Abstract:
It is possible to provide electronic parts for assembling a module by superimposing a plurality of layers with identical configuration. Each terminal of each terminal groups (31 to 36) is formed to be rotationally symmetric with a predetermined number of settings or symmetric with respect to the plane containing the rotational symmetry and the symmetric axis line. Each of the terminals (A0 to A7, RFCG) of common connection terminal groups (32, 36)has a connection portion formed on the surface section of both sides of the superimposing direction. Among the terminals of individual connection terminal groups (31, 33), a particular terminal CS;KEY has a connection portion formed at least on one of the sides of the superimposing direction of the surface section while the remaining associated terminal NC;DMY has a connection portion formed on the surface section of both sides of the superimposing direction. Such an electronic part (20) can be shifted by the angle obtained by dividing 360 degrees by the predetermined number of settings or added and reversed so as to be superimposed, thereby preferably assembling a module.
Abstract:
A compiler is supplied with a pseudo C description (1) which can describe parallel operation at the statement level by a clock boundary and a register assignment statement with a cycle accuracy, identifies the register assignment statement (S2), generates an executable C description (3), extracts a state machine in which the number of states has been reduced, and judges whether any loop executed by 0 cycle is present (S5). If none, the compiler generates a circuit description (4) capable of synthesizing a logic. Thus, a pseudo C description having C description in which a clock boundary is explicitly inserted is input. Since the pseudo C description capable of parallel description at the statement level by the register assignment statement is input, it is possible to express the pipeline operation accompanied by stall operation.
Abstract:
A method and system for providing a magnetic memory is described. The magnetic memory includes magnetic storage cells in an array, bit lines, and source lines. Each magnetic storage cell includes at least one magnetic element. The magnetic element(s) are programmable by write currents driven through the magnetic element(s). Each magnetic element has free and pinned layer(s) and a dominant spacer. The magnetic memory is configured such that either the read current(s) flow from the free layer(s) to the dominant spacer if the maximum low resistance state read current divided by the minimum low resistance state write current is greater than the maximum high resistance state read current divided by the minimum high resistance state write current or the read current(s) flow from the dominant spacer to the free layer(s) if the maximum low resistance state read current divided by the minimum low resistance state write current is less than the maximum high resistance state read current divided by the minimum high resistance state write current.
Abstract:
A squib driver module comprises a squib circuit for deploying a squib, e.g., in an airbag assembly, the squib circuit including a high side driver and a low side driver in combination for driving a firing signal to the squib: a circuit for activating the firing signal in response to a firing condition; squib diagnostic circuits for conducting diagnostic tests without activating the firing signal and without delivering a diagnostic signal equivalent of the firing signal to the squib, and for generating digital fault information based on the tests; registers for storing the fault information; logic for recognizing a fault condition based on the fault information; and a communication module for communicating the fault condition to a microprocessor unit. The squib diagnostic circuit may include node voltage diagnostic circuits, USD and/or LSD open/short circuits, USD and/or LSD driver fault diagnostic circuits, squib-squib short diagnostic circuits, and/or squib resistance diagnostic circuits.
Abstract:
A NAND-type flash memory includes a memory array (2) having a plurality of nonvolatile memory transistor (QM) and a control circuit (8). The nonvolatile memory transistor has a tunnel insulation film (15), an insulating charge accumulation film (16), and a memory gate (18) on a substrate region (11) and stores information by a difference in a threshold value viewed from the memory gate. The threshold value voltage is a negative voltage. The memory array has a plurality of series circuits (STRG) consisting of a plurality of nonvolatile memory transistors connected in series and word lines (WL0 to WLn) connected to respective row of the memory gates of the nonvolatile memory transistors constituting the series circuit. When information stored in the nonvolatile memory transistor is read out, the control circuit makes the word line connected to the nonvolatile memory transistor of read selection at a potential identical to the substrate region and makes the word line connected to the nonvolatile memory transistor of read non-selection at a potential identical to the source potential.
Abstract:
A method of producing ultra shallow junctions (104) for PMOS transistors, which eliminates the need for pre-amorphization implants, is disclosed. The method utilizes octadecaborane, B 18 H 22 . In accordance with the present invention, the pre-amorphizing step may be eliminated, greatly reducing cost per processed wafer. An appropriate process sequence has been suggested to take advantage of cluster ion implantation for PMOS manufacturing. In addition, the novel use of tilted implants for the source/drain extension and for pocket implants has been described.
Abstract translation:公开了一种产生用于PMOS晶体管的超浅结(104)的方法,其消除了对非晶化前注入的需要。 该方法利用十八硼烷B 18 SUB 22 22。 根据本发明,可以消除预非晶化步骤,大大降低每个加工晶片的成本。 已经提出了适当的工艺顺序以利用用于PMOS制造的簇离子注入。 另外,已经描述了倾斜植入物用于源极/漏极延伸部分和口袋植入物的新颖用途。
Abstract:
A semiconductor integrated circuit device for stable transmission through an antenna, a noncontact type IC card using the semiconductor integrated circuit device, and a portable information terminal. The semiconductor integrated circuit device is provided with antenna terminals LA and LB, a power supply circuit (B5) and an internal circuit (B8). The antenna terminals LA and LB are connected to an antenna (L1). The power supply circuit (B5) is provided with a rectifier/smoothing circuit (B1), which rectifies and smoothes an alternating signal given to an antenna terminal from the antenna to obtain a direct voltage, a shunt regulator (B6), which stabilizes the direct voltage, and a series regulator (B7). The internal circuit (B8) operates by being supplied with a direct current voltage from the power supply circuit. At the time of transmission to a reader/writer, the series regulator operates and the shunt regulator stops, and other than the time of transmission to the reader/writer, the shunt regulator operates and the series regulator stops.
Abstract:
A method and system for providing and utilizing a magnetic memory are described. The magnetic memory includes a plurality of magnetic storage cells. Each magnetic storage cell includes magnetic element(s) programmable due to spin transfer when a write current is passed through the magnetic element(s) and selection device(s). The method and system include driving a first current in proximity to but not through the magnetic element(s) of a portion of the magnetic storage cells. The first current generates a magnetic field. The method and system also include driving a second current through the magnetic element(s) of the portion of the magnetic storage cells. The first and second currents are preferably both driven through bit line(s) coupled with the magnetic element(s). The first and second currents are turned on at a start time. The second current and the magnetic field are sufficient to program the magnetic element(s).
Abstract:
A power semiconductor device having a semiconductor element die-mount-connected onto a lead frame in a leadless manner. Die-mount-connection between a semiconductor element (1) and a lead frame (2) that have large thermal expansion coefficient difference between them, wherein the connection is made by an intermetallic compound layer (200) having a melting point of at least 260æC or by a leadless solder having a melting point of 260æC through 400æC, and thermal stress caused by a temperature cycle is buffered by a metal layer (100) having a melting point of at least 260æC. The leadless die-mount-connection can be made without being melted at reflowing and without causing chip-crack under a thermal stress.
Abstract:
A method and system for providing and using a magnetic storage cell and magnetic memory is described. The method and system include providing a magnetic element and providing a selection device. The magnetic element is programmable to a first state by a first write current driven through the magnetic element in a first direction and to a second state by a second write current driven through the magnetic element in a second direction. The selection device is connected with the magnetic element. The selection device includes a gate having an aperture therein. The selection device is configured such that the first write current and second write current are provided to the magnetic element across the aperture.