公开(公告)号：WO2018085030A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/056756

申请日：2017-10-16

Applicant: GENERAL ELECTRIC COMPANY

Inventor： TUOMINEN, Risto, Ilkka ,  GOWDA, Arun, Virupaksha

IPC: H01L23/538 ,  H01L21/48 ,  H01L25/16

Abstract: An electronics package includes an insulating substrate, an electrical component coupled to a first surface of the insulating substrate, and a stepped conductor layer formed on a second surface of the insulating substrate, opposite the first surface. The stepped conductor layer includes a first portion that extends into at least one via formed through the insulating substrate to electrically couple with at least one contact pad of the electrical component and a second portion spaced away from the at least one via, the second portion having a thickness greater than the first portion.

Abstract translation: 电子组件包括绝缘基板，耦合到绝缘基板的第一表面的电气部件以及形成在绝缘基板的与第一表面相对的第二表面上的阶梯式导体层。 阶梯式导体层包括第一部分和第二部分，所述第一部分延伸到穿过绝缘基板形成的至少一个通孔中以与电部件的至少一个接触焊盘电耦合，所述第二部分与所述至少一个通孔间隔开， 厚度大于第一部分。

公开(公告)号：WO2005096320A2

公开(公告)日：2005-10-13

申请号：PCT/US2005/010600

申请日：2005-03-29

Applicant: GENERAL ELECTRIC COMPANY ,  ZHONG, Hong ,  GOWDA, Arun, Virupaksha ,  ESLER, David, Richard ,  PAISNER, Sara, Naomi

Inventor： ZHONG, Hong ,  GOWDA, Arun, Virupaksha ,  ESLER, David, Richard ,  PAISNER, Sara, Naomi

IPC: H01B3/00

CPC classification number: H01L23/3737 ,  B82Y30/00 ,  H01L23/42 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29486 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12044 ,  H01L2924/157 ,  H01L2924/3011 ,  H01L2924/01031 ,  H01L2224/29105 ,  H01L2924/05432 ,  H01L2924/00014 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05342 ,  H01L2924/05341 ,  H01L2924/0536 ,  H01L2924/05442 ,  H01L2924/00

Abstract: A composition comprising at least one liquid metal having a melting point less than 35°C; at least one electrically insulating solid filler comprising thermally conducting materials; at least one resin is provided. The composition is both thermally conducting and electrically insulating and has utility in the preparation of electronic devices comprising heat generating and heat dissipating structures. In one instance a composition is provided which comprises a liquid metal selected from the group consisting of gallium, gallium alloys, and mixtures thereof, a boron nitride particulate filler, and a silicone resin, wherein said liquid metal and particulate filler are present in a volume ratio of about 1:0.4 to about 1: 10. A method of making and using such a composition is also provided.

Abstract translation: 一种组合物，其包含至少一种熔点低于35℃的液态金属; 至少一种电绝缘固体填料，包括导热材料; 提供至少一种树脂。 该组合物是导热和电绝缘的，并且在制备包括发热和散热结构的电子器件中具有实用价值。 在一种情况下，提供了一种组合物，其包含选自镓，镓合金及其混合物的液态金属，氮化硼颗粒填料和硅树脂，其中所述液态金属和颗粒填料存在于体积 比例为约1:0.4至约1:10。还提供了制备和使用这种组合物的方法。

公开(公告)号：WO2019032211A1

公开(公告)日：2019-02-14

申请号：PCT/US2018/039464

申请日：2018-06-26

Applicant: GENERAL ELECTRIC COMPANY

Inventor： KAPUSTA, Christopher, James ,  NAGARKAR, Kaustubh, Ravindra ,  GOWDA, Arun, Virupaksha ,  ROSE, James, Wilson

IPC: H01L23/485 ,  H01L23/498 ,  H01L23/528 ,  H01L23/14

Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.

公开(公告)号：WO2018084980A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/054695

申请日：2017-10-02

Applicant: GENERAL ELECTRIC COMPANY

Inventor： TUOMINEN, Risto, Ilkka ,  GOWDA, Arun, Virupaksha

IPC: H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01L25/00

CPC classification number: H01L24/24 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24145 ,  H01L2224/24147 ,  H01L2224/24996 ,  H01L2224/25171 ,  H01L2224/25174 ,  H01L2224/2541 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/15311 ,  H01L2924/15313

Abstract: An electronics package includes an insulating substrate, a first electrical component coupled to a bottom surface of the insulating substrate, and a first conductor layer formed adjacent the bottom surface of the insulating substrate. The electronics package also includes a second conductor layer formed on a top surface of the insulating substrate and extending through a plurality of vias in the insulating substrate to electrically couple with the first electrical component and the first conductor layer. A second electrical component is electrically coupled to the first conductor layer and the first electrical component and the second electrical component are positioned in a stacked arrangement.

Abstract translation: 电子组件包括绝缘基板，耦合到绝缘基板的底表面的第一电部件以及邻近绝缘基板的底表面形成的第一导体层。 所述电子封装还包括第二导体层，所述第二导体层形成在所述绝缘基板的顶表面上并且延伸穿过所述绝缘基板中的多个通孔以与所述第一电气部件和所述第一导体层电耦合。 第二电气元件电耦合至第一导体层，并且第一电气元件和第二电气元件以堆叠布置方式定位。

公开(公告)号：WO2018084957A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/053150

申请日：2017-09-25

Applicant: GENERAL ELECTRIC COMPANY

Inventor： TUOMINEN, Risto, Ilkka ,  GOWDA, Arun, Virupaksha

IPC: H01L23/538 ,  H01L25/16

Abstract: An electronics package includes an insulating substrate, a first electrical component coupled to a top surface of the insulating substrate, and a second electrical component coupled to a bottom surface of the insulating substrate. A first conductor layer is formed on the bottom surface of the insulating substrate and extends through a via formed therethrough to contact a contact pad of the first electrical component, with a portion of the first conductor layer positioned between the insulating substrate and the second electrical component. A second conductor layer is formed on the top surface of the insulating substrate and extends through another via formed therethrough to electrically couple with the first conductor layer and to contact a contact pad of the second electrical component.

Abstract translation: 电子组件包括绝缘基板，耦合到绝缘基板的顶表面的第一电气部件以及耦合到绝缘基板的底部表面的第二电气部件。 第一导体层形成在绝缘基板的底表面上并延伸穿过形成于其中的通孔以接触第一电气部件的接触垫，第一导体层的一部分位于绝缘基板和第二电气部件之间 。 第二导体层形成在绝缘衬底的顶表面上并延伸穿过形成于其中的另一个通孔以与第一导体层电耦合并接触第二电部件的接触焊盘。

公开(公告)号：WO2018111485A1

公开(公告)日：2018-06-21

申请号：PCT/US2017/061851

申请日：2017-11-15

Applicant: GENERAL ELECTRIC COMPANY

Inventor： GOWDA, Arun, Virupaksha ,  FILLION, Raymond, Albert ,  MCCONNELEE, Paul, Alan

IPC: H01L23/485 ,  H01L23/00 ,  H01L25/07 ,  H01L25/065

CPC classification number: H01L23/5228 ,  H01L21/486 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2924/10272 ,  H01L2924/10323 ,  H01L2924/10325 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An electronics package includes an insulating substrate, a semiconductor device having a top surface coupled to a first side of the insulating substrate, and a pass-through structure coupled to the first side of the insulating substrate. The pass-through structure includes an insulating core, a resistor disposed proximate a top surface of the insulating core, and at least one through- hole structure forming at least one conductive pathway through a thickness of the insulating core, A patterned metallization layer is formed on a second side of the insulating substrate. The patterned metallization layer is electrically coupled to at least one first conductive pad of the semiconductor device and electrically couples at least one second conductive pad of the semiconductor device to a through-hole structure of the at least one through-hole structure through the resistor.

公开(公告)号：WO2018085020A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/056362

申请日：2017-10-12

Applicant: GENERAL ELECTRIC COMPANY

Inventor： TUOMINEN, Risto, Ilkka ,  GOWDA, Arun, Virupaksha

IPC: H01L21/60 ,  H01L23/538 ,  H01L25/16 ,  H01L25/18 ,  H01L21/98 ,  H01L23/31

CPC classification number: H01L25/50 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5387 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/08235 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/8309 ,  H01L2224/83091 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83865 ,  H01L2224/83874 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1302 ,  H01L2924/13023 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronics package includes an insulating substrate (106), a first electrical component (104) coupled to a first surface of the insulating substrate, and a first conductor layer (108) formed on the first surface of the insulating substrate. A second conductor layer (128) is formed on a second surface of the insulating substrate, opposite the first surface, the second conductor layer extending through vias (124,126) in the insulating substrate to contact at least one contact pad (122) of the first electrical component and couple with the first conductor layer. The electronics package also includes a second electrical component (102) having at least one contact pad (142) coupled to the first conductor layer. The first conductor layer has a thickness greater than a thickness of the second conductor layer.

Abstract translation: 一种电子器件封装包括绝缘基板（106），耦合到绝缘基板的第一表面的第一电气部件（104）和形成在绝缘基板的第一表面上的第一导体层（108） 绝缘基板。 第二导体层（128）形成在绝缘基板的与第一表面相对的第二表面上，第二导体层延伸穿过绝缘基板中的通孔（124,126）以接触第一导体层的至少一个接触垫（122） 电部件并与第一导体层耦合。 该电子封装还包括具有耦合到第一导体层的至少一个接触焊盘（142）的第二电气部件（102）。 第一导体层的厚度大于第二导体层的厚度。

公开(公告)号：WO2018084955A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/053119

申请日：2017-09-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： GOWDA, Arun, Virupaksha ,  TUOMINEN, Risto, Ilkka

IPC: H01L23/538

Abstract: An electronics package includes an insulating substrate and an electrical component coupled to a first surface of the insulating substrate. A first conductor is formed on a second surface of the insulating substrate and extends through a first via therein to electrically couple with a first contact pad of the electrical component. A second conductor is formed on the second surface of the insulating substrate and extends through a second via therein to electrically couple with a second contact pad of the electrical component. The second conductor has a thickness greater than a thickness of the first conductor layer.

Abstract translation: 电子封装包括绝缘衬底和耦合到绝缘衬底的第一表面的电部件。 第一导体形成在绝缘衬底的第二表面上并且延伸穿过其中的第一通孔以与电部件的第一接触焊盘电耦合。 第二导体形成在绝缘基板的第二表面上并延伸穿过其中的第二通孔以与电部件的第二接触垫电耦合。 第二导体的厚度大于第一导体层的厚度。

公开(公告)号：WO2006132822A3

公开(公告)日：2006-12-14

申请号：PCT/US2006/020445

申请日：2006-05-25

Applicant: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION) ,  GOWDA, Arun, Virupaksha ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  ESLER, David, Richard ,  LATHAM, Stephen, Andrew ,  CAMPBELL, John, Robert

Inventor： GOWDA, Arun, Virupaksha ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  ESLER, David, Richard ,  LATHAM, Stephen, Andrew ,  CAMPBELL, John, Robert

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/373 ,  H01L21/48

Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.

公开(公告)号：WO2006023860A3

公开(公告)日：2006-03-02

申请号：PCT/US2005/029808

申请日：2005-08-22

Applicant: GENERAL ELECTRIC COMPANY ,  ZHONG, Hong ,  PAISNER, Sara, Naomi ,  GOWDA, Arun, Virupaksha ,  ESLER, David, Richard ,  TONAPI, Sandeep, Shrikant ,  DAVID, Jennifer ,  MENEGHETTI, Paulo ,  MANICCIA, Laurence ,  HANS, Paul, Joseph ,  FORTUNA, Robert ,  STROSAKER, Gregory, A. ,  SHAFFER, Gregory, W. ,  VICTOR, Hollister

Inventor： ZHONG, Hong ,  PAISNER, Sara, Naomi ,  GOWDA, Arun, Virupaksha ,  ESLER, David, Richard ,  TONAPI, Sandeep, Shrikant ,  DAVID, Jennifer ,  MENEGHETTI, Paulo ,  MANICCIA, Laurence ,  HANS, Paul, Joseph ,  FORTUNA, Robert ,  STROSAKER, Gregory, A. ,  SHAFFER, Gregory, W. ,  VICTOR, Hollister

IPC: C09K5/14 ,  C09K5/06 ,  C08K3/38 ,  H01L23/373

Abstract: Thermally conductive compositions containing spherical boron nitride filler particles having an average aspect ration of less than 2.0 in a polymer matrix.