公开(公告)号：EP2116114B1

公开(公告)日：2010-08-11

申请号：EP07827694.6

申请日：2007-09-17

Applicant: Cisel S.r.l. - Circuiti Stampati Per Applicazioni Elettroniche

Inventor： FIORETTI, Faustino

IPC: H05K1/11 ,  H05K1/00 ,  H05K3/34

CPC classification number: H05K1/112 ,  H05K1/0393 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2203/0455 ,  Y02P70/613

Abstract: The present patent application relates to a production process of printed circuits on which electronic components without leading wire situated on the opposite side with respect to the circuit printed side are soldered. In particular, the said process provides for drilling the support (10), rolling it with a layer of conductive material (20) on only one (10a) of the two sides (10a and 10b) and making the circuits on the said side (10a).

公开(公告)号：EP2214204A1

公开(公告)日：2010-08-04

申请号：EP08839374.9

申请日：2008-10-16

Applicant: Panasonic Corporation

Inventor： MATSUNO, Koso ,  YAMAGUCHI, Atsushi ,  SAKATANI, Shigeaki ,  MIYAKAWA, Hidenori ,  UEDA, Mikiya

IPC: H01L25/04 ,  H01L21/56 ,  H01L21/60 ,  H01L25/18

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0224 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/10977

Abstract: In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.

Abstract translation: 为了容易地注入底部填充树脂并且可靠地进行成型，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，并在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。

公开(公告)号：EP1983809A3

公开(公告)日：2010-07-21

申请号：EP08007057.6

申请日：2008-04-09

Applicant: YAZAKI CORPORATION

Inventor： Masaoki, Yoshida ,  Nakayama, Takuya ,  Ueyama, Koji

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

Abstract translation: 本发明提供一种能够可靠地防止由端子引起的导体图案的损伤的印刷布线板。 印刷线路板具有板，导电图案，通孔和非导电区域。 将安装在印刷线路板上的电阻引线插入到通孔4中。引线从电路板的表面突出，并弯曲靠近表面。 非导电区域形成为从通孔的中心向引线的末端扩大的扇形形状。 由于弯曲引线布置在非导电区域上，因此非导电区域可以防止由于引线接触导电图案而导致的导电图案的损坏。

公开(公告)号：EP2180595A1

公开(公告)日：2010-04-28

申请号：EP08832206.0

申请日：2008-09-09

Applicant: Nec Corporation

Inventor： ISHINO, Tooru

IPC: H03F3/24 ,  H03F1/30 ,  H03F3/193 ,  H03F3/60 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10969 ,  Y10T29/49117

Abstract: A high power amplifier that has a high heat dissipation effect and is produced at low cost, a wireless transmitter and a wireless transceiver with the high power amplifier and a method for mounting a high power amplifier are provided. The high power amplifier comprises a transistor with lead wires extending from both side surfaces of a mold provided on a heat dissipation member to the outside, a double-sided wiring board of which the heat dissipation member is inserted in an opening of the double-sided wiring board and a wiring pattern on one surface of the double-sided wiring board is electrically connected to the lead wires, and a case for accommodating the double-sided wiring board. Further, the high power amplifier comprises a plate of which one main surface is in contact with an inner wall of the case and the other main surface is connected to the heat dissipation member and a wiring pattern on the other main surface of the double-sided wiring board.

Abstract translation: 高功率放大器确实具有高的散热效果，并以低成本生产，提供一个无线发射机和与所述大功率放大器的无线收发器以及用于安装大功率放大器的方法。 大功率放大器包括与引线从设置在散热构件向外部上的模具的表面bothside延伸的晶体管，其中的双面电路板上的散热部件插入到双面的开口 配线板以及在双面接线板的一个表面上的布线图案电连接至所述引线，和用于容纳双面电路板的情况。 此外，高功率放大器包括板，其中一个主表面是在所述壳体和所述另一主表面的内壁与触点连接到散热构件和双面的另一个主表面上的布线图案 布线板。

公开(公告)号：EP1413178B1

公开(公告)日：2010-01-06

申请号：EP02750400.0

申请日：2002-08-02

Applicant: SanDisk Corporation

Inventor： WALLACE, Robert, F.

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0256 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07735 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/242 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer (112) extending to the edges of a circuit board for electrostatic discharge protection but also has gaps (112a) at the edge of the ground and/or power layer (112) to avoid short circuiting with conductive segments (160) of another layer deformed when the card is trimmed during manufacture.

公开(公告)号：EP2086295A2

公开(公告)日：2009-08-05

申请号：EP09250025.5

申请日：2009-01-07

Applicant: Nitto Denko Corporation

Inventor： Ishimaru, Yasuto ,  Ebe, Hirofumi

IPC: H05K1/02 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674

Abstract: A mounting region (S) is provided at an approximately center of one surface of an insulating layer (1). A conductive trace (2) is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer (4) is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal (21) of the conductive trace is arranged in the mounting region, and a bump (5a) of an electronic component (5) is bonded to the terminal. A metal layer (3) made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.

Abstract translation: 安装区域（S）设置在绝缘层（1）的一个表面的大致中心处。 导电迹线（2）形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层（4）以覆盖导电迹线。 导电迹线的端子（21）布置在安装区域中，并且电子部件（5）的凸块（5a）接合到端子。 例如，在绝缘层的另一个表面上设置由铜制成的金属层（3）。 在金属层中形成一对狭缝，使得与电子部件相对的区域夹在其间。 每个狭缝形成为不将金属层分成多个区域。

公开(公告)号：EP1827069B1

公开(公告)日：2009-04-22

申请号：EP07075315.7

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, ,  Tsukada, Kiyotaka, ,  Kobayashi, Hiroyuki, ,  Minoura, Hisashi, ,  Ukai, Yoshikazu, ,  Kondo, Mitsuhiro,

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

公开(公告)号：EP1651016A3

公开(公告)日：2007-11-28

申请号：EP05021273.7

申请日：2005-09-29

Applicant: NITTO DENKO CORPORATION

Inventor： Kanagawa, Hitoki, Nitto Denko Corporation ,  Ohsawa, Tetsuya, Nitto Denko Corporation ,  Ooyabu, Yasunari, Nitto Denko Corporation

IPC: H05K1/11

CPC classification number: H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, so as to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer (3) is formed on a supporting board (2), and a conductive pattern (4) is formed on the insulating base layer (3) so that a number of lines of wire (4a,4b,4c,4d) magnetic head connecting terminals (7), and external connecting terminals (8) are integrally formed and also first through holes (9) are formed in the external connecting terminals (8). Thereafter, after an insulating cover layer (10) is formed, third through holes (20) and second through holes (19) are formed in the supporting board (2) and in the insulating base layer (3), respectively, to communicate with the first through holes (9). This can provide the result that when the external connecting terminals (8) are connected to the external terminals (23), the connection can be performed while confirming the placement of the solder balls (21) by means of the respective through holes.

公开(公告)号：EP1827065A3

公开(公告)日：2007-10-10

申请号：EP07075318.1

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).

Abstract translation: 一种印刷线路板（3）的制造方法，该印刷线路板（3）包括用于安装电子部件的安装凹部（1），导体图案（7）和布置在安装凹部的底部的散热板（6） （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。

公开(公告)号：EP1827068A2

公开(公告)日：2007-08-29

申请号：EP07075317.3

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A printed wiring board (802) comprising an insulating substrate (806), a conductor pattern formed on a surface of the insulating substrate (806), a solder filling hole (801) passing through the insulating substrate (806) and arriving at an upper surface of the conductor pattern (851) and a solder (807) filled in the solder filling hole (801), characterized in that the insulating substrate (806) includes fibers (861) therein, and end portions (863) of the fibers (861) protrude from a wall face (810) of the solder filling hole (801) and encroach into the solder (807).

Abstract translation: 一种印刷电路板（802），包括绝缘基板（806），形成在所述绝缘基板（806）的表面上的导体图案，穿过所述绝缘基板（806）并到达所述绝缘基板 导体图案（851）的表面和填充在焊料填充孔（801）中的焊料（807），其特征在于，绝缘基板（806）包括纤维（861），纤维的端部（863） 861）从焊料填充孔（801）的壁面（810）突出并侵入焊料（807）。