公开(公告)号：US5519176A

公开(公告)日：1996-05-21

申请号：US223240

申请日：1994-04-05

申请人： Thomas W. Goodman ,  Hiroyuki Fujita ,  Yoshikazu Murakami ,  Arthur T. Murphy ,  Daniel I. Amey

发明人： Thomas W. Goodman ,  Hiroyuki Fujita ,  Yoshikazu Murakami ,  Arthur T. Murphy ,  Daniel I. Amey

IPC分类号： H01L23/12 ,  H01L23/498 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

CPC分类号： H01L24/49 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/0253 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0213 ,  H05K1/0224 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/09227 ,  H05K2201/09681 ,  H05K3/4629

摘要： A substrate or a ceramic package for packaging semiconductor chips, which comprises an insulating layer having a signal line on one surface of said insulating layer and a power line or ground line corresponding to said signal line on the other surface of said insulating layer. A well-controlled constant high frequency characteristics, and particularly, characteristic impedance, can be obtained on the signal line without being influenced by the power line or ground line.

摘要翻译： 一种用于封装半导体芯片的衬底或陶瓷封装，其包括在所述绝缘层的一个表面上具有信号线的绝缘层和对应于所述绝缘层的另一个表面上的所述信号线的电力线或接地线。 可以在信号线上获得良好控制的恒定高频特性，特别是特性阻抗，而不受电力线或接地线的影响。

公开(公告)号：US5477419A

公开(公告)日：1995-12-19

申请号：US226049

申请日：1994-04-11

申请人： Thomas W. Goodman ,  Hiroyuki Fujita ,  Yoshikazu Murakami ,  Arthur T. Murphy

发明人： Thomas W. Goodman ,  Hiroyuki Fujita ,  Yoshikazu Murakami ,  Arthur T. Murphy

IPC分类号： H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02

CPC分类号： H05K3/3484 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/044 ,  Y02P70/613 ,  Y10T29/49144

摘要： A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.

摘要翻译： 一种在其上形成有包括连接部分的电路的板上安装具有端子部分的电子部件的方法。 它包括在端子部分的表面上形成导电层的工艺; 在连接部分的表面上形成具有与形成在端子部分的表面上的导电层的熔点不同的熔点的导电层的工艺; 在使端子部的导电层与连接部的导体层接触的状态下熔融具有低熔点的导电层的工序，从而将具有低熔点的导电层熔合到导电层上 具有高熔点。 此外，该方法包括在端子部分周围的电子部件的表面上形成由耐热材料制成的突出部分的工艺，以及在连接部分或端子部分的至少一个表面上形成导电层的工艺; 以及将连接部与端子部电连接并使突出部与板的表面接触的工序。

公开(公告)号：US08141245B2

公开(公告)日：2012-03-27

申请号：US12344643

申请日：2008-12-29

申请人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

发明人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

IPC分类号： H01K3/10

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

摘要： A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

摘要翻译： 多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片的另一表面的绝缘底层和覆盖 导电片的边缘。 绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。 无地通孔或通孔可以延伸通过一个或多个电路板，用于连接其相对表面上的电导体。

公开(公告)号：US20090101274A1

公开(公告)日：2009-04-23

申请号：US12344643

申请日：2008-12-29

申请人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

发明人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

IPC分类号： B32B37/00

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

摘要： A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

摘要翻译： 多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片的另一表面的绝缘底层和覆盖 导电片的边缘。 绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。 无地通孔或通孔可以延伸通过一个或多个电路板，用于连接其相对表面上的电导体。

公开(公告)号：US07485812B2

公开(公告)日：2009-02-03

申请号：US10987480

申请日：2004-11-11

申请人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

发明人： Kevin C. Olson ,  Alan E. Wang ,  Peter Elenius ,  Thomas W. Goodman

IPC分类号： H05K1/03

CPC分类号： H05K3/002 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135

摘要： A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

摘要翻译： 多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片另一表面的绝缘底层和覆盖 导电片的边缘。 绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。 无地通孔或通孔可以延伸通过一个或多个电路板，用于连接其相对表面上的电导体。

公开(公告)号：US20080302564A1

公开(公告)日：2008-12-11

申请号：US11760887

申请日：2007-06-11

申请人： Kevin C. Olson ,  Thomas W. Goodman ,  Peter Elenius

发明人： Kevin C. Olson ,  Thomas W. Goodman ,  Peter Elenius

IPC分类号： H05K1/05 ,  H05K3/10

CPC分类号： H01L23/142 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13091 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/0382 ,  H05K2203/135 ,  Y10T29/49155 ,  H01L2924/00

摘要： A substrate for an electronic device package includes an electrically conductive core shaped to define a cavity for receiving an electronic device, a first insulating layer positioned on a first side of the core, and a first contact positioned adjacent to a surface within the cavity. Method of fabricating the substrates is also provided.

摘要翻译： 用于电子器件封装的衬底包括形成为限定用于接收电子器件的空腔的导电芯，位于芯的第一侧上的第一绝缘层和邻近腔内的表面定位的第一接触。 还提供了制造基板的方法。