公开(公告)号：US08153909B2

公开(公告)日：2012-04-10

申请号：US12403535

申请日：2009-03-13

申请人： Hiroshi Katagiri ,  Toshiya Asano

发明人： Hiroshi Katagiri ,  Toshiya Asano

IPC分类号： H01K3/10

CPC分类号： H05K3/0035 ,  H05K1/0366 ,  H05K3/0055 ,  H05K3/025 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2203/0152 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductor layers is formed in the via holes respectively. A tip of the glass cloth contained in each of the resin insulating layers is protruded from an internal wall surface of the via hole and cuts into a sidewall of the filled via conductor.

摘要翻译： 无芯线路板没有芯板，而是层叠结构，其中导体层和树脂绝缘层交替层压成多层。 树脂绝缘层中的每一个被形成为在环氧树脂中含有玻璃布。 多个通孔形成为穿透每个树脂绝缘层，并且分别在通孔中形成用于电连接导体层的填充通孔导体。 包含在每个树脂绝缘层中的玻璃布的尖端从通孔的内壁表面突出并切入填充的通孔导体的侧壁。

公开(公告)号：US07977580B2

公开(公告)日：2011-07-12

申请号：US12473609

申请日：2009-05-28

申请人： Seigo Ueno ,  Toshiya Asano

发明人： Seigo Ueno ,  Toshiya Asano

IPC分类号： H05K1/16

CPC分类号： H05K3/0052 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/016 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/05599

摘要： An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

摘要翻译： 中间多层布线板产品包括：多个树脂绝缘层，第一导体层和第二导体层的叠层。 堆叠包括：产品形成区域，包括沿着堆叠的主表面布置的多个产品部分，多个产品部分中的每一个成为多层布线板的产品; 以及围绕产品形成区域的框架部分。 第一导体层形成在多个产品部分的每一个内的多个树脂绝缘层中的至少一个上。 第二导体层形成在框架部分内的多个树脂绝缘层中的至少一个上。 框架部分具有在其厚度方向上穿透框架部分的多个切口，多个切口以基本相等的间隔布置。

公开(公告)号：US20090294156A1

公开(公告)日：2009-12-03

申请号：US12473609

申请日：2009-05-28

申请人： Seigo UENO ,  Toshiya Asano

发明人： Seigo UENO ,  Toshiya Asano

IPC分类号： H05K1/03 ,  H05K3/00

CPC分类号： H05K3/0052 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/016 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/05599

摘要： An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

摘要翻译： 中间多层布线板产品包括：多个树脂绝缘层，第一导体层和第二导体层的叠层。 堆叠包括：产品形成区域，包括沿着堆叠的主表面布置的多个产品部分，多个产品部分中的每一个成为多层布线板的产品; 以及围绕产品形成区域的框架部分。 第一导体层形成在多个产品部分的每一个内的多个树脂绝缘层中的至少一个上。 第二导体层形成在框架部分内的多个树脂绝缘层中的至少一个上。 框架部分具有在其厚度方向上穿透框架部分的多个切口，多个切口以基本相等的间隔布置。

公开(公告)号：US08110754B2

公开(公告)日：2012-02-07

申请号：US12412748

申请日：2009-03-27

申请人： Toshiya Asano

发明人： Toshiya Asano

IPC分类号： H05K1/11

CPC分类号： H05K3/0064 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K3/025 ,  H05K3/303 ,  H05K3/4644 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2224/05599

摘要： A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; terminal pins bonded to a corresponding one of the second terminals, wherein each of the terminal pins is formed in a nailhead shape that includes a shaft portion and a head portion, and a diameter of the head portion is larger than that of the shaft portion; and a reinforcing plate which has pin insertion openings formed at positions corresponding to the terminal pins and which is fixed to the rear surface, wherein the diameter of the pin insertion openings is smaller than the diameter of the head portion and is larger than the diameter of the shaft portion.

摘要翻译： 没有芯基板的多层布线板包括：多层层叠结构; 第一端子，设置在多层层叠结构体的表面上; 设置在所述多层层叠结构的后表面上的第二端子; 端子销接合到相应的一个第二端子，其中每个端子销形成为包括轴部分和头部部分的钉头形状，并且头部部分的直径大于轴部分的直径; 以及加强板，其具有形成在与端子销对应的位置处并且固定到后表面的销插入口，其中销插入口的直径小于头部直径，并且大于直径 轴部分。

公开(公告)号：US07193493B2

公开(公告)日：2007-03-20

申请号：US10670241

申请日：2003-09-26

申请人： Toshiya Asano ,  Yugo Shibata

发明人： Toshiya Asano ,  Yugo Shibata

IPC分类号： H01F7/08

CPC分类号： G03F7/70716 ,  G03F7/70725 ,  G03F7/70758 ,  Y10T74/20207 ,  Y10T74/20354

摘要： An alignment apparatus moves an X-Y slider together with X and Y beams. Electromagnetic guides (electromagnetic mechanisms) are interposed between the X-Y slider, the X beam, and the Y beam. The electromagnetic guides include alignment and acceleration electromagnets attached to the X-Y slider, and targets attached to the X and Y beams. The alignment electromagnet is feedback-controlled, whereas the acceleration electromagnet is feedforward-controlled.

摘要翻译： 对准装置与X和Y光束一起移动X-Y滑块。 电磁导轨（电磁机构）插在X-Y滑块，X光束和Y光束之间。 电磁导轨包括连接到X-Y滑块的对准和加速电磁铁，以及附着到X和Y光束的目标。 对准电磁铁是反馈控制的，而加速电磁铁是前馈控制的。

公开(公告)号：US20060082225A1

公开(公告)日：2006-04-20

申请号：US11290498

申请日：2005-12-01

申请人： Nobushige Korenaga ,  Toshiya Asano

发明人： Nobushige Korenaga ,  Toshiya Asano

IPC分类号： H02K41/00

CPC分类号： H01J37/20 ,  G03F7/70758 ,  H01J2237/20221 ,  H01J2237/20278 ,  H01J2237/3175 ,  H02K1/276 ,  H02K41/031

摘要： A linear motor includes a coil and a plurality of magnets disposed along a central axis of the coil. The magnetization directions of the plurality of magnets have different tilts with respect to the central axis.

摘要翻译： 线性电动机包括线圈和沿着线圈的中心轴布置的多个磁体。 多个磁体的磁化方向相对于中心轴具有不同的倾斜。

公开(公告)号：US5331204A

公开(公告)日：1994-07-19

申请号：US962419

申请日：1992-10-19

申请人： Masao Kuroda ,  Ryuji Imai ,  Toshiya Asano

发明人： Masao Kuroda ,  Ryuji Imai ,  Toshiya Asano

IPC分类号： H01L23/12 ,  H01L23/14 ,  H01L23/50 ,  H01L23/538 ,  H01L23/64 ,  H05K3/46 ,  H01L23/48 ,  H01L23/02 ,  H01L29/46 ,  H01L39/02

CPC分类号： H01L23/538 ,  H01L23/50 ,  H01L23/64 ,  H01L2924/0002 ,  H01L2924/3011

摘要： An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.

摘要翻译： 本发明的目的是使信号布线的整个线路的每一部分的阻抗与安装在封装上的集成电路相匹配。 所有接地层在垂直于设置在聚酰亚胺多层部件的顶表面或底面的连接焊盘的下方或上方的区域内被删除，由此在连接焊盘和接地层之间不产生电容，使得 防止连接垫正下方/下方的区域内的信号线被降低。

公开(公告)号：US08362364B2

公开(公告)日：2013-01-29

申请号：US12705776

申请日：2010-02-15

申请人： Toshiya Asano ,  Shinnosuke Maeda

发明人： Toshiya Asano ,  Shinnosuke Maeda

IPC分类号： H05K1/16

CPC分类号： H05K1/0271 ,  H01L21/563 ,  H01L23/16 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/562 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K3/0058 ,  H05K2201/2009 ,  H05K2201/2018 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.

摘要翻译： 布线基板组件包括矩形板状布线板，其具有多个树脂绝缘层和交替层叠在一起以限定相对的第一和第二主表面的导电层，以及布置在第一主表面上用于与端子表面接触的多个连接端子 所述芯片和矩形框状加固件固定到所述布线板的所述第一主表面，所述连接端子通过所述加强件的开口暴露。 加强构件具有由从加强构件的内周面延伸到外周面的狭缝分隔开的多个结构件。

公开(公告)号：US08233289B2

公开(公告)日：2012-07-31

申请号：US12706255

申请日：2010-02-16

申请人： Shinnosuke Maeda ,  Toshiya Asano ,  Takuya Hando

发明人： Shinnosuke Maeda ,  Toshiya Asano ,  Takuya Hando

IPC分类号： H05K1/11

CPC分类号： H05K3/243 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/30107 ,  H05K1/0269 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4682 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/1184 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multilayer wiring substrate of the present invention has a laminated structure composed of conductor layers and resin insulating layers stacked alternately. A plurality of surface connection terminals to which terminals of a chip component are to be surface-connected are formed on a main face of the laminated structure. A plurality of via conductors connected to the plurality of surface connection terminals are formed in the resin insulating layers. Each of the plurality of surface connection terminals has a structure in which a copper layer, a nickel layer, and a gold layer are stacked in this sequence. The gold layer is larger in diameter than at least the copper layer. The gold layer has an overhanging portion which extends radially outward from a circumference of the copper layer.

摘要翻译： 本发明的多层布线基板具有由交替堆叠的导体层和树脂绝缘层构成的层叠结构。 在层压结构的主面上形成有多个芯片部件的端子要被表面连接的表面连接端子。 连接到多个表面连接端子的多个通孔导体形成在树脂绝缘层中。 多个表面连接端子中的每一个具有这样的结构，其中铜层，镍层和金层以该顺序堆叠。 金层的直径比至少铜层大。 金层具有从铜层的圆周向外延伸的突出部分。

公开(公告)号：US08035035B2

公开(公告)日：2011-10-11

申请号：US12412693

申请日：2009-03-27

申请人： Toshiya Asano

发明人： Toshiya Asano

IPC分类号： H05K1/03

CPC分类号： H05K3/303 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/10318 ,  H05K2201/10424 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/05599

摘要： A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.

摘要翻译： 没有芯基板的多层布线板包括：多层层叠结构; 设置在所述多层层叠结构的前表面上的第一端子; 设置在所述多层层叠结构的后表面上的第二端子; 覆盖后表面的阻焊剂，并且在与第二端子对应的位置上形成阻焊剂开口; 加强板，其由非金属材料制成，并且在对应于第二端子的位置处形成有加强板开口; 以及插入在阻焊剂和加强板之间的粘合剂层，以将加强板固定到阻焊剂上，并且包括形成在对应于第二端子的位置处的粘合剂层开口。 阻焊剂开口的直径和加强板开口的直径小于粘合剂层开口的直径。