公开(公告)号：US06684007B2

公开(公告)日：2004-01-27

申请号：US09853449

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： H01L24/82 ,  G02B6/06 ,  G02B6/10 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide. The method for making an optical apparatus also comprises inserting at least a portion of an optical device within the aperture so that the optical device is positioned to receive light from the first end of the waveguide.

摘要翻译： 一种光学装置，包括具有嵌入式波导的光学基板和适于接收从波导的端部传输的光的光学装置。 光学装置包括用于将光学装置耦合到基板的耦合结构。 耦合结构具有带孔的薄金属层。 光学装置的至少一部分设置在孔中。 一种制造光学装置的方法，包括：形成具有嵌入其中的波导的光学基板; 在所述波导的一端上沉积金属层; 以及在所述金属层上沉积聚合物层。 通过去除金属层的一部分和设置在波导端部上的聚合物层的一部分，在金属层和聚合物层中形成孔。 制造光学装置的方法还包括将光学装置的至少一部分插入孔内，使得光学装置被定位成接收来自波导的第一端的光。

公开(公告)号：US06669801B2

公开(公告)日：2003-12-30

申请号：US09853353

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

发明人： Tetsuzo Yoshimura ,  James Roman ,  Wen-chou Vincent Wang ,  Masaaki Inao ,  Mark Thomas McCormack

IPC分类号： B32B3100

CPC分类号： H01L24/73 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

摘要： A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.

公开(公告)号：US6054761A

公开(公告)日：2000-04-25

申请号：US203126

申请日：1998-12-01

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC分类号： C08K3/00 ,  C08L63/00 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L23/04

CPC分类号： H05K3/363 ,  H01L23/49883 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H01L2224/16503 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/4623

摘要： Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.

摘要翻译： 公开了印刷电路基板和包括导电组合物的电气组件。 印刷电路基板和电组件实施例包括第一导电区域和第二导电区域。 电介质层设置在第一和第二导电区域之间。 在电介质层中设置孔，并且包括导电组合物的通孔结构设置在孔中。 导电组合物优选处于固化状态并与第一和第二导电区域电连通。 在优选的实施方案中，导电组合物包含至少约75wt。 基于组合物的重量％。 至少50重量％的导电颗粒具有小于约400℃的熔点。该组合物还包括载体，其包含至少约50重量％的量的环氧官能树脂。 基于载体的重量，以及基于载体重量的至少约0.1重量％的助熔剂。 环氧官能树脂在25℃下的粘度可以小于约1000厘泊

公开(公告)号：US06281040B1

公开(公告)日：2001-08-28

申请号：US09397614

申请日：1999-09-16

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC分类号： H01L2144

CPC分类号： H05K3/363 ,  H01L23/49883 ,  H01L2224/16503 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455

摘要： Methods for making circuit substrates and electrical assemblies are disclosed. A conductive composition is disposed between confronting conductive regions and can be cured to form a via structure. The conductive composition includes conductive particles and a carrier. The carrier can include a fluxing agent and an epoxy-functional resin having a viscosity of less than about 1000 centipoise at 25° C.

摘要翻译： 公开了制造电路基板和电气组件的方法。 导电组合物设置在相对的导电区域之间，并且可以被固化以形成通孔结构。 导电组合物包括导电颗粒和载体。 载体可以包括助熔剂和在25℃下粘度小于约1000厘泊的环氧官能树脂。

公开(公告)号：US06579474B2

公开(公告)日：2003-06-17

申请号：US09782384

申请日：2001-02-12

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC分类号： H01B104

CPC分类号： H05K3/363 ,  H01L23/49883 ,  H01L2224/16503 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455

摘要： A conductive composition, and articles and methods using the conductive composition are disclosed.

摘要翻译： 公开了导电组合物，以及使用导电组合物的制品和方法。

公开(公告)号：US06544430B2

公开(公告)日：2003-04-08

申请号：US09872795

申请日：2001-05-31

申请人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

IPC分类号： C03C2568

CPC分类号： B32B37/26 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K3/025 ,  H05K3/205 ,  Y10S438/957 ,  Y10S438/968 ,  Y10S438/976 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T156/1082 ,  Y10T156/1158

摘要： Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

公开(公告)号：US06572780B2

公开(公告)日：2003-06-03

申请号：US09872629

申请日：2001-05-31

申请人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

IPC分类号： H01B1300

CPC分类号： B32B37/26 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K3/025 ,  H05K3/205 ,  Y10S438/957 ,  Y10S438/968 ,  Y10S438/976 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T156/1082 ,  Y10T156/1158

摘要： Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.

公开(公告)号：US06326555B1

公开(公告)日：2001-12-04

申请号：US09259126

申请日：1999-02-26

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Thomas J. Massingill ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Thomas J. Massingill ,  Solomon I. Beilin

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H05K3/3484 ,  H05K2201/09536 ,  H05K2203/0191 ,  H05K2203/043 ,  H05K2203/0568 ,  Y10T29/49128

摘要： Structures, methods and materials for making multilayer circuit substrates are disclosed. The structures include bumped structures or microencapsulated conductive particles suitable for use in a lamination process to make a multilayer printed circuit substrate.

摘要翻译： 公开了用于制造多层电路基板的结构，方法和材料。 这些结构包括适于用于层压工艺以制造多层印刷电路基板的凸起结构或微胶囊化导电颗粒。

公开(公告)号：US06866741B2

公开(公告)日：2005-03-15

申请号：US09757364

申请日：2001-01-08

申请人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

发明人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

IPC分类号： H01L21/60 ,  B32B7/12 ,  H01L21/58 ,  H01L21/68 ,  H05K3/34 ,  H05K3/46 ,  H01L21/46

CPC分类号： H01L21/6835 ,  B32B7/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K3/3489 ,  H05K3/4614 ,  H05K2203/0759 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00012

摘要： A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

摘要翻译： 一种用于连接大面积半导体衬底，液体热固性聚合物的方法。 通过从半导体衬底的边缘向内分配液体聚合物，可以将诸如晶片或电路板（例如刚性或柔性）的两个大面积衬底接合在一起。 然后可以将基板压在一起，使得液体热固性材料沿着朝向半导体基板边缘的向外方向流动。 在压制液态热固性聚合物之后，第一和第二基底上的导电表面可以彼此接触。 然后可以将所形成的结构中的液态热固性聚合物固化至硬化状态。 液体热固性聚合物优选具有低粘度，低水平的离子污染物，对基材的良好粘附性，低吸湿性和良好的热膨胀性能。

公开(公告)号：US06882045B2

公开(公告)日：2005-04-19

申请号：US09997589

申请日：2001-11-29

申请人： Thomas J. Massingill ,  Mark Thomas McCormack ,  Wen-Chou Vincent Wang

发明人： Thomas J. Massingill ,  Mark Thomas McCormack ,  Wen-Chou Vincent Wang

IPC分类号： H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/16501 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1383 ,  H01L2924/01049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for deplating defective capacitors comprising forming a plurality of capacitors on a semiconductor substrate, forming a plurality of metal contacts on the plurality of capacitors, and depositing a layer of photoresist on the semiconductor substrate. The photoresist layer is patterned so that the plurality of metal contacts are exposed, which are then contacted with an electrically conductive solution. The metal contacts, which are disposed over defective capacitors, are subsequently deplated. A method for forming a multi-chip module comprising forming a thin-film polymeric interconnect structure having a pair of sides, one of which is disposed on a silicon substrate having active or passive devices and the other of which has a computer chip mounted thereon. A multi-chip module formed by the method.

摘要翻译： 一种用于去除有缺陷的电容器的方法，包括在半导体衬底上形成多个电容器，在多个电容器上形成多个金属触点，并在半导体衬底上沉积一层光致抗蚀剂。 图案化光致抗蚀剂层，使得多个金属触点暴露，然后与导电溶液接触。 随后将金属触点设置在不良电容器上，随后被去掉。 一种用于形成多芯片模块的方法，包括形成具有一对侧面的薄膜聚合物互连结构，其中一个侧面设置在具有有源或无源器件的硅衬底上，并且另一个具有安装在其上的计算机芯片。 通过该方法形成的多芯片模块。