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公开(公告)号：US09048761B1
公开(公告)日：2015-06-02
申请号：US13553638
申请日：2012-07-19
CPC分类号： H02N2/18 , F23Q3/002 , H01L41/0477 , H01L41/0478 , H01L41/113 , H01L41/193
摘要： An energy harvesting device using auxetic materials includes a first auxetic conductive electrode layer. A second auxetic conductive electrode layer is associated with the first auxetic conductive electrode layer. The auxetic conductive electrode layers have negative Poisson ratios. At least one dielectric elastomer layer is associated in layered orientation between the first and second auxetic conductive electrode layers.
摘要翻译： 使用使用材料的能量收集装置包括第一辅助导电电极层。 第二辅助导电电极层与第一辅助导电电极层相关联。 使用导电电极层具有负的泊松比。 至少一个介电弹性体层在第一和第二辅助导电电极层之间以分层取向相关联。
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公开(公告)号：US09030079B1
公开(公告)日：2015-05-12
申请号：US13553744
申请日：2012-07-19
IPC分类号： H01L41/113 , H02N2/18 , F23Q3/00
CPC分类号： H02N2/18 , F23Q3/002 , H01L41/0477 , H01L41/0478 , H01L41/113 , H01L41/193
摘要： An energy harvesting device using auxetic materials includes a first auxetic conductive electrode layer. A second auxetic conductive electrode layer is associated with the first auxetic conductive electrode layer. The auxetic conductive electrode layers have negative Poisson ratios. At least one dielectric elastomer layer is associated in layered orientation between the first and second auxetic conductive electrode layers.
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3.发明授权Apparatus and method for a hybrid system for harvesting magnetic and electrical energy 有权用于收集磁能和电能的混合系统的装置和方法公开(公告)号：US08692396B1
公开(公告)日：2014-04-08
申请号：US13495278
申请日：2012-06-13
CPC分类号： H02K35/02 , A43B3/0015
摘要： A hybrid system for harvesting magnetic and electrical energy includes a substrate, at least one permanent magnet, and at least one coil of wire equal in number to the permanent magnet. Each permanent magnet is configured to fit in the substrate. Each coil of wire is configured to fit circumferentially around a respective permanent magnet. Each coil of wire is configured to fit in the substrate.
摘要翻译： 用于收集磁能和电能的混合系统包括基板，至少一个永磁体和至少一个与永磁体数量相等的线圈。 每个永磁体被配置成装配在基板中。 线圈的每个线圈构造成围绕相应的永磁体周向配合。 每个线圈线被配置成装配在基板中。
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4.发明授权公开(公告)号：US09356240B1
公开(公告)日：2016-05-31
申请号：US13667115
申请日：2012-11-02
申请人： William W. Lai , Alfred J. Baca
发明人： William W. Lai , Alfred J. Baca
CPC分类号： H01L51/0044 , H01G4/008 , H01G4/33 , H01G11/02 , H01G11/28 , H01G11/48 , H01L51/0002 , H01L51/0035 , H01L51/0048 , H01L51/0096 , H01L51/0508 , H01L51/055 , H01L51/0558 , H01L51/441 , Y02E10/549 , Y02E60/13
摘要： A method for making electronic devices based on derivatized ladder polymer (Pz-BBL) including photovoltaic modules and simple thin film transistors in planar and mechanically flexible and stretchable constructs.
摘要翻译： 一种基于衍生化梯形聚合物（Pz-BBL）制造电子器件的方法，包括光伏模块和平面和机械柔性和可拉伸结构中的简单薄膜晶体管。
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5.发明授权Release strategies for making transferable semiconductor structures, devices and device components 有权制定可转移半导体结构，器件和器件组件的策略公开(公告)号：US07932123B2
公开(公告)日：2011-04-26
申请号：US11858788
申请日：2007-09-20
申请人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
发明人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。
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6.发明授权Release strategies for making transferable semiconductor structures, devices and device components 有权制定可转移半导体结构，器件和器件组件的策略公开(公告)号：US08895406B2
公开(公告)日：2014-11-25
申请号：US13071027
申请日：2011-03-24
申请人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
发明人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
IPC分类号： H01L21/30 , H01L21/302 , H01L21/469 , B82Y10/00 , B82Y20/00 , H01L29/15 , H01L31/0687 , H01L31/0725 , B81C1/00 , H01L29/20 , H01L21/78 , H01L31/072 , H01L31/068 , H01L33/00
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。
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公开(公告)号：US07972875B2
公开(公告)日：2011-07-05
申请号：US11981380
申请日：2007-10-31
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-II Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-II Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
摘要翻译： 提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。
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公开(公告)号：US08722458B2
公开(公告)日：2014-05-13
申请号：US13100774
申请日：2011-05-04
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung Cho Ko , Mark Stoykovich , Jongseung Yoon
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
摘要翻译： 提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。
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9.发明申请公开(公告)号：US20110171813A1
公开(公告)日：2011-07-14
申请号：US13071027
申请日：2011-03-24
申请人： John A. ROGERS , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
发明人： John A. ROGERS , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
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公开(公告)号：US20100283069A1
公开(公告)日：2010-11-11
申请号：US11981380
申请日：2007-10-31
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
IPC分类号： H01L33/58 , H01L33/00 , H01L31/18 , H01L31/0232
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchability. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates.
摘要翻译： 本发明提供至少部分地通过基于印刷的装配和装置部件的集成制造的光学装置和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和拉伸性。 然而，本发明的光学系统除了在柔性，可塑性和/或可拉伸的基底上提供的装置和装置阵列外，还包括设置在常规刚性或半刚性基底上的装置和装置阵列。
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