维波导和LN块表面上的电极。